Sung-Mo Kang - Böcker

Electrothermal Analysis of VLSI Systems addresses electrothermal problems in modern VLSI systems. Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (includin...

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Electrothermal Analysis of VLSI Systems addresses electrothermal problems in modern VLSI systems. Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (includin...

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Moore's law [Noy77], which predicted that the number of devices in tegrated on a chip would be doubled every two years, was accurate for a number of years. Only recently has the level of integration be gun to slow down somewhat due to the phy...

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As the complexity and the density of VLSI chips increase with shrinking design rules, the evaluation of long-term reliability of MOS VLSI circuits is becoming an important problem. The assessment and improvement of reliability on the circuit level...

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Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as...

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Electrical overstress (EOS) and Electrostatic discharge (ESD) pose one of the most dominant threats to integrated circuits (ICs). These reliability concerns are becoming more serious with the downward scaling of device feature sizes. Modeling of E...

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Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as...

Läs mer »

Electrical overstress (EOS) and Electrostatic discharge (ESD) pose one of the most dominant threats to integrated circuits (ICs). These reliability concerns are becoming more serious with the downward scaling of device feature sizes. Modeling of E...

Läs mer »

Moore's law [Noy77], which predicted that the number of devices in tegrated on a chip would be doubled every two years, was accurate for a number of years. Only recently has the level of integration be gun to slow down somewhat due to the phy...

Läs mer »

As the complexity and the density of VLSI chips increase with shrinking design rules, the evaluation of long-term reliability of MOS VLSI circuits is becoming an important problem. The assessment and improvement of reliability on the circuit level...

Läs mer »

Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as...

Läs mer »

Electrical overstress (EOS) and Electrostatic discharge (ESD) pose one of the most dominant threats to integrated circuits (ICs). These reliability concerns are becoming more serious with the downward scaling of device feature sizes. Modeling of E...

Läs mer »

Moore's law [Noy77], which predicted that the number of devices in- tegrated on a chip would be doubled every two years, was accurate for a number of years. Only recently has the level of integration be- gun to slow down somewhat due to the physic...

Läs mer »

As the complexity and the density of VLSI chips increase with shrinking design rules, the evaluation of long-term reliability of MOS VLSI circuits is becoming an important problem. The assessment and improvement of reliability on the circuit level...

Läs mer »

Electrothermal Analysis of VLSI Systems addresses electrothermal problems in modern VLSI systems. Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (includin...

Läs mer »