Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module (inbunden)
Format
Inbunden (Hardback)
Språk
Engelska
Antal sidor
242
Utgivningsdatum
1993-04-01
Upplaga
illustrated ed
Förlag
Kluwer Academic Publishers
Originalspråk
Japanese
Illustrationer
XIV, 242 p.
Volymtitel
Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module Multichip Module
Dimensioner
234 x 156 x 16 mm
Vikt
540 g
Antal komponenter
1
Komponenter
1 Hardback
ISBN
9781851665792
Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module (inbunden)

Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module

Ceramic research and development in Japan

Inbunden Engelska, 1993-04-01
4299
Skickas inom 10-15 vardagar.
Gratis frakt inom Sverige över 159 kr för privatpersoner.
This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.
Visa hela texten

Passar bra ihop

  1. Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module
  2. +
  3. Second International Symposium on Polymer Electrolytes

De som köpt den här boken har ofta också köpt Second International Symposium on Polymer Elect... av B Scrosati (inbunden).

Köp båda 2 för 8598 kr

Kundrecensioner

Har du läst boken? Sätt ditt betyg »

Fler böcker av K Otsuka

Innehållsförteckning

Introduction. Introduction. Past and current studies. Modelling of fine powder mixing and measurement of the degree of mixing. Object of this study. Study of mixing models. Simulation of the flowpath in the doctor-blade and its application to raising the precision of green sheet thickness. Object of the study. Experimental procedure. Improving dimensional precision by firing in a reducing atmosphere. Purpose of the studies. Experimental methods. Effect of forming and firing conditions on the dimensions of ceramics. Object of the study. Experimental method. Improving the strength of tungsten metallization on alumina ceramics. Purpose of the studies. Experimental methods. Electrical insulation between fine metallization on alumina ceramics, and its protection. Purpose of the study. Experimental methods. Summary. Guidelines obtained by production process. Overall summary. References. Index.