As the selection of material for particular engineering properties becomes increasingly important in keeping costs down, methods for evaluating material properties also become more relevant. One such method examines the geometry of grain boundaries, which reveals much about the properties of the material.Studying material properties from their geometrical measurements, The Measurement of Grain Boundary Geometry provides a framework for a specialized application of electron microscopy for metals and alloys and, by extension, for ceramics, minerals, and semiconductors. The book presents an overview of the developments in the theory of grain boundary geometry and its practical applications in material engineering. It also covers the tunneling electron microscope (TEM), experimental aspects of data collection, data processing, and examples from actual investigations. Each step of the analysis process is clearly described, from data collection through processing, analysis, representation, and display to applications. The book also includes a glossary of terms.Exploring both the experimental and analytical aspects of the subject, this practical reference guide is essential for researchers and students involved in material properties, whether in physics, materials science, metallurgy, or physical chemistry.

Electron Microscopy of Interfaces in Metals and Alloys examines the structure of interfaces in metals and alloys using transmission electron microscopy. The book presents quantitative methods of analysis and reviews the most significant work on interface structure over the last 20 years. It provides the first book description of the methods used for quantitative identification of Burgers vectors of interfacial dislocations, including the geometric analysis of periodicities in interface structure and the comparison of experimental and theoretical electron micrographs. The book explores low- and high-angle grain boundaries and interphase interfaces between neighboring grains, emphasizing interfacial dislocations and rigid-body displacements to the structure and properties of interfaces. It also analyzes the use of two-beam images and diffraction patterns for analysis and studies n-beam lattice imaging. The book includes numerous worked examples of the analysis of the structure of grain boundaries and interphase interfaces, which are particularly useful to those who need to consider the nature of intercrystalline interfaces.

As the selection of material for particular engineering properties becomes increasingly important in keeping costs down, methods for evaluating material properties also become more relevant. One such method examines the geometry of grain boundaries, which reveals much about the properties of the material.Studying material properties from their geometrical measurements, The Measurement of Grain Boundary Geometry provides a framework for a specialized application of electron microscopy for metals and alloys and, by extension, for ceramics, minerals, and semiconductors. The book presents an overview of the developments in the theory of grain boundary geometry and its practical applications in material engineering. It also covers the tunneling electron microscope (TEM), experimental aspects of data collection, data processing, and examples from actual investigations. Each step of the analysis process is clearly described, from data collection through processing, analysis, representation, and display to applications. The book also includes a glossary of terms.Exploring both the experimental and analytical aspects of the subject, this practical reference guide is essential for researchers and students involved in material properties, whether in physics, materials science, metallurgy, or physical chemistry.

Topics in Electron Diffraction and Microscopy of Materials celebrates the retirement of Professor Michael Whelan from the University of Oxford. Professor Whelan taught many of today's heads of department and was a pioneer in the development and use of electron microscopy. His collaborators and colleagues, each one of whom has made important advances in the use of microscopy to study materials, have contributed to this cohesive work.The book provides a useful overview of current applications for selected electron microscope techniques that have become important and widespread in their use for furthering our understanding of how materials behave. Linked through the dynamical theory of electron diffraction and inelastic scattering, the topics discussed include the history and impact of electron microscopy in materials science, weak-beam techniques for problem solving, defect structures and dislocation interactions, using beam diffraction patterns to look at defects in structures, obtaining chemical identification at atomic resolution, theoretical developments in backscattering channeling patterns, new ways to look at atomic bonds, using numerical simulations to look at electronic structure of crystals, RHEED observations for MBE growth, and atomic level imaging applications.

Characterization of Radiation Damage by Transmission Electron Microscopy details the electron microscopy methods used to investigate complex and fine-scale microstructures, such as those produced by fast-particle irradiation of metals or ion implantation of semiconductors. The book focuses on the methods used to characterize small point-defect clusters, such as dislocation loops, because the coverage in general microscopy textbooks is limited and omits many of the problems associated with the analysis of these defects. The book also describes in situ, high-resolution, and analytical techniques. Techniques are illustrated with examples, providing a solid overview of the contribution of TEM to radiation damage mechanisms. The book is most useful to researchers in, or entering into, the field of defect analysis in materials.

