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Köp båda 2 för 2457 kr1 Electrical Overstress in ICS.- 1.1 Definition of Electrostatic Discharge Phenomena.- 1.2 Impact of ESD on IC Chip Technologies.- 1.3 Protection Strategies for Reducing ESD Effects.- 1.4 ESD Models and Qualification.- 1.5 EOS Models and Qualification.- 1.6 Previous Work on ESD/EOS Device Failure Modeling.- 2 NMOS ESD Protection Devices and Process Related Issues.- 2.1 ESD Phenomena in nMOS Devices.- 2.2 Failure Modes in nMOS.- 2.3 Protection Technique Using nMOS Device Structures.- 2.4 The Impact of Process Technologies on nMOS ESD Behavior.- 2.5 Advance nMOS Device Protection Concepts.- 3 Measuring EOS Robustness in ICS.- 3.1 Statistical Distribution of EOS/ESD-related Failures.- 3.2 Characterization of Bipolar Devices.- 3.3 EOS Characterization of nMOS Devices.- 3.4 Summary.- 4 Eos Thermal Failure Simulation for Integrated Circuits.- 4.1 Nomenclature.- 4.2 ITSIM: A Nonlinear Thermal Failure Simulator for ICs.- 4.3 Simulation Results for Ceramic and Plastic Packages.- 4.4 Summary.- 5 ITSIM: A Nonlinear 2D - 1D Thermal Simulator.- 5.1 Introduction.- 5.2 Running the Program.- 5.3 Input File.- 5.4 An Example.- 6 2D Electrothermal Analysis of Device Failure in Mos Processes.- 6.1 Device Level Electrothermal Simulation.- 6.2 Comparison of Experimental and 2D Electrothermal Results.- 6.3 Summary.- 7 Circuit-Level Electrothermal Simulation.- 7.1 Temperature Effects and Device Models.- 7.2 Simulation of Avalanche Breakdown.- 7.3 Temperature Model for Electrothermal Simulation.- 7.4 iETSIM: An Electrothermal Circuit-Level Simulation Tool.- 7.5 Summary.- 8 IETSIM : An Electrothermal Circuit Simulator.- 8.1 Introduction.- 8.2 Running the Program.- 8.3 Input File: Circuit Description and Format.- 8.4 Low Temperature Thermometer Example.- 9 Summary and Future Research.- 9.1 Summary.- 9.2 Future Research.- About the Authors.