• Fri frakt över 249 kr
  • •
  • Snabba leveranser
  • •
  • Billiga böcker
Kundservice

Du är på sajten för privatpersoner.

Företag, bibliotek eller offentlig verksamhet?

Du handlar på classic.bokus.com, där alla dina funktioner finns intakta.
Till classic.bokus.com
Bokus logotyp. Gå till startsidan.
  • Erbjudanden
  • Nyheter
  • Student
  • Topplistor
  • Barn & ungdom
  • Bokus Play
  • E-böcker
  • Pocketböcker
  • Spel & pussel

Upp till 20% på populära nyheter →

Sidfot

Mina sidor

    Hjälp

    • Kundservice
    • Vanliga frågor och svar
    • Frakt och leverans
    • Retur vid ångerrätt
    • Reklamera vara
    • Betalning
    • Köpvillkor
    • Allmänna villkor
    • Information om webbplatsens tillgänglighet

    Om Bokus

    • Om oss
    • Pressrum
    • För studenter
    • För företag
    • För bibliotek och offentlig verksamhet
    • För leverantörer
    • Hållbarhet

    Populärt

    • Aktuella erbjudanden
    • Presentkort
    • Studentlitteratur
    • Nya böcker
    • Topplistor
    • Signerade böcker
    • Engelska böcker

    Inspiration

    • Boktips
    • BookTok
    • Populära bokserier
    • Barnbokskaraktärer
    • Populära författare

    Mina sidor

      Hjälp

      • Kundservice
      • Vanliga frågor och svar
      • Frakt och leverans
      • Retur vid ångerrätt
      • Reklamera vara
      • Betalning
      • Köpvillkor
      • Allmänna villkor
      • Information om webbplatsens tillgänglighet

      Om Bokus

      • Om oss
      • Pressrum
      • För studenter
      • För företag
      • För bibliotek och offentlig verksamhet
      • För leverantörer
      • Hållbarhet

      Populärt

      • Aktuella erbjudanden
      • Presentkort
      • Studentlitteratur
      • Nya böcker
      • Topplistor
      • Signerade böcker
      • Engelska böcker

      Inspiration

      • Boktips
      • BookTok
      • Populära bokserier
      • Barnbokskaraktärer
      • Populära författare
      Logotyp för Bokus
      Följ oss på Facebook (extern länk)Följ oss på Instagram (extern länk)Följ oss på YouTube (extern länk)Följ oss på TikTok (extern länk)
      bokus @ CookiesIntegritetspolicyKöpvillkor
      Till Citymail hemsida (extern länk)Till Budbee hemsida (extern länk)Till Postnord hemsida (extern länk)Till Schenker hemsida (extern länk)Till Early Bird hemsida (extern länk)Till Walleys hemsida (extern länk)
      1. Naturvetenskap och teknik
      2. Teknik och industri
      3. Elektronik och kommunikationer

      Semiconductor Lithography

      Principles, Practices, and Materials

      AvWayne M. Moreau

      Häftad, Engelska, 2012

      Del i serien Microdevices

      1 659 kr

      Beställningsvara. Skickas inom 10-15 vardagar. Fri frakt över 249 kr.

      Fler format och utgåvor

      E-bok

      2 065 kr

      Beskrivning

      Semiconductor lithography is one of the key steps in the manufacturing of integrated silicon-based circuits. In fabricating a semiconductor device such as a transistor, a series of hot processes consisting of vacuum film deposition, oxidations, and dopant implantation are all patterned into microscopic circuits by the wet processes of lithography. Lithography, as adopted by the semiconductor industry, is the process of drawing or printing the pattern of an integrated circuit in a resist material. The pattern is formed and overlayed to a previous circuit layer as many as 30 times in the manufacture of logic and memory devices. With the resist pattern acting as a mask, a permanent device structure is formed by subtractive (removal) etching or by additive deposition of metals or insulators. Each process step in lithography uses inorganic or organic materials to physically transform semiconductors of silicon, insulators of oxides, nitrides, and organic polymers, and metals, into useful electronic devices. All forms of electromagnetic radiation are used in the processing. Lithography is a mUltidisciplinary science of materials, processes, and equipment, interacting to produce three-dimensional structures. Many aspects of chemistry, electrical engineering, materials science, and physics are involved. The purpose of this book is to bring together the work of many scientists and engineers over the last 10 years and focus upon the basic resist materials, the lithographic processes, and the fundamental principles behind each lithographic process.

