Electronic Packaging Materials and Their Properties

Inbunden, Engelska, 1998

2 703 kr

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Beskrivning

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials soldersElectronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

Produktinformation

Utgivningsdatum:1998-12-18
Mått:156 x 234 x 11 mm
Vikt:362 g
Format:Inbunden
Språk:Engelska
Serie:Electronic Packaging
Antal sidor:120
Förlag:Taylor & Francis Inc
ISBN:9780849396250

Utforska kategorier

Elektronik och kommunikationer inom Naturvetenskap och teknik

Mer om författaren

Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan

Innehållsförteckning

Introduction,Properties of Electronics Packaging Materials,Electrical Properties,Thermal and Thermomechanical Properties,Mechanical Properties,Chemical Properties,Miscellaneous Properties,Zeroth-Level Packaging Materials,Semiconductors,Attachment Materials,Substrates,First-Level Packaging Materials,Wire Interconnects,Tape Interconnects,Case Materials,Lid Seals,Leads,Second-Level Packaging Materials,Reinforcement Fiber Materials,Resins,Laminates,Constraining Cores,Flexible Wiring Board Materials,Conductor Metals in Laminates,Conformal Coatings,Third-Level Packaging Materials,Backpanel Materials,Connectors Materials,Cables and Flex Circuit Materials,Summary,Appendices,Index

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