Riko Radojcic – författare
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17 produkter
Guidebook for Managing Silicon Chip Reliability
Av Michael Pecht, Riko Radojcic m. fl.
Häftad, 2019
646 kr
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Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated …
Guidebook for Managing Silicon Chip Reliability
Av Michael Pecht, Riko Radojcic m. fl.
Inbunden, 1998
1827 kr
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Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated …
Startup
E-bok, 2022
119 kr
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Professor Andrija Krstic is a bright man pursuing leading edge research in semiconductor technology.But when an opportunity for financing an Artificial Intelligence high tech startup presents itself, he embraces the opportunity even though the seed money is offered by an odd and somewhat suspicious …
Guidebook for Managing Silicon Chip Reliability
Av Gopal Rao, Riko Radojcic m. fl.
E-bok, 2017
746 kr
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Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated …
Guidebook for Managing Silicon Chip Reliability
Av Gopal Rao, Riko Radojcic m. fl.
E-bok, 2017
762 kr
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Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated …
Three Dimensional System Integration
IC Stacking Process and Design
Av Antonis Papanikolaou, Dimitrios Soudris m. fl.
Inbunden, 2010
552 kr
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Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., …
Three Dimensional System Integration
IC Stacking Process and Design
Av Riko Radojcic, Dimitrios Soudris m. fl.
E-bok, 2010
718 kr
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Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., …
Three Dimensional System Integration
IC Stacking Process and Design
Av Antonis Papanikolaou, Dimitrios Soudris m. fl.
Häftad, 2014
551 kr
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Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., …
Managing More-than-Moore Integration Technology Development
A Story of an Advanced Technology Program in the Semiconductor Industry
Häftad, 2019
367 kr
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This book presents the real challenges and experiences of managing an advanced semiconductor technology development and integration program – but using a novelized form. The material is presented in a conversational format through a story that follows a fictional narrator as she grows from an …
More-than-Moore 2.5D and 3D SiP Integration
Inbunden, 2017
1316 kr
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This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business …
More-than-Moore 2.5D and 3D SiP Integration
E-bok, 2017
1176 kr
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This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business …
More-than-Moore 2.5D and 3D SiP Integration
Häftad, 2018
934 kr
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This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business …
Managing More-than-Moore Integration Technology Development
A Story of an Advanced Technology Program in the Semiconductor Industry
Inbunden, 2018
366 kr
Lägg i varukorg
This book presents the real challenges and experiences of managing an advanced semiconductor technology development and integration program – but using a novelized form. The material is presented in a conversational format through a story that follows a fictional narrator as she grows from an …
Managing More-than-Moore Integration Technology Development
A Story of an Advanced Technology Program in the Semiconductor Industry
E-bok, 2018
447 kr
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This book presents the real challenges and experiences of managing an advanced semiconductor technology development and integration program – but using a novelized form. The material is presented in a conversational format through a story that follows a fictional narrator as she grows from an …
FA Confidential
E-bok, 2023
120 kr
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Big things often have small beginnings.As National Security Adviser to the President of the United States, Jane Stewart shepherds an act through congress to subsidize manufacturing of silicon chips on American soil.Argon Zhi, an executive at one of the world's best semiconductor foundries, accepts …
