Michael Pecht – författare

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future?Chapters discuss:failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliabilityGuidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.

This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs.The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture.The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The

This practical guide presents and compares the fundamental theories and techniques of placement and routing and provides important new approaches to solving specific problems.;Focusing on highly reliable methods for good manufacturing capability, Placement and Routing of Electronic Modules: discusses the mathematical basis for placement and routing, including set, combinatorial and graph theories; explicates the definitions, structures and relationships of tree types and gives methods of finding minimum trees; furnishes useful techniques for placing and routing high-density modules; supplies ways to determine the work-space area needed for placement and routing; shows how to estimate the number of layers necessary to complete routing; explains via minimization to reduce work-space area, facilitate manufacture, and reduce the number of layers; demonstrates a variety of search strategies for paths connecting two nodes on a work space with obstacles; and much more. Containing over 300 illustrative examples, figures and tables that clarify concepts and enhance understanding, Placement and Routing of Electronic Modules should be a useful tool for electrical and electronics, mechanical, reliability, process, and manufacturing engineers; computer scientists; applied mathematicians; and graduate-level students in these disciplines.

This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs.The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture.The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The

This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs.The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture.The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The

Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development

This practical guide presents and compares the fundamental theories and techniques of placement and routing and provides important new approaches to solving specific problems.;Focusing on highly reliable methods for good manufacturing capability, Placement and Routing of Electronic Modules: discusses the mathematical basis for placement and routing, including set, combinatorial and graph theories; explicates the definitions, structures and relationships of tree types and gives methods of finding minimum trees; furnishes useful techniques for placing and routing high-density modules; supplies ways to determine the work-space area needed for placement and routing; shows how to estimate the number of layers necessary to complete routing; explains via minimization to reduce work-space area, facilitate manufacture, and reduce the number of layers; demonstrates a variety of search strategies for paths connecting two nodes on a work space with obstacles; and much more. Containing over 300 illustrative examples, figures and tables that clarify concepts and enhance understanding, Placement and Routing of Electronic Modules should be a useful tool for electrical and electronics, mechanical, reliability, process, and manufacturing engineers; computer scientists; applied mathematicians; and graduate-level students in these disciplines.

The Korean Electronics Industry documents the technologies, manufacturing procedures, capabilities, and infrastructure that have made the Republic of Korea successful in the electronics industry. The book covers the major segments of Korea's electronics industry, including semiconductors, packaging, displays, printed circuit boards, and systems. In addition, this book examines the roles that government, associations, research organizations, educational institutions, and major companies have played in establishing an infrastructure where the industry can flourish.

The Chinese Electronics Industry documents the technologies, capabilities, and infrastructure that has made China a major player in the Asian electronics industry. This book covers the major segments of China's electronics industry, including semiconductors, packaging, printed circuit boards, computer hardware and software, telecommunications, and electronic systems. In addition, this book examines the role of government, research organizations, educational institutions, and major companies in establishing an infrastructure where the industry can flourish. Specifically, this book will help readers:Comprehend the historical developments, current status, and future growth of China's electronics industry Understand the cultural, economic, and technological factors that drive and inhibit market access and success in China Make decisions on strategic issues, such as market entry, establishing joint ventures or strategic alliances with Chinese electronics companies in order to access world's largest emerging market Formulate strategy to cooperate and compete in the global electronics industry

The rapid growth of the electronic products market has created an increasing need for affordable, reliable, high-speed and high-density multi-layer printed circuit boards (PCBs). This book presents the technologies, algorithms, and methodologies for engineers and others developing the next generation of electronic products.A vision of the future in advanced electronicsAdvanced Routing of Electronic Modules provides both fundamental theory and advanced technologies for improving routing. Beginning chapters discuss approaches to approximate a minimum rectilinear Steiner tree from a minimum spanning tree and introduce ways to avoid obstacles for routing simple multi-terminal nets sequentially in a workspace. Timing delay, clock skew, and noise control requirements in signal integrity are described as well as computer-aided approaches to managing these requirements in high-speed PCB/MCM routing.Later chapters present the two-layer wiring problem, rip-up and reroute approaches, and parallel routing, including global routing, boundary crossing placement, and detailed maze routing in hardware acceleration. Data structures, data management, and algorithms for parallel routing in a multiple-processor hardware systems are also covered.

