Michael G. Pecht - Böcker
2 251 kr
Skickas inom 7-10 vardagar
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages.
In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology.
Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic.
Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid themNature-Inspired Computing Paradigms in Systems
Reliability, Availability, Maintainability, Safety and Cost (RAMS+C) and Prognostics and Health Management (PHM)
1 188 kr
Skickas inom 7-10 vardagar
Nature-Inspired Computing Paradigms in Systems: Reliability, Availability, Maintainability, Safety and Cost (RAMS+C) and Prognostics and Health Management (PHM) covers several areas that include bioinspired techniques and optimization approaches for system dependability.
The book addresses the issue of integration and interaction of the bioinspired techniques in system dependability computing so that intelligent decisions, design, and architectures can be supported. It brings together these emerging areas under the umbrella of bio- and nature-inspired computational intelligence.
The primary audience of this book includes experts and developers who want to deepen their understanding of bioinspired computing in basic theory, algorithms, and applications. The book is also intended to be used as a textbook for masters and doctoral students who want to enhance their knowledge and understanding of the role of bioinspired techniques in system dependability.
Provides the latest review Covers various nature-inspired techniques applied to RAMS+C and PHM problems Includes techniques applied to new applications1 451 kr
Skickas inom 5-8 vardagar
1 674 kr
Skickas inom 7-10 vardagar
1 752 kr
Skickas inom 7-10 vardagar
Quality Conformance and Qualification of Microelectronic Packages and Interconnects
1 860 kr
Skickas inom 7-10 vardagar
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
A Focus on Reliability
2 095 kr
Skickas inom 7-10 vardagar
1 840 kr
Skickas inom 7-10 vardagar
China's Electronics Industry
The Definitive Guide for Companies and Policy Makers with Interest in China
3 361 kr
Skickas inom 7-10 vardagar
1 995 kr
Skickas inom 7-10 vardagar
Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations.
Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-shelf (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability.
With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packaging (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechanical systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs).
This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology.
Guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Coverage of environmentally friendly 'green encapsulants' Practical coverage of faults and defects: how to analyze them and how to avoid themStrategies to the Prediction, Mitigation and Management of Product Obsolescence
1 458 kr
Skickas inom 7-10 vardagar
Reliability Engineering
1 546 kr
Skickas inom 7-10 vardagar
Prognostics and Health Management of Electronics
Fundamentals, Machine Learning, and the Internet of Things
1 776 kr
Skickas inom 5-8 vardagar
1 487 kr
Skickas inom 7-10 vardagar
Safety Challenges and Strategies of Using Lithium-Ion Batteries
Safety Challenges and Strategies
1 478 kr
Skickas inom 7-10 vardagar
Optimum Cooling of Data Centers
Application of Risk Assessment and Mitigation Techniques
1 073 kr
Skickas inom 10-15 vardagar
1 392 kr
Skickas inom 10-15 vardagar
Optimum Cooling of Data Centers
Application of Risk Assessment and Mitigation Techniques
1 067 kr
Skickas inom 10-15 vardagar
1 392 kr
Skickas inom 10-15 vardagar
Risk-Based Engineering
An Integrated Approach to Complex Systems—Special Reference to Nuclear Plants
1 392 kr
Skickas inom 10-15 vardagar
Risk-Based Engineering
An Integrated Approach to Complex Systems—Special Reference to Nuclear Plants
966 kr
Skickas inom 10-15 vardagar