Katsuyuki Sakuma – författare
Visar alla böcker från författaren Katsuyuki Sakuma. Handla med fri frakt och snabb leverans.
8 produkter
Flexible, Wearable, and Stretchable Electronics
Inbunden, 2020
2144 kr
Lägg i varukorg
Remarkable progress has been achieved within recent years in developing flexible, wearable, and stretchable (FWS) electronics. These electronics will play an increasingly significant role in the future of electronics and will open new product paradigms that conventional semiconductors are not …
Flexible, Wearable, and Stretchable Electronics
Häftad, 2022
871 kr
Lägg i varukorg
Remarkable progress has been achieved within recent years in developing flexible, wearable, and stretchable (FWS) electronics. These electronics will play an increasingly significant role in the future of electronics and will open new product paradigms that conventional semiconductors are not …
Flexible, Wearable, and Stretchable Electronics
E-bok, 2020
1052 kr
Lägg i varukorg
Remarkable progress has been achieved within recent years in developing flexible, wearable, and stretchable (FWS) electronics. These electronics will play an increasingly significant role in the future of electronics and will open new product paradigms that conventional semiconductors are not …
Flexible, Wearable, and Stretchable Electronics
E-bok, 2020
1052 kr
Lägg i varukorg
Remarkable progress has been achieved within recent years in developing flexible, wearable, and stretchable (FWS) electronics. These electronics will play an increasingly significant role in the future of electronics and will open new product paradigms that conventional semiconductors are not …
3D Integration in VLSI Circuits
Implementation Technologies and Applications
Häftad, 2021
929 kr
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Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to …
3D Integration in VLSI Circuits
Implementation Technologies and Applications
Inbunden, 2018
2759 kr
Lägg i varukorg
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to …
3D Integration in VLSI Circuits
Implementation Technologies and Applications
E-bok, 2018
1091 kr
Lägg i varukorg
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to …
3D Integration in VLSI Circuits
Implementation Technologies and Applications
E-bok, 2018
1091 kr
Lägg i varukorg
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to …