      Produktinformation

      • Utgivningsdatum:2012-02-22
      • Mått:170 x 244 x 51 mm
      • Vikt:1 606 g
      • Format:Häftad
      • Språk:Engelska
      • Serie:Microdevices
      • Antal sidor:952
      • Förlag:Springer-Verlag New York Inc.
      • ISBN:9781461282280

      Utforska kategorier

      • Elektronik och kommunikationer inom Naturvetenskap och teknik

      Innehållsförteckning

      • 1. Introduction.- 1-1. Semiconductor Device Manufacturing.- 1-2. Lithography Processing and Materials.- 1-3. Lithography Costs and Process Equipment.- 1-4. Organization of the Book.- 2. Positive Photoresists.- 2-1. Introduction.- 2-2. Diazoquinone Photoresists.- 2-2-1. General Performance.- 2-2-2. General Photochemistry and Solubility Properties.- 2-2-3. Spectral Absorbance.- 2-2-4. Resins for DQ Resists.- 2-2-5. Chemical Mechanisms in DQN.- 2-3. Shelf Life and Quality Control of DQN.- 2-4. Summary and Outlook on DQN Resists.- 2-5. Deep-UV Exposure.- 2-5-1. Optical Systems.- 2-5-2. Resist Sensitometry.- 2-5-3. Deep-UV Resists.- 2-6. PMMA and PMIPK.- 2-6-1. PMMA.- 2-6-2. PMIPK.- 2-6-3. Summary.- 2-7. Nitroaldehyde Resists.- 2-8. Photocatalyzed Positive Resists.- 2-9. Miscellaneous Positive Deep-UV Resists.- 2-10. Outlook.- 3. Positive Radiation Resists.- 3-1. Introduction.- 3-1-1. Tool Contributions.- 3-1-2. Resist Considerations.- 3-1-3. High-Energy Radiation Absorption.- 3-1-4. Radiation Chemical Reactions.- 3-2. X-Ray Positive Resists.- 3-2-1. Basic Exposure Tool.- 3-2-2. X-Ray Positive Resists.- 3-3. Positive Ion-Beam Resists.- 3-4. Electron-Beam Positive Resists.- 3-4-1. Electron-Beam Tool and Process Considerations.- 3-4-2. One-Component Positive Radiation Resists.- 3-4-3. Pre-cross-linked PMMA Resist.- 3-4-3-1. Plasma Stability of PMMA.- 3-4-3-2. Processing.- 3-4-3-3. Outlook for PMMA.- 3-5. Polyolefin Sulfones and Other Electron-Beam Positive Resists.- 3-6. Practical Positive Resists.- 3-7. Outlook.- 4. Negative Photoresists.- 4-1. Introduction.- 4-1-1. Chemical Reactions.- 4-1-2. Exposure and Contrast.- 4-1-3. Photosensitizers.- 4-1-4. Commercial Resist Compositions.- 4-2. Polyvinylcinnamate.- 4-3. Azide-Sensitized Resists.- 4-3-1. Azide-Activated Formulations.-4-3-2. Photochemistry of Azides.- 4-3-3. Rubber and Phenolic Based Systems.- 4-3-4. Photospeed of Rubber Azide.- 4-3-5. Oxygen Effect in Azide Resists.- 4-4. Miscellaneous Radical-Based Photoresists.- 4-5. High-Temperature Negative Photoresists.- 4-6. Photopolymerization.- 4-7. Charge Transfer Resists.- 4-8. Inorganic Resists.- 4-9. Summary and Outlook.- 5. Negative Radiation Resists.- 5-1. Introduction.- 5-2. X-Ray Resists.- 5-3. Ion-Beam Resists.- 5-4. Electron-Beam Resists.- 5-4-1. Styrene-Based Resists.- 5-4-2. Epoxy-Based Resists.- 5-4-3. Allyl-Based Resists.- 5-4-4. Charge Transfer Resists.- 5-4-5. Silicone Negative Resists.