Ning-Cheng Lee – författare

This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field.

Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored:

* Chip (wafer) level interconnects with lead-free solder bumps* Lead-free solder wafer bumping with micro-ball mounting and paste printing methods* Lead-free solder joint reliability of WLCSPs on organic and ceramic substrates* Chip (wafer) level interconnects with solderless bumps such as Ni-Au, Au, and Cu, Cu wires, Au wires, Au studs, and Cu studs* Design, materials, process, and reliability of WLCSPs with solderless interconnects on PCB/substrate* Halogen-free molding compounds for PQFP, PBGA, and MAP-PBGA packages* Environmentally benign die-attach films for PQFP and PBGA packages and lead-free die-attach bonding techniques for IC packaging* Environmental issues for conventional PCBs and substrates* Some environmentally conscious flame-retardants for PCBs and organic substrates* Emerging technologies for fabricating environmental friendly PCBs such as design for environment, green PCB manufacturing, and environmental safety* Lead-free soldering activities such as legislation, consortia programs, and regional preferences on lead-free solder alternatives* Criteria, development approaches, and varieties of alloys and properties of lead-free solders* Physical, mechanical, chemical, electrical, and soldering properties of lead-free solders* Manufacturing process and performance of lead-free surface finishes for both PCB and component applications* Implementation and execution challenges of lead-free soldering, especially for the reflow and wave soldering process* Fundamental understanding of electrically conductive adhesive (ECA) technology* Effects of lubricant removal and cure shrinkage on ECAs* Mechanisms underlying the contact resistance shifts of ECAs* Effects of electrolytes and moisture absorption on contact resistance shifts of ECAs* Stabilization of contact resistance of ECAs using various additives

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.