Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Inbunden, Engelska, 2015

Del i serien Woodhead Publishing Series in Electronic and Optical Materials

1 945 kr

Beställningsvara. Skickas inom 10-15 vardagar. Fri frakt över 249 kr.

Beskrivning

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.

The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.

The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.

Discusses how the reliability of packaging components is a prime concern to electronics manufacturers
Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques
Includes program files and macros for additional study

Produktinformation

Utgivningsdatum:2015-05-22
Mått:152 x 229 x 0 mm
Vikt:830 g
Format:Inbunden
Språk:Engelska
Serie:Woodhead Publishing Series in Electronic and Optical Materials
Antal sidor:482
Förlag:Elsevier Science
ISBN:9781845695286

Utforska kategorier

Elektronik och kommunikationer inom Naturvetenskap och teknik

Mer om författaren

Dr Yiu-Wing Mai is Chair and Professor of Mechanical Engineering at the University of Sydney, Australia

Innehållsförteckning

Temperature induced failureMoisture induced failureMechanical shock induced failureAdhesive interconnects and viscoelasticityConcluding remarksPrograms and macro filesTemperature induced failureMoisture induced failureMechanical induced failure