- 5-4-6. Miscellaneous Resists.- 5-5. Two-Component Resists.- 5-6. Practical Use of Negative Electron-Beam Resists.- 5-7. Outlook.- 6. Surface Preparation and Coatin.- 6-1. Introduction.- 6-2. Cleaning the Wafer Surface.- 6-2-1. Contamination and General Consequences.- 6-2-2. Causes and Mechanisms of Surface Contamination.- 6-2-3. Removal of Contaminants.- 6-2-3-1. Clean Rooms.- 6-2-3-2. Liquid Contamination.- 6-2-3-3. Removal of Contaminants on the Wafer Surface.- 6-2-4. Detection of Contaminants on the Wafer Surface.- 6-3. Storage of Cleaned Wafers.- 6-4. Adhesion Promoters.- 6-5. Physical Chemistry of Spin Coating.- 6-5-1. Solvents for Spin Coating.- 6-5-2. Practical Aspects of Spin Coating.- 6-6. Other Resist Coating Techniques.- 6-6-1. Langmuir-Blodgett Films.- 6-6-2. Gas-Phase Deposition.- 6-7. Resist Film Thickness Measurements.- 6-8. Pinholes in Resist Films.- 6-8-1. Causes of Pinholes.- 6-8-2. Measurement of Pinholes in Resist Films.- 6-8-3. Reduction and Control of Pinholes in Resist Films.- 6-9. Summary and Outlook of Resist Coatings.- 7. Prebake (Softbake).- 7-1. Introduction.- 7-2. Kinetics of Prebaking.- 7-3. Physical Changes inPrebaking.- 7-3-1. Residual Stress Strain.- 7-3-2. Measurement of Residual Solvent in Prebaked Films.- 7-4. Prebaking Positive Resists.- 7-5. Prebake Equipment and Processes.- 7-6. Summary.- 8. Optical Exposure.- 8-1. Introduction.- 8-2. Optical Principles.- 8-3. Contact and Proximity Print.- 8-4. Projection Print.- 8-5. Overlay.- 8-6. Miscellaneous Exposure Techniques.- 8-7. Photomasks.- 8-8. Sensitometry.- 8-9. Outlook.- 9. Radiation Exposure.- 9-1. Introduction.- 9-2. Electron-Beam Performance.- 9-3. Electron-Beam Exposure Equipment.- 9-4. Electron-Beam-Resist Interaction.- 9-4-1. Charging of Resist.- 9-4-2. Resist Outgassing.- 9-5. Registration.- 9-6. Proximity Effects.- 9-7. Radiation Damage.- 9-8. X-Ray and Ion-Beam Exposure.- 9-8-1. X Rays.- 9-8-2. Ion Beams.- 9-9. Outlook.- 10. Developing Resist Images.- 10-1. Introduction.- 10-2. General Mechanisms.- 10-3. PMMA Developer Sensitivity.- 10-4. Enhancement of R and R0 of PMMA.- 10-5. Diazoquinone-Novolak Resists.- 10-5-1. Introduction.- 10-5-2. Modeling DQN Development.- 10-5-2-1. Photokinetics of Exposure.- 10-5-2-2. Kinetics of Dissolution.- 10-6. Development of Negative Resists.- 10-7. Dry Development.- 10-7-1. Direct Image Formation.- 10-7-2. Plasma-Developed Resists.- 10-7-2-1. Monomer Matrices for Plasma-Developable Resists.- 10-7-2-2. Polymer Matrices for Plasma Development.- 10-7-3. Plasma Etching without Development.- 10-7-4. Outlook for Dry Development.- 10-8. Practical Development of Resists.- 11. Postbake.- 11-1. Introduction.- 11-2. Physical Chemistry of Postbake.- 11-2-1. Adhesion.- 11-2-2. Melting.- 11-3. Chemical Reactions in Postbake.- 11-4. Other Methods of Hardening DQN.- 11-5. Practical Postbaking.