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Beskrivning
Containing updated material from the first edition, this book adds several chapters covering RF testing techniques, reliability, process and manufacturing disciplines and process development (experiment by design).
GaAs material and crystal properties; GaAs devices; general process techniques; cleaning and cleanliness; wet etching; photolithography; nonoptical lithography; plasma processing equipment and plasma-assisted deposition; dry etching; plasma, RIE, RIBE, ion milling; specific process types; device isolation; ohmic contacts; schottky barriers and gate formation; first-level metal, dielectric formation, second-level metal; capacitors, inductors, and resistors.
