John H. Lau – författare
Visar alla böcker från författaren John H. Lau. Handla med fri frakt och snabb leverans.
29 produkter
Semiconductor Advanced Packaging
Av John H. Lau
Häftad, 2022
1316 kr
Lägg i varukorg
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on …
Microvias: For Low Cost, High Density Interconnects
Av Ricky S. W. Lee, John H. Lau
E-bok, 2001
1191 kr
Lägg i varukorg
State-of-the-art introduction to high-density interconnect technology The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology that’s changing the nature of printed circuit boards--and driving the mobile electronic …
Electronics Manufacturing
with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials
Av Ricky S. W. Lee, Ning-Cheng Lee m. fl.
E-bok, 2002
1749 kr
Lägg i varukorg
ELECTRONICS MANUFACTUIRNG WITH LEAD-FREE, HALOGEN-FREE, AND CONDUCTIVE-ADHESTIVE MATERIALS This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. …
Advanced MEMS Packaging
Av Yu Aibin, C. S. Premachandran m. fl.
E-bok, 2009
2149 kr
Lägg i varukorg
A comprehensive guide to 3D MEMS packaging methods and solutions Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents …
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
Av John H. Lau
E-bok, 2010
1740 kr
Lägg i varukorg
Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This …
Through-Silicon Vias for 3D Integration
Av John H. Lau
E-bok, 2012
1931 kr
Lägg i varukorg
A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping …
3D IC Integration and Packaging
Av John H. Lau
E-bok, 2015
2741 kr
Lägg i varukorg
A comprehensive guide to 3D IC integration and packaging technology 3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this …
Solder Joint Reliability
Theory and Applications
Av John H. Lau
Inbunden, 1991
2254 kr
Lägg i varukorg
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is …
Handbook Of Tape Automated Bonding
Av John H. Lau
Inbunden, 1992
2254 kr
Lägg i varukorg
Handbook of tape automated bonding (TAB) is a one-stop guide to the state of the art of TAB technology - including TAB tape, bump, inner lead bonding, encapsulation, testing, burn-in, outer lead bonding, inspection, rework, thermal management and reliability. For professionals active in TAB …
Chip On Board
Technology for Multichip Modules
Av John H. Lau
Inbunden, 1994
2188 kr
Lägg i varukorg
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their …
Mechanics of Solder Alloy Interconnects
Av Darrel R. Frear, Steven N. Burchett m. fl.
Inbunden, 1994
2254 kr
Lägg i varukorg
The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a …
Solder Joint Reliability
Theory and Applications
Av John H. Lau
Häftad, 2014
2188 kr
Lägg i varukorg
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is …
Solder Joint Reliability
Theory and Applications
Av John H. Lau
E-bok, 2013
2840 kr
Lägg i varukorg
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is …
Fan-Out Wafer-Level Packaging
Av John H. Lau
Inbunden, 2018
1643 kr
Lägg i varukorg
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan …
Fan-Out Wafer-Level Packaging
Av John H. Lau
E-bok, 2018
1587 kr
Lägg i varukorg
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan …
Fan-Out Wafer-Level Packaging
Av John H. Lau
Häftad, 2018
1207 kr
Lägg i varukorg
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan …
Heterogeneous Integrations
Av John H. Lau
Inbunden, 2019
1752 kr
Lägg i varukorg
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each …
Heterogeneous Integrations
Av John H. Lau
E-bok, 2019
2224 kr
Lägg i varukorg
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each …
Assembly and Reliability of Lead-Free Solder Joints
Av John H. Lau, Ning-Cheng Lee
Inbunden, 2020
1752 kr
Lägg i varukorg
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and …
Assembly and Reliability of Lead-Free Solder Joints
Av Ning-Cheng Lee, John H. Lau
E-bok, 2020
1587 kr
Lägg i varukorg
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and …
Assembly and Reliability of Lead-Free Solder Joints
Av John H. Lau, Ning-Cheng Lee
Häftad, 2021
1261 kr
Lägg i varukorg
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and …
Semiconductor Advanced Packaging
Av John H. Lau
Inbunden, 2021
1752 kr
Lägg i varukorg
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on …
Semiconductor Advanced Packaging
Av John H. Lau
E-bok, 2021
1785 kr
Lägg i varukorg
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on …
Chiplet Design and Heterogeneous Integration Packaging
Av John H. Lau
Inbunden, 2023
1970 kr
Lägg i varukorg
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a …
Chiplet Design and Heterogeneous Integration Packaging
Av John H. Lau
E-bok, 2023
1728 kr
Lägg i varukorg
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a …
Chiplet Design and Heterogeneous Integration Packaging
Av John H. Lau
Häftad, 2024
1425 kr
Lägg i varukorg
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a …
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Av John H. Lau
Inbunden, 2024
1861 kr
Lägg i varukorg
This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study …
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Av John H. Lau
E-bok, 2024
2444 kr
Lägg i varukorg
This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study …