- 11-6. Summary and Outlook.- 12. Additive Processes.- 12-1. Introduction.- 12-2. Single-Layer Resist for Resist Processes.- 12-3. DQN for Lift-off.- 12-4. Lift-off with PMMA Films.- 12-5. Single-Film Lift-off with Shallow-Profile Resists.- 12-6. Summary and Outlook of Single Films.- 12-7. Double-Layer Resist.- 12-7-1. Developer Transfer Bilayer Resist.- 12-7-2. Optical Dual-Layer Resist.- 12-7-3. Dual-Layer Plasma Etch Transfer.- 12-8. High-Temperature Lift-off.- 12-9. Summary and Outlook of Double-Layer Resists.- 12-10. Trilayer Resists.- 12-10-1. Planarizing Layers.- 12-10-2. Barrier Layers.- 12-10-3. Image Layer.- 12-11. Practical MLR Processing.- 12-12. Metal Deposition and Lift-off.- 12-12-1. Resist Profile and Lift-off.- 12-12-2. Resist Thickness and Lift-off.- 12-13. Lift-ofT Process Control.- 12-14. Miscellaneous Additive Processes.- 12-15. Electroplating with Resists.- 12-16. Ion Implantation Resist Masking.- 13. Subtractive Etching.- 13-1. Introduction.- 13-1-1. General Principles of the Rate of Etching.- 13-1-2. Phenomenological Mechanisms of Etching.- 13-2. Liquid Etching.- 13-2-1. SiO2 Liquid Etching.- 13-2-2. Wetting, Adhesion, and Undercutting.- 13-2-3. Surface Primers and Treatments.- 13-2-4. Stress in Resist Films.- 13-3. Passivity in Etching SiO2.- 13-4. Silicon Etching.- 13-5. Sandwich Etching.- 13-6. Aluminum Etching.- 13-6-1. Etchants for Aluminum.- 13-6-2. Electroetching.- 13-6-3. Summary.- 13-7. Practical Aspects of Wet Etching.- 13-8. Troubleshooting Etching.- 13-8-1. Spray versus Static Etching.- 13-8-2. Other Etching Considerations.- 13-9. Modeling of Wet Etching.- 13-10. Outlook of Wet Etching.- 13-11. Introduction to Gas Etching.- 13-12. Aluminum Etching.- 13-12-1. Introduction.- 13-12-2. Mechanism of A1 Etching.- 13-12-3. Selectivity of A1 Etching.- 13-12-4. Residue and Postetch Corrosion.- 13-12-5. Resist Hardening.- 13-12-6. PracticalA1 Etching.- 13-12-7. Summary.- 13-13. Silicon Etching.- 13-13-1. Introduction.- 13-13-2. Gas-Phase Etching.- 13-13-2-1. Thermal Gas-Phase Etching.- 13-13-2-2. Plasma Etching.- 13-13-2-3. Plasma Etch Rates of Radical Systems.- 13-13-2-4. Plasma Ion Etching.- 13-13-2-5. Role of Plasma-Deposited Polymers.- 13-13-2-6. Gas-Phase Recombination Model.- 13-13-2-7. Role of Electrode in Etching.- 13-13-2-8. Summary of Plasma Etching Mechanisms.- 13-13-3. Selectivity.- 13-13-4. Etch Profiles and Image Bias.- 13-13-4-1. Etch Profile Factors.- 13-13-4-2. Ion Transport Model.- 13-13-5. Uniformity of Plasma Etching.- 13-13-6. Plasma Etching Contamination.- 13-13-6-1. Sputtered Metals.- 13-13-6-2. Insulation Deposits.- 13-13-6-3. Etch Residues.- 13-13-6-4. Radiation Damage.- 13-13-7. Applications of Plasma Processing.- 13-13-8. Loading Effects.- 13-13-9. Etch Rate and Endpoint Monitor.- 13-14. Summary and Outlook of Etching.- 14. Stripping of Resists.- 14-1. Introduction.