Sujoy Kumar Saha – författare

Microchannel Heat transfer is the cooling application of high power density microchips in the CPU system, micropower systems and many other large scale thermal systems requiring effective cooling capacity.This book offers the latest research and recommended models on the microsize cooling system which not only significantly reduces the weight load, but also enhances the capability to remove much greater amount of heat than any of large scale cooling systems.

A detailed reference in microchannel phase change (boiling and condensation) including recommended models and correlations for various requirements such as pressure loss, and heat transfer coefficient.

Researchers, engineers, designers and students will benefit from the collated, state-of-the-art of the research put together in this book and its systematic, addressing all the relevant issues and providing a good reference for solving problems of critical analysis.

This Brief deals with heat transfer and friction in plate and fin extended heat transfer enhancement surfaces. It examines Offset-Strip Fin (OSF), Enhancement Principle, Analytically Based Models for j and f vs. Re, Transition from Laminar to Turbulent Region, Correlations for j and f vs. Re, Use of OSF with Liquids, Effect of Percent Fin Offset, Effect of Burred Edges, Louver fin, heat transfer and friction correlations, flow structure in the louver fin  array, analytical model for heat transfer and friction, convex louver fin, wavy fin, 3D corrugated fin, perforated fin, pin fins and wire mesh, types of vortex generators, metal foam fin, plain fin, packings, numerical simulation of various types of fins.

This Brief stands as a primer for heat transfer fundamentals in heat transfer enhancement devices, the definition of heat transfer area, passive and active enhancement techniques and their potential and benefits and commercial applications. It further examines techniques and modes of heat transfer like single-phase flow and two-phase flow, natural and forced convection, radiation heat transfer and convective mass transfer.

This Brief concerns heat transfer and pressure drop in heat transfer enhancement for boiling and condensation. The authors divide their topic into six areas: abrasive treatment and coatings, combined structured and porous surfaces, basic principles of boiling mechanism, vapor space condensation, convective vaporization, and forced condensation inside tubes. Within this framework, the book examines range of specific phenomena including  abrasive treatment, open grooves, 3D cavities, etched surfaces, electroplating, pierced 3D cover sheets, attached wire and screen promoters, non-wetting coatings, oxide and ceramic coatings, porous surfaces, structured surfaces (integral roughness), combined structured and porous surfaces, composite surfaces, single-tube pool boiling tests, theoretical fundamentals like liquid superheat, effect of cavity shape and contact angle on superheat, entrapment of vapor in cavities, nucleation at a surface cavity, effect of dissolved gases, bubble departure diameter, bubble dynamics, boiling hysteresis and orientation effects, basic principles of boiling mechanism, visualization and mechanism of boiling in subsurface tunnels, and Chien and Webb parametric boiling studies.

This Brief describes heat transfer and pressure drop in heat transfer enhancement by insert devices and integral roughness. The authors deal with twisted-tape insert laminar and turbulent flow in tubes and annuli in smooth tubes and rough tubes, segmented twisted-tape inserts, displaced enhancement devices, wire coil inserts, extended surface inserts and tangential injection devices. The articles also address transverse and helical integral rib roughness, corrugated tube roughness, 3D and 2D roughness, rod bundles, outside roughness for cross flow, non-circular channels, Reynolds analogy and similarity law, numerical simulation and predictive models. The book is ideal for professionals and researchers working with thermal management in devices.