Wei-Ting Kary Chien – författare
Visar alla böcker från författaren Wei-Ting Kary Chien. Handla med fri frakt och snabb leverans.
3 produkter
3 produkter
Reliability, Yield, and Stress Burn-In
A Unified Approach for Microelectronics Systems Manufacturing & Software Development
Inbunden, Engelska, 1998
1 588 kr
Skickas inom 10-15 vardagar
This text explains reliability issues in microelectronics systems manufacturing and software development with an emphasis on evolving manufacturing technology for the semiconductor industry. Since most microelectronics components have an infant mortality period of about one year under ordinary operating conditions, and many modern systems, such as PCs, are heavily used in the first few years, the reliability problem in the infant mortality period becomes extremely important. Burn-in is an accelerated screening procedure that eliminates infant mortalities early on in the shop before shipping out the products to the customers. This book should also help readers to analyze systems that exhibit high failure rate during a long infant mortality period. The text presents ways to systematically analyze burn-in policy at the component, sub-system, and system levels. Various statistical methods are addressed including parametric, nonparametric, and Bayesian approaches. Many case studies are introduced in combination with the developed theories. Included in the book is an introduction to software reliability.The book should help manufacturers and system designers to understand and to design a more reliable product given constraints specified by the users and designers. An understanding of the infant mortality period may solve many reliability problems, including those faced in the semiconductor industry and software industry.
Reliability, Yield, and Stress Burn-In
A Unified Approach for Microelectronics Systems Manufacturing & Software Development
Häftad, Engelska, 2014
1 588 kr
Skickas inom 10-15 vardagar
The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: • the economic impact of employing the microelectronics fabricated by in dustry, • a study of the relationship between reliability and yield, • the progression toward miniaturization and higher reliability, and • the correctness and complexity of new system designs, which include a very significant portion of software.
2 894 kr
Kommande
This book is a definitive guide to improving yield and reliability in the modern semiconductor industry. Blending academic research with industrial expertise, it unveils the innovative Build-In Reliability (BIR) platform.The book consists of 20 chapters, organized into four technical parts, deep diving into operational excellence and future perspectives. It emphasizes BIR’s core components—Wafer-Level Reliability (WLR) and the AI-enhanced Build-In Reliability Diagnosis System (BIRDS), a knowledge-based tool designed to enable early detection of non-conformance.Part 1 introduces the BIR framework. Subsequent parts address completeness and timeliness, which are essential for establishing robust systems to enhance yield and reliability. Part 4 discusses emerging trends, including 3D packaging technologies (e.g., CoWoS), neural network-driven reliability predictions, Prognostic Health Management (PHM) for predictive maintenance, and the strategic importance of Diversity, Equity, and Inclusion (DEI) and globalization in overcoming industry challenges.This book covers a wide range of topics, including logic devices (down to 2nm), volatile and non-volatile memory tests, laboratory management, tool design, integrated circuit (IC) qualification, supplier and consumables management, statistical process control (SPC), and a novel multi-level quality and reliability training and certification framework. It also addresses the development of exceptionally reliable automotive chips, system-level lean methodologies, and optimization strategies, with a focus on yield-reliability and performance-cost trade-offs for value engineering.Complex concepts are elucidated through 51 real-world case studies, derived from decades of industry experience. These case studies emphasize root cause analysis, timely corrective actions, and innovative methodologies. Vivid figures, flowcharts, and tables are used extensively to enhance clarity and minimize reliance on complex mathematics. Each part concludes with 20 key takeaways to reinforce core insights.An indispensable resource for practitioners, researchers, and students, this book provides actionable strategies and advanced solutions for semiconductor manufacturing. It is the only comprehensive guide available today to bridge advanced academic research with real-world industrial applications in nanoelectronics manufacturing.