- 14-2. Liquid Stripping Formulations.- 14-2-1. Organic Solvent Strippers.- 14-2-1-1. Simple Solvent Strippers.- 14-2-1-2. Multiple Component Strippers.- 14-2-1-3. Surface Wetting Agents.- 14-2-2. Typical Liquid Strippers.- 14-3. Water-Based Strippers.- 14-3-1. Acidic Strippers.- 14-3-2. Alkaline Strippers.- 14-4. Practical Aspects of Stripping.- 14-5. Plasma Gas Stripping of Resists.- 14-5-1. Reactants of Plasma Stripping.- 14-5-2. Polymeric Reactants.- 14-5-3. Oxygen Plasma.- 14-5-4. Plasma Radiation Field.- 14-6. Kinetics of Stripping.- 14-6-1. Gas-Solid Interactions.- 14-6-2. Activation Energy of Stripping.- 14-6-3. Monitoring Plasma Stripping.- 14-6-4. Resist Stripping Rates and Polymer Structure.- 14-7. Side Effects of Plasma Stripping.- 14-7-1. Detection of Damage.- 14-7-2. Prevention and Control of Damage.- 14-8. Plasma Stripping Apparatus.- 14-9. Miscellaneous Stripping Techniques.- 14-10. Applications of Oxygen Plasma to Semiconductor Lithography.- 14-11. Outlook.- 15. Process Controls.- 15-1. General Process Considerations.- 15-2. Lithographic Process Automation.- 15-3. Resist Material Controls.- 15-4. Resist Processing Controls.- 15-4-1. Exposure Controls.- 15-4-2. Development Process Controls.- 15-4-3. Etching Process Controls.- 15-5. Process Troubleshooting.- 15-6. Summary.- 16. Nonresist Processe.- 16-1. Introduction.- 16-1-1. Elementary Considerations.- 16-1-2. Chemical and Thermal Energy Requirements.- 16-1-3. Laser Sources.- 16-2. Gas-Solid Photon-Induced Reactions.- 16-2-1. Deposition.- 16-2-2. Subtractive Etching and Removal.- 16-2-3. Summary of Gas-Solid Reactions.- 16-3. Liquid-Solid Reactions.- 16-3-1. Deposition Including Oxidation.- 16-3-2. Etching at Liquid-Solid Interface.- 16-4. Solid-Solid Reactions.- 16-4-1. Sublimography.- 16-4-2. Fill-and-Fire Resists.- 16-4-3. Metal Silicides.- 16-4-4. Metal Salt Decomposition.- 16-4-5. Generation of Etchants from Solid Precursors.- 16-5. Direct Laser Treatments.- 16-6. Summary of Photoassisted Processes.- 16-7. Electron-Beam-Assisted Patterning.- 16-7-1. Deposition by Electron Beams.- 16-7-2. Electron-Beam-Induced Etching.- 16-8. Ion-Beam Processes.- 16-9. Summary and Outlook of Resistless Direct Patterning Lithography.- 17. Summary and Future Processes.- 17-1. Critical Lithography.- 17-2. Resist Materials.- 17-2-1. Positive Photoresists.- 17-2-2. Negative Photoresists.- 17-2-3. Positive Radiation Resists.- 17-2-4. Negative Radiation Resists.- 17-2-5. Complementary Lithographic Materials.- 17-2-6. Overall Rating of Resists.- 17-3. Process Lithography.- 17-3-1. Coating Techniques.- 17-3-2. Prebake and Postbake.- 17-3-3. Expose.- 17-3-4. Develop.- 17-3-5. Subtractive Processing.- 17-3-6. Additive Processes.- 17-3-7. Stripping of Resists.- 17-3-8. Resistless Processes.- 17-3-9. Process Controls.- 17-4. Postlude.
      Hoppa över listan

