Oliver Brand - Böcker

This work presents a packaged ultrasound microsystem for object detection and distance metering based on micromachined silicon transducer elements. It describes the characterization, optimization and the long-term stability of silicon membrane resonators as well as appropriate packaging for ultrasound microsystems. It also describes a cost-effective approach to the realization of a micro electro mechanical system (MEMS). The micromachined silicon transducer elements were fabricated using industrial IC technology combined with standard silicon micromachining techniques. Additionally, this approach allows the cointegration of the driving and read-out circuitry. To ensure the industrial applicability of the fabricated transducer elements intensive long-term stability and reliability tests were performed under various environmental conditions such as high temperature and humidity. Great effort was undertaken to investigate the packaging and housing of the ultrasound system, which mainly determine the success or failure of an industrial microsystem. A low-stress mounting of the transducer element minimizes thermomechanical stress influences.The developed housing not only protects the silicon chip but also improves the acoustic performance of the transducer elements. The developed ultrasound proximity sensor system can determine object distances up to 10 cm with an accuracy of better than 0.8 mm. It should be of interest to MEMS researchers as well as those involved in solid-state sensor development.

Micromachined Ultrasound-Based Proximity Sensors presents a packaged ultrasound microsystem for object detection and distance metering based on micromachined silicon transducer elements. It describes the characterization, optimization and the long-term stability of silicon membrane resonators as well as appropriate packaging for ultrasound microsystems. Micromachined Ultrasound-Based Proximity Sensors describes a cost-effective approach to the realization of a micro electro mechanical system (MEMS). The micromachined silicon transducer elements were fabricated using industrial IC technology combined with standard silicon micromachining techniques. Additionally, this approach allows the cointegration of the driving and read-out circuitry. To ensure the industrial applicability of the fabricated transducer elements intensive long-term stability and reliability tests were performed under various environmental conditions such as high temperature and humidity. Great effort was undertaken to investigate the packaging and housing of the ultrasound system, which mainly determine the success or failure of an industrial microsystem. A low-stress mounting of the transducer element minimizes thermomechanical stress influences. The developed housing not only protects the silicon chip but also improves the acoustic performance of the transducer elements. The developed ultrasound proximity sensor system can determine object distances up to 10 cm with an accuracy of better than 0.8 mm. Micromachined Ultrasound-Based Proximity Sensors will be of interest to MEMS researchers as well as those involved in solid-state sensor development.

Band 2 behandelt die §§ 19 – 73 VVG.

Das englische Zinsrecht bereitet dem ausländischen Rechtsanwender aufgrund seiner Einzigartigkeit immer wieder Schwierigkeiten. Das ist problematisch, weil englisches Recht im internationalen Wirtschaftsverkehr noch heute besonders häufig zur Anwendung kommt. Oliver Brand untersucht Aufkommen und Berechtigung der oft fremden englischen Rechtsfiguren unter juristischen, ökonomischen und historischen Gesichtspunkten. Er würdigt Literatur, Rechtsprechung und Gesetzgebung (insb. Interest Act 1998) und veranschaulicht durch Beispielsfälle das englische Recht der Fremdwährungsschulden sowie das englische Zinskollisionsrecht. Rechtsphilosophische und politische Erwägungen verdeutlichen die uns fremde Motivlage, wobei der Umgang mit Zinsverboten, wucherischen Zinsen und Zinseszinsen sowie internationalrechtliche Probleme des Verzugszinses im Vordergrund stehen. Es zeigt sich, daß das englische Zinsrecht nicht isoliert betrachtet werden kann, da es sich in einem Macht- und Wettbewerbsgefüge zwischen US-amerikanischem und kontinentaleuropäischem Recht bewegt. Die Mitgliedschaft Großbritanniens in der EU und das Aufkommen Internationalen Einheitsrechts (CISG) sowie globaler Kommunikationsstrukturen (Internet) verschärfen den Problemdruck. Der Autor zeichnet die vielschichtigen Konflikte zwischen einem nationalen Zinsrecht und seinen internationalen Bezügen nach und weist mit einem rechtsvergleichenden Seitenblick Lösungswege für das englische Recht auf. Dabei tun sich auch für ungelöste Grundprobleme des deutschen Kollisionsrechts (gemeineuropäische) Lösungen auf.

Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.