Selahattin Sayil - Böcker

This textbook provides readers with a comprehensive introduction to various noise sources that significantly reduce performance and reliability in nanometer-scale integrated circuits. The author covers different types of noise, such as crosstalk noise caused by signal switching of adjacent wires, power supply noise or IR voltage drop in the power line due to simultaneous buffer / gate switching events, substrate coupling noise, radiation-induced transients, thermally induced noise and noise due to process and environmental Coverages also includes the relationship between some of these noise sources, as well as compound effects, and modeling and mitigation of noise mechanisms.

This textbook provides readers with a comprehensive introduction to various noise sources that significantly reduce performance and reliability in nanometer-scale integrated circuits. The author covers different types of noise, such as crosstalk noise caused by signal switching of adjacent wires, power supply noise or IR voltage drop in the power line due to simultaneous buffer / gate switching events, substrate coupling noise, radiation-induced transients, thermally induced noise and noise due to process and environmental Coverages also includes the relationship between some of these noise sources, as well as compound effects, and modeling and mitigation of noise mechanisms.

This book introduces readers to various radiation soft-error mechanisms such as soft delays, radiation induced clock jitter and pulses, and single event (SE) coupling induced effects. In addition to discussing various radiation hardening techniques for combinational logic, the author also describes new mitigation strategies targeting commercial designs. Coverage includes novel soft error mitigation techniques such as the Dynamic Threshold Technique and Soft Error Filtering based on Transmission gate with varied gate and body bias. The discussion also includes modeling of SE crosstalk noise, delay and speed-up effects. Various mitigation strategies to eliminate SE coupling effects are also introduced. Coverage also includes the reliability of low power energy-efficient designs and the impact of leakage power consumption optimizations on soft error robustness. The author presents an analysis of various power optimization techniques, enabling readers to make design choices that reduce static power consumption and improve soft error reliability at the same time.

This book provides readers with a comprehensive overview of the state-of-the-art in optical contactless probing approaches, in order to fill a gap in the literature on VLSI Testing.  The author highlights the inherent difficulties encountered with the mechanical probe and testability design approaches for functional and internal fault testing and shows how contactless testing might resolve many of the challenges associated with conventional mechanical wafer testing. The techniques described in this book address the increasing demands for internal access of the logic state of a node within a chip under test.

This book introduces readers to various radiation soft-error mechanisms such as soft delays, radiation induced clock jitter and pulses, and single event (SE) coupling induced effects.