      Mer från samma serie

      Michael S. Shur - GaAs Devices and Circuits, Inbunden

      GaAs Devices and Circuits

      Michael S. Shur

      Inbunden, 1987

      2 210 kr

      E.I. Givargizov - Oriented Crystallization on Amorphous Substrates, Inbunden

      Oriented Crystallization on Amorphous Substrates

      E.I. Givargizov

      Inbunden, 1991

      1 659 kr

      Kamil A. Valiev - Physics of Submicron Lithography, Inbunden

      Physics of Submicron Lithography

      Kamil A. Valiev

      Inbunden, 1992

      2 210 kr

      Ivor Brodie, Julius J. Muray, Ivor Brodie, Julius J. Muray - Physics of Micro/Nano-Fabrication, Inbunden

      Physics of Micro/Nano-Fabrication

      Ivor Brodie, Julius J. Muray, Ivor Brodie, Julius J. Muray

      Inbunden, 1993

      2 210 kr

      John T. L. Thong, John T.L. Thong - Electron Beam Testing Technology, Inbunden

      Electron Beam Testing Technology

      John T. L. Thong, John T.L. Thong

      Inbunden, 1993

      1 659 kr

      Takahiko Misugi, Akihiro Shibatomi - Compound and Josephson High-Speed Devices, Inbunden

      Compound and Josephson High-Speed Devices

      Takahiko Misugi, Akihiro Shibatomi

      Inbunden, 1993

      1 659 kr

      Juras Pozela - Physics of High-Speed Transistors, Inbunden

      Physics of High-Speed Transistors

      Juras Pozela

      Inbunden, 1993

      1 659 kr

      Victor E. Borisenko, Peter J. Hesketh - Rapid Thermal Processing of Semiconductors, Inbunden

      Rapid Thermal Processing of Semiconductors

      Victor E. Borisenko, Peter J. Hesketh

      Inbunden, 1997

      2 430 kr

      J.S. Yuan, Juin Jei Liou - Semiconductor Device Physics and Simulation, Inbunden

      Semiconductor Device Physics and Simulation

      J.S. Yuan, Juin Jei Liou

      Inbunden, 1998

      1 659 kr

      George N. Fursey - Field Emission in Vacuum Microelectronics, Inbunden

      Field Emission in Vacuum Microelectronics

      George N. Fursey

      Inbunden, 2005

      1 108 kr

      Hoppa över listan

      Du kanske också är intresserad av

      Carola Häggkvist, Desirée Stattin Drakenberg - Jag är Carola : Del 1. Frigörelsen, Inbunden
      • Nyhet

      Jag är Carola : Del 1. Frigörelsen

      Carola Häggkvist, Desirée Stattin Drakenberg

      Inbunden, 2026

      289 kr

      Wayne M. Moreau - Semiconductor Lithography, E-bok

      Semiconductor Lithography

      Wayne M. Moreau

      E-bok
      2012

      2 065 kr

      George N. Fursey - Field Emission in Vacuum Microelectronics, Häftad

      Field Emission in Vacuum Microelectronics

      George N. Fursey

      Häftad, 2011

      1 114 kr

      Kamil A. Valiev - Physics of Submicron Lithography, Häftad

      Physics of Submicron Lithography

      Kamil A. Valiev

      Häftad, 2012

      2 222 kr

      Juras Pozela - Physics of High-Speed Transistors, Inbunden

      Physics of High-Speed Transistors

      Juras Pozela

      Inbunden, 1993

      1 659 kr

      Henrik Wahlström - SIGNERAD - Jag måste måla av mig, Inbunden
      • Signerad!

      SIGNERAD - Jag måste måla av mig

      Henrik Wahlström

      Inbunden, 2026

      329 kr

      David K. Ferry, Robert O. Grondin - Physics of Submicron Devices, Häftad

      Physics of Submicron Devices

      David K. Ferry, Robert O. Grondin

      Häftad, 2012

      561 kr

      George N. Fursey - Field Emission in Vacuum Microelectronics, Inbunden

      Field Emission in Vacuum Microelectronics

      George N. Fursey

      Inbunden, 2005

      1 108 kr

      Michael S. Shur - GaAs Devices and Circuits, Inbunden

      GaAs Devices and Circuits

      Michael S. Shur

      Inbunden, 1987

      2 210 kr

      E.I. Givargizov - Oriented Crystallization on Amorphous Substrates, Häftad

      Oriented Crystallization on Amorphous Substrates

      E.I. Givargizov

      Häftad, 2013

      1 659 kr