Ibrahim (Abe) M. Elfadel - Böcker
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11 produkter
11 produkter
2 107 kr
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This book provides readers with an up-to-date account of the use of machine learning frameworks, methodologies, algorithms and techniques in the context of computer-aided design (CAD) for very-large-scale integrated circuits (VLSI). Coverage includes the various machine learning methods used in lithography, physical design, yield prediction, post-silicon performance analysis, reliability and failure analysis, power and thermal analysis, analog design, logic synthesis, verification, and neuromorphic design. Provides up-to-date information on machine learning in VLSI CAD for device modeling, layout verifications, yield prediction, post-silicon validation, and reliability;Discusses the use of machine learning techniques in the context of analog and digital synthesis;Demonstrates how to formulate VLSI CAD objectives as machine learning problems and provides a comprehensive treatment of their efficient solutions;Discusses the tradeoff between the cost of collecting data and prediction accuracy and provides a methodology for using prior data to reduce cost of data collection in the design, testing and validation of both analog and digital VLSI designs.From the Foreword As the semiconductor industry embraces the rising swell of cognitive systems and edge intelligence, this book could serve as a harbinger and example of the osmosis that will exist between our cognitive structures and methods, on the one hand, and the hardware architectures and technologies that will support them, on the other….As we transition from the computing era to the cognitive one, it behooves us to remember the success story of VLSI CAD and to earnestly seek the help of the invisible hand so that our future cognitive systems are used to design more powerful cognitive systems. This book is very much aligned with this on-going transition from computing to cognition, and it is with deep pleasure thatI recommend it to all those who are actively engaged in this exciting transformation.Dr. Ruchir Puri, IBM Fellow, IBM Watson CTO & Chief Architect, IBM T. J. Watson Research Center
1 385 kr
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This book documents some of the most recent advances on the physical layer of the Internet of Things (IoT), including sensors, circuits, and systems. The book is unique in that it adopts a holistic view of such systems and includes not only the sensor and processing subsystems, but also the power, communication, and security subsystems.
863 kr
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This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017.
608 kr
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This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017.
913 kr
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This book discusses single-channel, device-to-device communication in the Internet of Things (IoT) at the signal encoding level and introduces a new family of encoding techniques that result in significant simplifications of the communication circuitry.
908 kr
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This book discusses single-channel, device-to-device communication in the Internet of Things (IoT) at the signal encoding level and introduces a new family of encoding techniques that result in significant simplifications of the communication circuitry.
Tapered Beams in MEMS
A Symbolic Modeling Framework with Applications to Energy Harvesting
Inbunden, Engelska, 2024
908 kr
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This book addresses important aspects of MEMS designs that are well established in engineering practice but rarely discussed in the standard textbooks.
Del 680 - IFIP Advances in Information and Communication Technology
VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence
31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16–18, 2023, Revised Extended Selected Papers
Inbunden, Engelska, 2024
935 kr
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This book contains revised and extended versions of a selection of papers presented at the 31st IFIP WG 10.5/IEEE International Conference on the theme of VLSI-SoC Innovations for Trustworthy Artificial Intelligence, VLSI-SoC 2023, held in Sharjah, United Arab Emirates, during October 16–18, 2023.The 15 full papers included in this volume were carefully revised and expanded from 77 papers submitted to the conference. This edited volume has been organized into four parts: architectures; accelerators; resiliency and robustness; and security and privacy - and is representing cutting-edge research at the forefront of VLSI technology.
540 kr
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This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
540 kr
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This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.
1 073 kr
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This book documents some of the most recent advances on the physical layer of the Internet of Things (IoT), including sensors, circuits, and systems. The application area selected for illustrating these advances is that of autonomous, wearable systems for real-time medical diagnosis. The book is unique in that it adopts a holistic view of such systems and includes not only the sensor and processing subsystems, but also the power, communication, and security subsystems. Particular attention is paid to the integration of these IoT subsystems as well as the prototyping platforms needed for achieving such integration. Other unique features include the discussion of energy-harvesting subsystems to achieve full energy autonomy and the consideration of hardware security as a requirement for the integrity of the IoT physical layer. One unifying thread of the various designs considered in this book is that they have all been fabricated and tested in an advanced, low-power CMOS process, namely GLOBALFOUNDRIES 65nm CMOS LPe.