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future?Chapters discuss:failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliabilityGuidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials soldersElectronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

This practical guide presents and compares the fundamental theories and techniques of placement and routing and provides important new approaches to solving specific problems.;Focusing on highly reliable methods for good manufacturing capability, Placement and Routing of Electronic Modules: discusses the mathematical basis for placement and routing, including set, combinatorial and graph theories; explicates the definitions, structures and relationships of tree types and gives methods of finding minimum trees; furnishes useful techniques for placing and routing high-density modules; supplies ways to determine the work-space area needed for placement and routing; shows how to estimate the number of layers necessary to complete routing; explains via minimization to reduce work-space area, facilitate manufacture, and reduce the number of layers; demonstrates a variety of search strategies for paths connecting two nodes on a work space with obstacles; and much more. Containing over 300 illustrative examples, figures and tables that clarify concepts and enhance understanding, Placement and Routing of Electronic Modules should be a useful tool for electrical and electronics, mechanical, reliability, process, and manufacturing engineers; computer scientists; applied mathematicians; and graduate-level students in these disciplines.

The Korean Electronics Industry documents the technologies, manufacturing procedures, capabilities, and infrastructure that have made the Republic of Korea successful in the electronics industry. The book covers the major segments of Korea''s electronics industry, including semiconductors, packaging, displays, printed circuit boards, and systems. In addition, this book examines the roles that government, associations, research organizations, educational institutions, and major companies have played in establishing an infrastructure where the industry can flourish.

This practical guide presents and compares the fundamental theories and techniques of placement and routing and provides important new approaches to solving specific problems.;Focusing on highly reliable methods for good manufacturing capability, Placement and Routing of Electronic Modules: discusses the mathematical basis for placement and routing, including set, combinatorial and graph theories; explicates the definitions, structures and relationships of tree types and gives methods of finding minimum trees; furnishes useful techniques for placing and routing high-density modules; supplies ways to determine the work-space area needed for placement and routing; shows how to estimate the number of layers necessary to complete routing; explains via minimization to reduce work-space area, facilitate manufacture, and reduce the number of layers; demonstrates a variety of search strategies for paths connecting two nodes on a work space with obstacles; and much more. Containing over 300 illustrative examples, figures and tables that clarify concepts and enhance understanding, Placement and Routing of Electronic Modules should be a useful tool for electrical and electronics, mechanical, reliability, process, and manufacturing engineers; computer scientists; applied mathematicians; and graduate-level students in these disciplines.

The Korean Electronics Industry documents the technologies, manufacturing procedures, capabilities, and infrastructure that have made the Republic of Korea successful in the electronics industry. The book covers the major segments of Korea''s electronics industry, including semiconductors, packaging, displays, printed circuit boards, and systems. In addition, this book examines the roles that government, associations, research organizations, educational institutions, and major companies have played in establishing an infrastructure where the industry can flourish.

Taiwan''s electronics industry, especially the semiconductor and information products sectors, is characterized by rapid growth and high potential. This book investigates the past performance, current status, and future development of this industry, providing engineers with important data. Corporate business planners and electronics managers will find helpful information for decision making regarding joint ventures and alliances with Taiwanese manufacturers.

Taiwan''s electronics industry, especially the semiconductor and information products sectors, is characterized by rapid growth and high potential. This book investigates the past performance, current status, and future development of this industry, providing engineers with important data. Corporate business planners and electronics managers will find helpful information for decision making regarding joint ventures and alliances with Taiwanese manufacturers.

Competitive product development is all about reliability, maintainability, and supportability and the earlier that these factors are considered the better. Edited by a mechanical engineer known for his work in product development, reliability, packaging, and supply chain efficiency, this invaluable bestselling resource is now updated to include new optimization methods, as well as the IEEE standards 1332 and 1413 on reliability and reliability prediction. The text presents the latest software tools for reliability evaluation as well as emerging techniques, such as up-rating, burn-in, and screening methods. It also explores the physics of failure in design and testing and the integration of reliability with business considerations.

