F. Patrick McCluskey - Böcker

Since the publication of the first edition of Integrated Product and Process Design and Development: The Product Realization Process more than a decade ago, the product realization process has undergone a number of significant changes. Reflecting these advances, this second edition presents a thorough treatment of the modern tools used in the integrated product realization process and places the product realization process in its new context.See what’s new in the Second Edition: Bio-inspired concept generation and TRIZComputing manufacturing cost, costs of ownership, and life-cycle costs of products Engineered plastics, ceramics, composites, and smart materialsRole of innovationNew manufacturing methods: in-mold assembly and layered manufacturing This book discusses how to translate customer needs into product requirements and specifications. It then provides methods to determine a product’s total costs, including cost of ownership, and covers how to generate and evaluate product concepts. The authors examine methods for turning product concepts into actual products by considering development steps such as materials and manufacturing processes selection, assembly methods, environmental aspects, reliability, and aesthetics, to name a few. They also introduce the design of experiments and the six sigma philosophy as means of attaining quality.To be globally viable, corporations need to produce innovative, visually appealing, quality products within shorter development times. Filled with checklists, guidelines, strategies, and examples, this book provides proven methods for creating competitively priced quality products.

The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them.Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments.High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts.Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.

The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them.Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments.High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts.Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials soldersElectronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.