- Inbunden (Hardback)
- Antal sidor
- CRC Press Inc
- black and white 378 Illustrations 128 equations 74 Halftones, black and white 38 Tables black a
- 128 equations; 74 Halftones, black and white; 38 Tables, black and white; 378 Illustrations, black a
- 241 x 158 x 31 mm
- Antal komponenter
- Contains 73 Hardbacks
- 807 g
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Lapping and polishing are currently the most precise surface finishing processes for mechanical and electronic components. Unfortunately, most improvements in either methods or understanding of the physical processes involved are closely guarded as proprietary information. The Handbook of Lapping and Polishing is the first source in English to bring to the light of day the physical fundamentals and advanced technologies at the leading edge of modern lapping and polishing practice. Collecting decisive work contributed by industrial and academic experts from the USA, Germany, and Japan, this authoritative resource presents the latest lapping and polishing technologies along with case studies that illustrate their value. After a brief introduction, the book explains the fundamental concepts and major types of lapping and polishing processes. The discussion then turns to lapping of ductile and brittle materials followed by an in-depth look at lapping machines and equipment. Rounding out the presentation, the final chapters discuss polishing technologies and equipment as well as the latest on chemical-mechanical polishing (CMP) and its applications in the semiconductor industry. Offering an integrated approach to both theory and practical applications under a single cover, the Handbook of Lapping and Polishing supplies a definitive survey of the most advanced surface finishing technologies available.
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INTRODUCTION; Ioan Marinescu From Craft to Science Importance of the Abrasive Problem Solving References FUNDAMENTALS OF LAPPING; Eckart Uhlmann General Considerations Historical Development of Lapping Definition of Lapping and Classification of Lapping Processes Process Mechanisms and Subsurface Damage in Lapping Lapping Process as a Removal System Tool Specification Machine Settings Fundamentals of Planetary Kinematics Process Models and Simulation Symbols and Abbreviations References LAPPING OF DUCTILE MATERIALS; Ioan Marinescu, Ion Benea, and Naga Jyothi Sanku Introduction Physics of the Process Mechanism of the Process References Bibliography LAPPING OF BRITTLE MATERIALS; Ioan Marinescu, Ion Benea, and Mariana Pruteanu Introduction Background Information Nontraditional Lapping Processes ELID-Lap Grinding Materials, Experimental Setup, and Testing Procedure (Study Case) Experimental Results and Discussion References Bibliography Appendix A Appendix B LAPPING AND LAPPING MACHINES; Toshiro K. Doi and Daizo Ichikawa Introduction Processing Principles of Lapping and Its Characteristics Lapping Machine Both-Sides Simultaneous Lapping Machine Equipped with a New Micromotion Mechanism Conclusions POLISHING TECHNOLOGY; Toshiro K. Doi Polishing Principles Processing Accuracy and Damaged Layer Polishing Machines Mechanochemical Polishing and Chemical Mechanical Polishing Noncontact Polishing Magnetoabrasive Finishing Polishing Process Applying Electrophoretic Deposition Electroabrasive Mirror Polishing Process P-MAC Polishing Colloidal Silica Polishing References CHEMICAL MECHANICAL POLISHING AND ITS APPLICATIONS IN ULSI PROCESS; Toshiro K. Doi Orientations and Role of CMP in Semiconductor Process Basic Concept of Planarization CMP Basic Technology of Planarization CMP The Study Case of Device Wafer Thin Film Magnetic Recording Heads CMP of Compound Semiconductor Wafers References INDEX