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Freeform Optics for LED Packages and Applications (e-bok)
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Modeling and Simulation for Microelectronic Packaging Assembly
Liu Sheng Liu, Liu Yong Liu
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "e;test and try out"e; method to obtain the best solu...
LED Packaging for Lighting Applications
Liu Sheng Liu, Luo Xiaobing Luo
Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, pr...