Marija Kosec – författare
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5 produkter
Electronic Packaging for High Reliability, Low Cost Electronics
Av R.R. Tummala, Marija Kosec m. fl.
Inbunden, 2000
1643 kr
Lägg i varukorg
Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, …
Chemical Solution Deposition of Functional Oxide Thin Films
Av Theodor Schneller, Rainer Waser m. fl.
Inbunden, 2014
2194 kr
Lägg i varukorg
This is the first text to cover all aspects of solution processed functional oxide thin-films. Chemical Solution Deposition (CSD) comprises all solution based thin- film deposition techniques, which involve chemical reactions of precursors during the formation of the oxide films, i. e. sol-gel type …
Chemical Solution Deposition of Functional Oxide Thin Films
Av David Payne, Marija Kosec m. fl.
E-bok, 2014
2833 kr
Lägg i varukorg
This is the first text to cover all aspects of solution processed functional oxide thin-films. Chemical Solution Deposition (CSD) comprises all solution based thin- film deposition techniques, which involve chemical reactions of precursors during the formation of the oxide films, i. e. sol-gel type …
Chemical Solution Deposition of Functional Oxide Thin Films
Av Theodor Schneller, Rainer Waser m. fl.
Häftad, 2016
2188 kr
Lägg i varukorg
This is the first text to cover all aspects of solution processed functional oxide thin-films. Chemical Solution Deposition (CSD) comprises all solution based thin- film deposition techniques, which involve chemical reactions of precursors during the formation of the oxide films, i. e. sol-gel type …
Electronic Packaging for High Reliability, Low Cost Electronics
Av R.R. Tummala, Marija Kosec m. fl.
Häftad, 2010
1643 kr
Lägg i varukorg
Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, …