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Modeling and Simulation for Microelectronic Packaging Assembly (e-bok)
Manufacturing, Reliability and Testing
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LED Packaging for Lighting Applications
Liu Sheng Liu, Luo Xiaobing Luo
Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, pr...
Freeform Optics for LED Packages and Applications
Wang Kai Wang, Liu Sheng Liu, Luo Xiaobing Luo, Wu Dan Wu
A practical introduction to state-of-the-art freeform optics design for LED packages and applications By affording designers the freedom to create complex, aspherical optical surfaces with minimal or no aberrations, freeform design transcends the ...