The rapid growth of the electronic products market has created an increasing need for affordable, reliable, high-speed and high-density multi-layer printed circuit boards (PCBs). This book presents the technologies, algorithms, and methodologies for engineers and others developing the next generation of electronic products.A vision of the future in advanced electronicsAdvanced Routing of Electronic Modules provides both fundamental theory and advanced technologies for improving routing. Beginning chapters discuss approaches to approximate a minimum rectilinear Steiner tree from a minimum spanning tree and introduce ways to avoid obstacles for routing simple multi-terminal nets sequentially in a workspace. Timing delay, clock skew, and noise control requirements in signal integrity are described as well as computer-aided approaches to managing these requirements in high-speed PCB/MCM routing.Later chapters present the two-layer wiring problem, rip-up and reroute approaches, and parallel routing, including global routing, boundary crossing placement, and detailed maze routing in hardware acceleration. Data structures, data management, and algorithms for parallel routing in a multiple-processor hardware systems are also covered.

The rapid growth of the electronic products market has created an increasing need for affordable, reliable, high-speed and high-density multi-layer printed circuit boards (PCBs). This book presents the technologies, algorithms, and methodologies for engineers and others developing the next generation of electronic products.A vision of the future in advanced electronicsAdvanced Routing of Electronic Modules provides both fundamental theory and advanced technologies for improving routing. Beginning chapters discuss approaches to approximate a minimum rectilinear Steiner tree from a minimum spanning tree and introduce ways to avoid obstacles for routing simple multi-terminal nets sequentially in a workspace. Timing delay, clock skew, and noise control requirements in signal integrity are described as well as computer-aided approaches to managing these requirements in high-speed PCB/MCM routing.Later chapters present the two-layer wiring problem, rip-up and reroute approaches, and parallel routing, including global routing, boundary crossing placement, and detailed maze routing in hardware acceleration. Data structures, data management, and algorithms for parallel routing in a multiple-processor hardware systems are also covered.

Taiwan's electronics industry, especially the semiconductor and information products sectors, is characterized by rapid growth and high potential. This book investigates the past performance, current status, and future development of this industry, providing engineers with important data. Corporate business planners and electronics managers will find helpful information for decision making regarding joint ventures and alliances with Taiwanese manufacturers.

The Chinese Electronics Industry documents the technologies, capabilities, and infrastructure that has made China a major player in the Asian electronics industry. This book covers the major segments of China's electronics industry, including semiconductors, packaging, printed circuit boards, computer hardware and software, telecommunications, and electronic systems. In addition, this book examines the role of government, research organizations, educational institutions, and major companies in establishing an infrastructure where the industry can flourish. Specifically, this book will help readers:Comprehend the historical developments, current status, and future growth of China's electronics industry Understand the cultural, economic, and technological factors that drive and inhibit market access and success in China Make decisions on strategic issues, such as market entry, establishing joint ventures or strategic alliances with Chinese electronics companies in order to access world's largest emerging market Formulate strategy to cooperate and compete in the global electronics industry

The Korean Electronics Industry documents the technologies, manufacturing procedures, capabilities, and infrastructure that have made the Republic of Korea successful in the electronics industry. The book covers the major segments of Korea's electronics industry, including semiconductors, packaging, displays, printed circuit boards, and systems. In addition, this book examines the roles that government, associations, research organizations, educational institutions, and major companies have played in establishing an infrastructure where the industry can flourish.

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future?Chapters discuss:

failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliabilityGuidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future?Chapters discuss:

failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliabilityGuidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.

The Chinese Electronics Industry documents the technologies, capabilities, and infrastructure that has made China a major player in the Asian electronics industry. This book covers the major segments of China''s electronics industry, including semiconductors, packaging, printed circuit boards, computer hardware and software, telecommunications, and electronic systems. In addition, this book examines the role of government, research organizations, educational institutions, and major companies in establishing an infrastructure where the industry can flourish. Specifically, this book will help readers:

Comprehend the historical developments, current status, and future growth of China''s electronics industry Understand the cultural, economic, and technological factors that drive and inhibit market access and success in China Make decisions on strategic issues, such as market entry, establishing joint ventures or strategic alliances with Chinese electronics companies in order to access world''s largest emerging market Formulate strategy to cooperate and compete in the global electronics industry

Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:

interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials soldersElectronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.