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4 produkter
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Substrate noise coupling in integrated circuits (ICs) is the process by which int- ference signals in the form of voltage and current glitches cause parasitic currents to ?ow in the silicon substrate to various parts of the IC. The source of such glitches and parasitic currents could be from the switching noise of high speed digital clocks on the same chip. In RF and mixed signal ICs the switching noise is coupled to sensitive analog and RF nodes in the IC causing degradation in performance that could severely impact the yield. Thus, overcoming substrate coupling is a key issue in successful “system on chip” ?rst-pass integration where RF and mixed signal blocks, high speed digital I/O interface are integrated with digital signal proce- ing algorithms on the same chip. This is particularly true as we move to sub-90 nanometer system on chip integration. In this book a substrate aware design ?ow is built, calibrated to silicon and used as part of the design and validation ?ows to uncover and ?x substrate coupling problems in RF ICs. The ?ow is used to develop a comprehensive RF substrate noise isolation design guide to be used by RF designers during the ?oor planning, circuit design and validation phases. This will allow designers to optimize the - sign, maximize noise isolation and protect sensitive analog/RF blocks from being degraded by substrate noise coupling.
551 kr
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th This volume presents the proceedings of the 9 IFIP/IEEE International Conference on Management of Multimedia and Mobile Networks and Services (MMNS 2006), th th which was held from October 25 to 27 as part of Manweek 2006 in Dublin,Ireland. In line with its reputation as one of the pre-eminent fora for the discussion anddebate of advances in management of multimedia networks and services, the 2006 iteration of MMNS brought together an international audience of researchers and practitioners from both industry and academia. One of the most signi?cant trends of recent years has been the development and considerable market penetration of multimedia-capable mobile handsets. Nevertheless, signi?cant research challenges remain in the area of management of mobile networks supporting multimedia services; challenges which must be addressed by the research community if the vision of ubiquitous availability of advanced multimedia services is to be realised. The MMNS Steering Committee, noting the growing interest within the research community on solving issues relating speci?cally to the transport of multimedia traf?c over various mobile access technologies, made the signi?cant decision to change the long name of the MMNS conference to re?ect this change in focus. For2006 and subsequent years, it will be called “Management of Multimedia and Mobile Networks and Services”.
Ad Hoc Networks
Third International ICST Conference, ADHOCNETS 2011, Paris, France, September 21-23, 2011, Revised Selected Papers
Häftad, Engelska, 2012
551 kr
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This volume constitutes the refereed proceedings of the Third International ICST Conference, ADHOCNETS 2011, held in Paris, France, in September 2011. The 15 revised full papers - selected from 42 submissions - and the 2 invited papers cover several fundamental aspects of ad hoc networking, including security, quality of service, radio and spectrum analysis, mobility, energy efficiency, and deployment. They are organized in topical sections on security and QoS, WSN development and evaluation, radio and spectrum analysis, mobile WSNs, mobile ad hoc networks, and energy.
1 064 kr
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Substrate noise coupling in integrated circuits (ICs) is the process by which int- ference signals in the form of voltage and current glitches cause parasitic currents to ?ow in the silicon substrate to various parts of the IC. The source of such glitches and parasitic currents could be from the switching noise of high speed digital clocks on the same chip. In RF and mixed signal ICs the switching noise is coupled to sensitive analog and RF nodes in the IC causing degradation in performance that could severely impact the yield. Thus, overcoming substrate coupling is a key issue in successful “system on chip” ?rst-pass integration where RF and mixed signal blocks, high speed digital I/O interface are integrated with digital signal proce- ing algorithms on the same chip. This is particularly true as we move to sub-90 nanometer system on chip integration. In this book a substrate aware design ?ow is built, calibrated to silicon and used as part of the design and validation ?ows to uncover and ?x substrate coupling problems in RF ICs. The ?ow is used to develop a comprehensive RF substrate noise isolation design guide to be used by RF designers during the ?oor planning, circuit design and validation phases. This will allow designers to optimize the - sign, maximize noise isolation and protect sensitive analog/RF blocks from being degraded by substrate noise coupling.