As the selection of material for particular engineering properties becomes increasingly important in keeping costs down, methods for evaluating material properties also become more relevant. One such method examines the geometry of grain boundaries, which reveals much about the properties of the material.Studying material properties from their geometrical measurements, The Measurement of Grain Boundary Geometry provides a framework for a specialized application of electron microscopy for metals and alloys and, by extension, for ceramics, minerals, and semiconductors. The book presents an overview of the developments in the theory of grain boundary geometry and its practical applications in material engineering. It also covers the tunneling electron microscope (TEM), experimental aspects of data collection, data processing, and examples from actual investigations. Each step of the analysis process is clearly described, from data collection through processing, analysis, representation, and display to applications. The book also includes a glossary of terms.Exploring both the experimental and analytical aspects of the subject, this practical reference guide is essential for researchers and students involved in material properties, whether in physics, materials science, metallurgy, or physical chemistry.

Electron Microscopy of Interfaces in Metals and Alloys examines the structure of interfaces in metals and alloys using transmission electron microscopy. The book presents quantitative methods of analysis and reviews the most significant work on interface structure over the last 20 years. It provides the first book description of the methods used for quantitative identification of Burgers vectors of interfacial dislocations, including the geometric analysis of periodicities in interface structure and the comparison of experimental and theoretical electron micrographs. The book explores low- and high-angle grain boundaries and interphase interfaces between neighboring grains, emphasizing interfacial dislocations and rigid-body displacements to the structure and properties of interfaces. It also analyzes the use of two-beam images and diffraction patterns for analysis and studies n-beam lattice imaging. The book includes numerous worked examples of the analysis of the structure of grain boundaries and interphase interfaces, which are particularly useful to those who need to consider the nature of intercrystalline interfaces.

As the selection of material for particular engineering properties becomes increasingly important in keeping costs down, methods for evaluating material properties also become more relevant. One such method examines the geometry of grain boundaries, which reveals much about the properties of the material.Studying material properties from their geometrical measurements, The Measurement of Grain Boundary Geometry provides a framework for a specialized application of electron microscopy for metals and alloys and, by extension, for ceramics, minerals, and semiconductors. The book presents an overview of the developments in the theory of grain boundary geometry and its practical applications in material engineering. It also covers the tunneling electron microscope (TEM), experimental aspects of data collection, data processing, and examples from actual investigations. Each step of the analysis process is clearly described, from data collection through processing, analysis, representation, and display to applications. The book also includes a glossary of terms.Exploring both the experimental and analytical aspects of the subject, this practical reference guide is essential for researchers and students involved in material properties, whether in physics, materials science, metallurgy, or physical chemistry.

Topics in Electron Diffraction and Microscopy of Materials celebrates the retirement of Professor Michael Whelan from the University of Oxford. Professor Whelan taught many of today's heads of department and was a pioneer in the development and use of electron microscopy. His collaborators and colleagues, each one of whom has made important advances in the use of microscopy to study materials, have contributed to this cohesive work.The book provides a useful overview of current applications for selected electron microscope techniques that have become important and widespread in their use for furthering our understanding of how materials behave. Linked through the dynamical theory of electron diffraction and inelastic scattering, the topics discussed include the history and impact of electron microscopy in materials science, weak-beam techniques for problem solving, defect structures and dislocation interactions, using beam diffraction patterns to look at defects in structures, obtaining chemical identification at atomic resolution, theoretical developments in backscattering channeling patterns, new ways to look at atomic bonds, using numerical simulations to look at electronic structure of crystals, RHEED observations for MBE growth, and atomic level imaging applications.

Characterization of Radiation Damage by Transmission Electron Microscopy details the electron microscopy methods used to investigate complex and fine-scale microstructures, such as those produced by fast-particle irradiation of metals or ion implantation of semiconductors. The book focuses on the methods used to characterize small point-defect clusters, such as dislocation loops, because the coverage in general microscopy textbooks is limited and omits many of the problems associated with the analysis of these defects. The book also describes in situ, high-resolution, and analytical techniques. Techniques are illustrated with examples, providing a solid overview of the contribution of TEM to radiation damage mechanisms. The book is most useful to researchers in, or entering into, the field of defect analysis in materials.