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Aida Todri-Sanial – författare

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7 produkter

  1. Aida Todri-Sanial, Chuan Seng Tan - Physical Design for 3D Integrated Circuits, Häftad. Tillgänglighet: Lägg i varukorg

    Physical Design for 3D Integrated Circuits

    Av Aida Todri-Sanial, Chuan Seng Tan

    Häftad, 2021

    1069 kr

    Lägg i varukorg

    Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology.The book begins by offering an overview of physical design challenges with …

  2. Chuan Seng Tan, Aida Todri-Sanial - Physical Design for 3D Integrated Circuits, E-bok. Tillgänglighet: Lägg i varukorg

    Physical Design for 3D Integrated Circuits

    Av Chuan Seng Tan, Aida Todri-Sanial

    E-bok, 2017

    1264 kr

    Lägg i varukorg

    Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with …

  3. Aida Todri-Sanial, Chuan Seng Tan - Physical Design for 3D Integrated Circuits, Inbunden. Tillgänglighet: Lägg i varukorg

    Physical Design for 3D Integrated Circuits

    Av Aida Todri-Sanial, Chuan Seng Tan

    Inbunden, 2015

    2746 kr

    Lägg i varukorg

    Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology.The book begins by offering an overview of physical design challenges with …

  4. Chuan Seng Tan, Aida Todri-Sanial - Physical Design for 3D Integrated Circuits, E-bok. Tillgänglighet: Lägg i varukorg

    Physical Design for 3D Integrated Circuits

    Av Chuan Seng Tan, Aida Todri-Sanial

    E-bok, 2017

    1264 kr

    Lägg i varukorg

    Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with …

  5. Aida Todri-Sanial, Jean Dijon, Antonio Maffucci - Carbon Nanotubes for Interconnects, Inbunden. Tillgänglighet: Lägg i varukorg

    Carbon Nanotubes for Interconnects

    Process, Design and Applications

    Av Aida Todri-Sanial, Jean Dijon m. fl.

    Inbunden, 2016

    1096 kr

    Lägg i varukorg

    This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in …

  6. Antonio Maffucci, Jean Dijon, Aida Todri-Sanial - Carbon Nanotubes for Interconnects, E-bok. Tillgänglighet: Lägg i varukorg

    Carbon Nanotubes for Interconnects

    Process, Design and Applications

    Av Antonio Maffucci, Jean Dijon m. fl.

    E-bok, 2016

    1459 kr

    Lägg i varukorg

    This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in …

  7. Aida Todri-Sanial, Jean Dijon, Antonio Maffucci - Carbon Nanotubes for Interconnects, Häftad. Tillgänglighet: Lägg i varukorg

    Carbon Nanotubes for Interconnects

    Process, Design and Applications

    Av Aida Todri-Sanial, Jean Dijon m. fl.

    Häftad, 2018

    1096 kr

    Lägg i varukorg

    This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in …