Y.-W. Mai – författare

Science and Engineering of Short Fibre Reinforced Polymer Composites, Second Edition, provides the latest information on the 'short fiber reinforced composites' (SFRP) that have found extensive applications in automobiles, business machines, durable consumer items, sporting goods and electrical industries due to their low cost, easy processing and superior mechanical properties over parent polymers. This updated edition presents new developments in this field of research and includes new chapters on electrical conductivity, structural monitoring, functional properties, self-healing, finite element method techniques, multi-scale SFRCs, and both modern computational and process engineering methods.

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.

The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.

The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.