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Ning-Cheng Lee – författare

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5 produkter

  1. Ricky S. W. Lee, Ning-Cheng Lee, C. P. Wong, John H. Lau - Electronics Manufacturing, E-bok. Tillgänglighet: Lägg i varukorg

    Electronics Manufacturing

    with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials

    Av Ricky S. W. Lee, Ning-Cheng Lee m. fl.

    E-bok, 2002

    1788 kr

    Lägg i varukorg

    ELECTRONICS MANUFACTUIRNG WITH LEAD-FREE, HALOGEN-FREE, AND CONDUCTIVE-ADHESTIVE MATERIALS This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. …

  2. Ning-Cheng Lee - Reflow Soldering Processes, E-bok. Tillgänglighet: Lägg i varukorg

    Reflow Soldering Processes

    Av Ning-Cheng Lee

    E-bok, 2002

    1255 kr

    Lägg i varukorg

    Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared …

  3. John H. Lau, Ning-Cheng Lee - Assembly and Reliability of Lead-Free Solder Joints, Inbunden. Tillgänglighet: Lägg i varukorg

    Assembly and Reliability of Lead-Free Solder Joints

    Av John H. Lau, Ning-Cheng Lee

    Inbunden, 2020

    1752 kr

    Lägg i varukorg

    This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and …

  4. Ning-Cheng Lee, John H. Lau - Assembly and Reliability of Lead-Free Solder Joints, E-bok. Tillgänglighet: Lägg i varukorg

    Assembly and Reliability of Lead-Free Solder Joints

    Av Ning-Cheng Lee, John H. Lau

    E-bok, 2020

    1622 kr

    Lägg i varukorg

    This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and …

  5. John H. Lau, Ning-Cheng Lee - Assembly and Reliability of Lead-Free Solder Joints, Häftad. Tillgänglighet: Lägg i varukorg

    Assembly and Reliability of Lead-Free Solder Joints

    Av John H. Lau, Ning-Cheng Lee

    Häftad, 2021

    1261 kr

    Lägg i varukorg

    This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and …