Ibrahim (Abe) M. Elfadel – författare
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20 produkter
Machine Learning in VLSI Computer-Aided Design
Av Ibrahim (Abe) M. Elfadel, Duane S. Boning m. fl.
Inbunden, 2019
2198 kr
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This book provides readers with an up-to-date account of the use of machine learning frameworks, methodologies, algorithms and techniques in the context of computer-aided design (CAD) for very-large-scale integrated circuits (VLSI). Coverage includes the various machine learning methods used in …
Machine Learning in VLSI Computer-Aided Design
Av Xin Li, Duane S. Boning m. fl.
E-bok, 2019
2833 kr
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This book provides readers with an up-to-date account of the use of machine learning frameworks, methodologies, algorithms and techniques in the context of computer-aided design (CAD) for very-large-scale integrated circuits (VLSI). Coverage includes the various machine learning methods used in …
IoT Physical Layer
Design and Implementation
Av Ibrahim (Abe) M. Elfadel, Mohammed Ismail
Häftad, 2019
1425 kr
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This book documents some of the most recent advances on the physical layer of the Internet of Things (IoT), including sensors, circuits, and systems. The application area selected for illustrating these advances is that of autonomous, wearable systems for real-time medical diagnosis. The book is …
VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23–25, 2017, Revised and Extended Selected Papers
Av Michail Maniatakos, Ibrahim (Abe) M. Elfadel m. fl.
Inbunden, 2019
886 kr
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This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017. The 11 papers included in this book were carefully reviewed …
VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23–25, 2017, Revised and Extended Selected Papers
Av Ricardo Reis, Jose Monteiro m. fl.
E-bok, 2019
839 kr
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This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017. The 11 papers included in this book were carefully reviewed …
VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23–25, 2017, Revised and Extended Selected Papers
Av Michail Maniatakos, Ibrahim (Abe) M. Elfadel m. fl.
Häftad, 2020
627 kr
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This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017. The 11 papers included in this book were carefully reviewed …
Secure, Low-Power IoT Communication Using Edge-Coded Signaling
Av Shahzad Muzaffar, Ibrahim (Abe) M. Elfadel
Inbunden, 2022
934 kr
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This book discusses single-channel, device-to-device communication in the Internet of Things (IoT) at the signal encoding level and introduces a new family of encoding techniques that result in significant simplifications of the communication circuitry. These simplifications translate into lower …
Secure, Low-Power IoT Communication Using Edge-Coded Signaling
Av Ibrahim (Abe) M. Elfadel, Shahzad Muzaffar
E-bok, 2022
1188 kr
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This book discusses single-channel, device-to-device communication in the Internet of Things (IoT) at the signal encoding level and introduces a new family of encoding techniques that result in significant simplifications of the communication circuitry. These simplifications translate into lower …
Secure, Low-Power IoT Communication Using Edge-Coded Signaling
Av Shahzad Muzaffar, Ibrahim (Abe) M. Elfadel
Häftad, 2023
934 kr
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This book discusses single-channel, device-to-device communication in the Internet of Things (IoT) at the signal encoding level and introduces a new family of encoding techniques that result in significant simplifications of the communication circuitry. These simplifications translate into lower …
Tapered Beams in MEMS
A Symbolic Modeling Framework with Applications to Energy Harvesting
Av Wajih U. Syed, Ibrahim (Abe) M. Elfadel
Inbunden, 2024
938 kr
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This book addresses important aspects of MEMS designs that are well established in engineering practice but rarely discussed in the standard textbooks. One such aspect is the ubiquitous use of tapered beams in the sensing and actuation elements of MEMS designs. As explained in this book, the …
Tapered Beams in MEMS
A Symbolic Modeling Framework with Applications to Energy Harvesting
Av Ibrahim (Abe) M. Elfadel, Wajih U. Syed
E-bok, 2024
1184 kr
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This book addresses important aspects of MEMS designs that are well established in engineering practice but rarely discussed in the standard textbooks. One such aspect is the ubiquitous use of tapered beams in the sensing and actuation elements of MEMS designs. As explained in this book, the …
Tapered Beams in MEMS
A Symbolic Modeling Framework with Applications to Energy Harvesting
Av Wajih U. Syed, Ibrahim (Abe) M. Elfadel
Häftad, 2025
664 kr
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This book addresses important aspects of MEMS designs that are well established in engineering practice but rarely discussed in the standard textbooks. One such aspect is the ubiquitous use of tapered beams in the sensing and actuation elements of MEMS designs. As explained in this book, the …
VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence
31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16–18, 2023, Revised Extended Selected Papers
Av Ibrahim (Abe) M. Elfadel, Lutfi Albasha
Inbunden, 2024
967 kr
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This book contains revised and extended versions of a selection of papers presented at the 31st IFIP WG 10.5/IEEE International Conference on the theme of VLSI-SoC Innovations for Trustworthy Artificial Intelligence, VLSI-SoC 2023, held in Sharjah, United Arab Emirates, during October 16–18, …
VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence
31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16–18, 2023, Revised Extended Selected Papers
Av Lutfi Albasha, Ibrahim (Abe) M. Elfadel
E-bok, 2024
1251 kr
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This book contains revised and extended versions of a selection of papers presented at the 31st IFIP WG 10.5/IEEE International Conference on the theme of VLSI-SoC Innovations for Trustworthy Artificial Intelligence, VLSI-SoC 2023, held in Sharjah, United Arab Emirates, during October 16–18, 2023. …
VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence
31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16–18, 2023, Revised Extended Selected Papers
Av Ibrahim (Abe) M. Elfadel, Lutfi Albasha
Häftad, 2025
967 kr
Lägg i varukorg
This book contains revised and extended versions of a selection of papers presented at the 31st IFIP WG 10.5/IEEE International Conference on the theme of VLSI-SoC Innovations for Trustworthy Artificial Intelligence, VLSI-SoC 2023, held in Sharjah, United Arab Emirates, during October 16–18, …
3D Stacked Chips
From Emerging Processes to Heterogeneous Systems
Av Ibrahim (Abe) M. Elfadel, Gerhard Fettweis
Inbunden, 2016
552 kr
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This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus …
3D Stacked Chips
From Emerging Processes to Heterogeneous Systems
Av Gerhard Fettweis, Ibrahim (Abe) M. Elfadel
E-bok, 2016
734 kr
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This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus …
3D Stacked Chips
From Emerging Processes to Heterogeneous Systems
Av Ibrahim (Abe) M. Elfadel, Gerhard Fettweis
Häftad, 2018
555 kr
Lägg i varukorg
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus …
IoT Physical Layer
Design and Implementation
Av Ibrahim (Abe) M. Elfadel, Mohammed Ismail
Inbunden, 2018
1098 kr
Lägg i varukorg
This book documents some of the most recent advances on the physical layer of the Internet of Things (IoT), including sensors, circuits, and systems. The application area selected for illustrating these advances is that of autonomous, wearable systems for real-time medical diagnosis. The book is …
IoT Physical Layer
Design and Implementation
Av Mohammed Ismail, Ibrahim (Abe) M. Elfadel
E-bok, 2018
1427 kr
Lägg i varukorg
This book documents some of the most recent advances on the physical layer of the Internet of Things (IoT), including sensors, circuits, and systems. The application area selected for illustrating these advances is that of autonomous, wearable systems for real-time medical diagnosis. The book is …
