Christopher Bailey - Böcker
Visar alla böcker från författaren Christopher Bailey. Handla med fri frakt och snabb leverans.
15 produkter
15 produkter
196 kr
Skickas
As a main supporter of their families, dads are pillars of strength. But sometimes they can get overwhelmed and stressed and require self-care. MEN'S DEVOTIONAL FOR DADS by authors and renowned Christian counsellors Chris and Jamie Bailey, helps all dads lean on God for strength and wisdom for the journey of fatherhood and beyond. MEN'S DEVOTIONAL FOR DADS features: · 52 WEEKS OF PRAYERS AND DEVOTIONALS: A selection of powerful scripture and God's truths makes sure that dad is spiritually covered for the whole year. Anecdotes and cases of real dads provide guidance on refocusing on God. Each devotional offers a prayer for God's strength, wisdom, and healing for all seasons of fatherhood. · UPLIFTING AND INSPIRATIONAL AFFIRMATIONS: Each devotional starts with an affirmation that also serves as the devotional theme that reflects God's truth
283 kr
Skickas inom 5-8 vardagar
159 kr
Skickas inom 5-8 vardagar
154 kr
Skickas inom 5-8 vardagar
283 kr
Skickas inom 5-8 vardagar
159 kr
Skickas inom 5-8 vardagar
176 kr
Skickas inom 5-8 vardagar
262 kr
Skickas inom 5-8 vardagar
154 kr
Skickas inom 5-8 vardagar
154 kr
Skickas inom 5-8 vardagar
265 kr
Skickas inom 5-8 vardagar
171 kr
Skickas inom 5-8 vardagar
154 kr
Skickas inom 5-8 vardagar
137 kr
Skickas inom 5-8 vardagar
Co-design And Modelling For Advanced Integration And Packaging: Manufacturing And Reliability
Inbunden, Engelska, 2027
1 796 kr
Kommande
The aim of this book is to provide readers with an in-depth understanding of current state-of-the-art in the use of co-design and modeling tools to predict reliability and robustness of advanced packaging and integration technologies for both micro and power electronic systems. Authored by world leading experts in the field the of multiphysics/multi-domain modeling, the book starts with an overview of advanced packaging and integration technologies which details the manufacturing and reliability challenges that need to be addressed in the development of, for example, 3D-IC, novel bumping technologies such a copper column, lead-free solders and nano-sintering, and packaging technologies such as wafer level packaging. The book then progresses to discuss state-of-the-art modeling tools and techniques and the evolving progression towards co-design, and multi-domain analysis to ensure reliability and robustness. Finally a number of chapters demonstrate the application of these modeling methodologies and toolsets to advanced packaging and integration technologies.