Mechanics of Solder Alloy Interconnects

Inbunden, Engelska, 1994

2 197 kr

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Beskrivning

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

Produktinformation

Utgivningsdatum:1994-01-31
Mått:152 x 229 x 28 mm
Vikt:781 g
Format:Inbunden
Språk:Engelska
Antal sidor:418
Upplaga:1994
Förlag:Kluwer Academic Publishers Group
ISBN:9780442015053

Utforska kategorier

Programmeringsböcker inom Data och IT

Innehållsförteckning

Foreword; Acknowldgement; Introduction: the mechanics of soldere alloy interconnect; Microstructural influences on the mechanical properties of solder; Interfaces and intermetallics; Constitutivemodels; Prediction of solder joint geometry; Life prediction and accelerated testing; Thermomechanical modeling of solder joints - numerical considerations; Applications - through-hole; Surface mount solder joints under thermal, mechanical, and vibration conditions; Index