Hong Liang – författare

The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization presents a detailed account of the CMP process in a language that is suitable for tribology professionals as well as chemists, materials scientists, physicists, and other applied scientists and engineers in fields of semiconductors and microelectronics. The first half of the book is devoted to CMP, while the other focuses on the fundamentals of tribology.As the first source to integrate CMP and tribology, the book illustrates the important role that these fields play in manufacturing and technological development. It follows with an examination of tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects. Other topics covered in depth include basics of friction, flash temperature, lubrication fundamentals, basics of wear, polishing particles, and pad wear. The book concludes its focus with CMP practices, discussing mechanical aspects, pad materials, elastic modulus, and cell buckling.Expanding upon the science and technology of tribology to improve the reliability, maintenance, and wear of technical equipment and other material applications, Tribology in Chemical-Mechanical Planarization provides scientists and engineers with clear foresight to the future of this technology.

Studying the morphology, defects, and wear behavior of a variety of material surfaces, Mechanical Tribology examines popular and emerging surface characterization techniques for assessment of the physical, mechanical, and chemical properties of various modified surfaces, thin films, and coatings.Its chapters explore a wide range of tribological applications while promoting reduced component deterioration and improved efficiency and reliability of mechanical systems. The book includes extensive coverage of critical technologies that are usually absent in other references on the subject, delving into procedures affecting metal cutting and forming, physicochemical issues involved in the design of fiber finishes, and recent progress in biotribological research. It provides strategies to characterize the friction and wear properties of tribological systems and procedures to assess the quality and lifetime of ceramic materials. It also outlines methods to avoid scuffing and seizure in machine operations and novel techniques to prevent oil from spreading and creeping in lubricating applications.Mechanical Tribology is a practical guide for mechanical, industrial, chemical, process, design, and process engineers, materials scientists, and tribologists in the selection of materials, surface treatments, coatings, and environments best suited for a particular industrial application.

Leading readers through an extensive compilation of surface modification reactions and processes for specific tribological results, this reference compiles detailed studies on various residual stresses, reaction processes and mechanisms, heat treatment methods, plasma-based techniques, and more, for a solid understanding of surface structural changes that occur during various engineering procedures. This unique book explores topics previously ignored in other texts on surface engineering and tribology, offers guidelines for the consideration and design of wear life and frictional performance, and sections on laser impingement and nanometer scale surface modification.

Leading readers through an extensive compilation of surface modification reactions and processes for specific tribological results, this reference compiles detailed studies on various residual stresses, reaction processes and mechanisms, heat treatment methods, plasma-based techniques, and more, for a solid understanding of surface structural changes that occur during various engineering procedures. This unique book explores topics previously ignored in other texts on surface engineering and tribology, offers guidelines for the consideration and design of wear life and frictional performance, and sections on laser impingement and nanometer scale surface modification.

Illustrating their intersecting role in manufacturing and technological development, this book examines tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects as well as friction, lubrication fundamentals, and the basics of wear. The book concludes its focus with mechanical aspects of CMP, pad materials, elastic modulus, and cell buckling. As the first source to integrate CMP and tribology, Tribology in Chemical-Mechanical Planarization provides applied scientists and engineers in the fields of semiconductors and microelectronics with clear foresight to the future of this technology.

Navigating through an extensive compilation of surface modification reactions and processes for specific tribological results, this reference compiles detailed studies, many not found in other texts, on various residual stresses, reaction processes and mechanisms, heat treatment methods, plasma-based techniques, laser impingement, nanometer scale surface modification, and more. Surface Modification and Mechanisms: Friction, Stress, and Reaction Engineering offers guidelines for the consideration and design of wear and frictional performance and provides a unique understanding of surface structural changes that occur during various engineering procedures.

Studying the morphology, defects, and wear behavior of a variety of material surfaces, Mechanical Tribology examines popular and emerging surface characterization techniques for assessment of the physical, mechanical, and chemical properties of various modified surfaces, thin films, and coatings.Its chapters explore a wide range of tribolo

Studying the morphology, defects, and wear behavior of a variety of material surfaces, Mechanical Tribology examines popular and emerging surface characterization techniques for assessment of the physical, mechanical, and chemical properties of various modified surfaces, thin films, and coatings.Its chapters explore a wide range of tribolo

Illustrating their intersecting role in manufacturing and technological development, this book examines tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects as well as friction, lubrication fundamentals, and the basics of wear. The book concludes its focus with mechanical aspects of CMP, pad materials, elastic modulus, and cell buckling. As the first source to integrate CMP and tribology, Tribology in Chemical-Mechanical Planarization provides applied scientists and engineers in the fields of semiconductors and microelectronics with clear foresight to the future of this technology.

This bookconstitutes the refereed proceedings of the workshops held at the 17thAsia-Pacific Web Conference, APWeb 2015, in Guangzhou, China, in September2015.The 15 fullpapers were carefully reviewed and selected from various submissions. The volumepresents the papers that have been accepted for the following workshops: BigData Applications in Telecoms, BDAT 2015, Big Social Data, BSD 2015, and WebData Mining and Applications, WDMA 2015. The papers cover various issues in thearea of the World Wide Web with the underlying technologies and applications.

Das Buch handelt von der Dostojewski-Rezeption im frühen Werk von Karl Barth und Eduard Thurneysen, welche sich in drei wesentliche Phasen gliedern lässt: 1915 bis Frühjahr 1919, Spätjahr 1919 bis 1921 und 1922 bis 1923. In der ersten Phase betrachtet Barth im Zusammenhang seiner Auseinandersetzungen mit dem russischen Bolschewismus Dostojewskis Romane als ideale Verkörperung der extremen russischen Mentalität. Ab dem Spätjahr 1919 entwickeln er und Thurneysen gemeinsam eine neue Lesart, die sie vom Denkschema "Dostojewski-Russland" befreit: Dostojewski stelle das menschliche Leben als Leben unter Gericht und Gnade Gottes dar. Die Rekonstruktion der zweiten Phase konzentriert sich auf die Entstehung dieser theologischen Lebensthematik, die der Parallelität zwischen Barths Römerbriefkommentar (1922) und Thurneysens Dostojewski-Studie (1921) zugrunde liegt. In der dritten Phase hat sich diese lebenstheologische Lesart beider Theologen weiter entwickelt und verfestigt. Das Buch zielt darauf, die Eschatologie des Römerbriefkommentars mithilfe von Barths und Thurneysens Dostojewski-Rezeption aufs neue darzustellen. Es zeigt sich, dass der berühmte Anspruch "Gott ist Gott" im Römerbriefkommentar nicht nur die Transzendenz Gottes, sondern v. a. dessen Treue sowie "jenseitige Sinngebung" (Barth) des menschlichen Lebens bedeutet.

The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization presents a detailed account of the CMP process in a language that is suitable for tribology professionals as well as chemists, materials scientists, physicists, and other applied scientists and engineers in fields of semiconductors and microelectronics. The first half of the book is devoted to CMP, while the other focuses on the fundamentals of tribology.As the first source to integrate CMP and tribology, the book illustrates the important role that these fields play in manufacturing and technological development. It follows with an examination of tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects. Other topics covered in depth include basics of friction, flash temperature, lubrication fundamentals, basics of wear, polishing particles, and pad wear. The book concludes its focus with CMP practices, discussing mechanical aspects, pad materials, elastic modulus, and cell buckling.Expanding upon the science and technology of tribology to improve the reliability, maintenance, and wear of technical equipment and other material applications, Tribology in Chemical-Mechanical Planarization provides scientists and engineers with clear foresight to the future of this technology.