Hong Liang – författare

The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization presents a detailed account of the CMP process in a language that is suitable for tribology professionals as well as chemists, materials scientists, physicists, and other applied scientists and engineers in fields of semiconductors and microelectronics. The first half of the book is devoted to CMP, while the other focuses on the fundamentals of tribology.As the first source to integrate CMP and tribology, the book illustrates the important role that these fields play in manufacturing and technological development. It follows with an examination of tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects. Other topics covered in depth include basics of friction, flash temperature, lubrication fundamentals, basics of wear, polishing particles, and pad wear. The book concludes its focus with CMP practices, discussing mechanical aspects, pad materials, elastic modulus, and cell buckling.Expanding upon the science and technology of tribology to improve the reliability, maintenance, and wear of technical equipment and other material applications, Tribology in Chemical-Mechanical Planarization provides scientists and engineers with clear foresight to the future of this technology.

Studying the morphology, defects, and wear behavior of a variety of material surfaces, Mechanical Tribology examines popular and emerging surface characterization techniques for assessment of the physical, mechanical, and chemical properties of various modified surfaces, thin films, and coatings.Its chapters explore a wide range of tribological applications while promoting reduced component deterioration and improved efficiency and reliability of mechanical systems. The book includes extensive coverage of critical technologies that are usually absent in other references on the subject, delving into procedures affecting metal cutting and forming, physicochemical issues involved in the design of fiber finishes, and recent progress in biotribological research. It provides strategies to characterize the friction and wear properties of tribological systems and procedures to assess the quality and lifetime of ceramic materials. It also outlines methods to avoid scuffing and seizure in machine operations and novel techniques to prevent oil from spreading and creeping in lubricating applications.Mechanical Tribology is a practical guide for mechanical, industrial, chemical, process, design, and process engineers, materials scientists, and tribologists in the selection of materials, surface treatments, coatings, and environments best suited for a particular industrial application.

Leading readers through an extensive compilation of surface modification reactions and processes for specific tribological results, this reference compiles detailed studies on various residual stresses, reaction processes and mechanisms, heat treatment methods, plasma-based techniques, and more, for a solid understanding of surface structural changes that occur during various engineering procedures. This unique book explores topics previously ignored in other texts on surface engineering and tribology, offers guidelines for the consideration and design of wear life and frictional performance, and sections on laser impingement and nanometer scale surface modification.

The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization presents a detailed account of the CMP process in a language that is suitable for tribology professionals as well as chemists, materials scientists, physicists, and other applied scientists and engineers in fields of semiconductors and microelectronics. The first half of the book is devoted to CMP, while the other focuses on the fundamentals of tribology.As the first source to integrate CMP and tribology, the book illustrates the important role that these fields play in manufacturing and technological development. It follows with an examination of tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects. Other topics covered in depth include basics of friction, flash temperature, lubrication fundamentals, basics of wear, polishing particles, and pad wear. The book concludes its focus with CMP practices, discussing mechanical aspects, pad materials, elastic modulus, and cell buckling.Expanding upon the science and technology of tribology to improve the reliability, maintenance, and wear of technical equipment and other material applications, Tribology in Chemical-Mechanical Planarization provides scientists and engineers with clear foresight to the future of this technology.

Leading readers through an extensive compilation of surface modification reactions and processes for specific tribological results, this reference compiles detailed studies on various residual stresses, reaction processes and mechanisms, heat treatment methods, plasma-based techniques, and more, for a solid understanding of surface structural changes that occur during various engineering procedures. This unique book explores topics previously ignored in other texts on surface engineering and tribology, offers guidelines for the consideration and design of wear life and frictional performance, and sections on laser impingement and nanometer scale surface modification.

Studying the morphology, defects, and wear behavior of a variety of material surfaces, Mechanical Tribology examines popular and emerging surface characterization techniques for assessment of the physical, mechanical, and chemical properties of various modified surfaces, thin films, and coatings.Its chapters explore a wide range of tribological applications while promoting reduced component deterioration and improved efficiency and reliability of mechanical systems. The book includes extensive coverage of critical technologies that are usually absent in other references on the subject, delving into procedures affecting metal cutting and forming, physicochemical issues involved in the design of fiber finishes, and recent progress in biotribological research. It provides strategies to characterize the friction and wear properties of tribological systems and procedures to assess the quality and lifetime of ceramic materials. It also outlines methods to avoid scuffing and seizure in machine operations and novel techniques to prevent oil from spreading and creeping in lubricating applications.Mechanical Tribology is a practical guide for mechanical, industrial, chemical, process, design, and process engineers, materials scientists, and tribologists in the selection of materials, surface treatments, coatings, and environments best suited for a particular industrial application.