Dongxing Wang – författare

The 4th International Conference of Electronic Engineering and Information Science (ICEEIS 2017) was held January 7-8, 2017 in Harbin, P.R. China. This conference is sponsored by Harbin University of Science and Technology. The topics covered at ICEEIS 2017 include semiconductor materials, nano materials, mechanical materials, MEMS materials, electronic engineering, and information science.

The 4th International Conference of Electronic Engineering and Information Science 2017 (ICEEIS2017) was held January 7-8, 2017 in Haikou, P.R. China. This conference was sponsored by the Harbin University of Science and Technology, China. The conference continued the tradition of gathering world-class researchers, engineers and educators engaged in the fields of electronic engineering and information science to meet and present their latest activities. The proceedings contains contributions in the fields of Electronic Engineering, Information Science and Information Technologies, Computational Mathematics and Data Mining, Mechatronics, Control and Automation and Material Science and Technologies of Processing.