LED Packaging for Lighting Applications

"The book will be useful as a resource for engineers in LED design or packaging, and as an introduction to the field for advanced students, researchers, lighting designers, and product managers." (Book News, 1 October 2011)

Sheng Liu is a ChangJiang Professor of Mechanical Engineering at Huazhong University of Science and Technology. He holds a dual appointment at Wuhan National Laboratory for Optoelectronics, and has served as tenured faculty at Wayne State University. He has over 14 years experience in LED/MEMS/IC packaging and extensive experience in consulting with many leading multi-national and Chinese companies. Liu was awarded the White House/NSF Presidential Faculty Fellowship in 1995, ASME Young Engineer Award in 1996, and China NSFC Overseas Young Scientist in 1999. He has been an associate editor for IEEE Trans. On Electronic Packaging Manufacturing since 1999 and an associate editor of Journal of Frontiers of Optoelectronics in China since 2007. He is currently one of the 11 National Committee Members in LED under Ministry of Science and Technology. He obtained a Ph.D. from Stanford in 1992, and got MS and BS in flight vehicle design, Nanjing University of Aeronautics and Astronautics, and he had three years industrial experience in China and USA. He has filed more than 70 patents in China and the USA, and has published more than 300 technical articles. Xiaobing Luo is a professor at Huazhong University of Science and Technology, Wuhan, China, with appointments at the School of Energy and Power Engineering and Wuhan National Lab for Optoelectronics. He received his Ph.D. in 2002 from Tsinghua University, China. He has also worked in Samsung Electronics in Korea as a Senior Engineer. His main research interests are LED, heat and mass transfer, microfluidics, MEMS, and sensors and actuators. He has published more than 60 papers and has applied for 40 patents in the USA, Korea, Japan, Europe and China.

Foreword (Magnus George Craford). Foreword (C. P. Wong). Foreword (B. J. Lee). Preface. Acknowledgments. About the Authors. 1 Introduction. 1.1 Historical Evolution of Lighting Technology. 1.2 Development of LEDs. 1.3 Basic Physics of LEDs. 1.3.1 Materials. 1.3.2 Electrical and Optical Properties. 1.3.3 Mechanical and Thermal Properties. 1.4 Industrial Chain of LED. 1.4.1 LED Upstream Industry. 1.4.2 LED Midstream Industry. 1.4.3 LED Downstream Industry. 1.5 Summary. References. 2 Fundamentals and Development Trends of High Power LED Packaging. 2.1 Brief Introduction to Electronic Packaging. 2.1.1 About Electronic Packaging and Its Evolution. 2.1.2 Wafer Level Packaging, More than Moore, and SiP. 2.2 LED Chips. 2.2.1 Current Spreading Efficiency. 2.2.2 Internal Quantum Efficiency. 2.2.3 High Light Extraction Efficiency. 2.3 Types and Functions of LED Packaging. 2.3.1 Low Power LED Packaging. 2.3.2 High Power LED Packaging. 2.4 Key Factors and System Design of High Power LED Packaging. 2.5 Development Trends and Roadmap. 2.5.1 Technology Needs. 2.5.2 Packaging Types. 2.6 Summary. References. 3 Optical Design of High Power LED Packaging Module. 3.1 Properties of LED Light. 3.1.1 Light Frequency and Wavelength. 3.1.2 Spectral Distribution. 3.1.3 Flux of Light. 3.1.4 Lumen Efficiency. 3.1.5 Luminous Intensity, Illuminance and Luminance. 3.1.6 Color Temperature, Correlated Color Temperature and Color Rendering Index. 3.1.7 White Light LED. 3.2 Key Components and Packaging Processes for Optical Design. 3.2.1 Chip Types and Bonding Process. 3.2.2 Phosphor Materials and Phosphor Coating Processes. 3.2.3 Lens and Molding Process. 3.3 Light Extraction. 3.4 Optical Modeling and Simulation. 3.4.1 Chip Modeling. 3.4.2 Phosphor Modeling. 3.5 Phosphor for White LED Packaging. 3.5.1 Phosphor Location for White LED Packaging. 3.5.2 Phosphor Thickness and Concentration for White LED Packaging. 3.5.3 Phosphor for Spatial Color Distribution. 3.6 Collaborative Design. 3.6.1 Co-design of Surface Micro-Structures of LED Chips and Packages. 3.6.2 Application Specific LED Packages. 3.7 Summary. References. 4 Thermal Management of High Power LED Packaging Module. 4.1 Basic Concepts of Heat Transfer. 4.1.1 Conduction Heat Transfer. 4.1.2 Convection Heat Transfer. 4.1.3 Thermal Radiation. 4.1.4 Thermal Resistance. 4.2 Thermal Resistance Analysis of Typical LED Packaging. 4.3 Various LED Packages for Decreasing Thermal Resistance. 4.3.1 Development of LED Packaging. 4.3.2 Thermal Resistance Decrease for LED Packaging. 4.3.3 SiP/COB LED Chip Packaging Process. 4.4 Summary. References. 5 Reliability Engineering of High Power LED Packaging. 5.1 Concept of Design for Reliability (DfR) and Reliability Engineering. 5.1.1 Fundamentals of Reliability. 5.1.2 Life Distribution. 5.1.3 Accelerated Models. 5.1.4 Applied Mechanics. 5.2 High Power LED Packaging Reliability Test. 5.2.1 Traditional Testing Standards, Methods, and Evaluation. 5.2.2 Methods for Failure Mechanism Analysis. 5.2.3 Failure Mechanisms Analysis. 5.3 Rapid Reliability Evaluation. 5.3.1 Material Property Database. 5.3.2 Numerical Modeling and Simulation. 5.4 Summary. References. 6 Design of LED Packaging Applications. 6.1 Optical Design. 6.1.1 Introduction of Light Control. 6.1.2 Reflectors. 6.1.3 Lenses. 6.1.4 Diffuser. 6.1.5 Color Design and Control in LED Applications. 6.2 Thermal Management. 6.2.1 Analysis of System Thermal Resistance. 6.2.2 Types of Heat Dissipation to Environment. 6.2.3 Design and Optimization of Fin Heat Sink. 6.2.4 Design Examples of Thermal Management of Typical LED Lighting Systems. 6.3 Drive Circuit and Intelligent Control Design. 6.3.1 Typical LED Wireless Intelligent Control System. 6.3.2 Working Principles of Wireless Intelligent Control System. 6.4 Summary. Re