Woodhead Publishing Series in Electronic and Optical Materials – serie

Polymer Optical Fibres: Fibre Types, Materials, Fabrication, Characterization, and Applications explores polymer optical fibers, specifically their materials, fabrication, characterization, measurement techniques, and applications. Optical effects, including light propagation, degrading effects of attenuation, scattering, and dispersion, are explained. Other important parameters like mechanical strength, operating temperatures, and processability are also described. Polymer optical fibers (POF) have a number of advantages over glass fibers, such as low cost, flexibility, low weight, electromagnetic immunity, good bandwidth, simple installation, and mechanical stability.

Provides systematic and comprehensive coverage of materials, fabrication, properties, measurement techniques, and applications of POF Focuses on industry needs in communication, illumination and sensors, the automotive industry, and medical and biotechnology Features input from leading experts in POF technology, with experience spanning optoelectronics, polymer, and textiles Explains optical effects, including light propagation, degrading effects of attenuation, scattering, and dispersion

Materials Characterization Using Nondestructive Evaluation (NDE) Methods discusses NDT methods and how they are highly desirable for both long-term monitoring and short-term assessment of materials, providing crucial early warning that the fatigue life of a material has elapsed, thus helping to prevent service failures.

Materials Characterization Using Nondestructive Evaluation (NDE) Methods gives an overview of established and new NDT techniques for the characterization of materials, with a focus on materials used in the automotive, aerospace, power plants, and infrastructure construction industries.

Each chapter focuses on a different NDT technique and indicates the potential of the method by selected examples of applications. Methods covered include scanning and transmission electron microscopy, X-ray microtomography and diffraction, ultrasonic, electromagnetic, microwave, and hybrid techniques. The authors review both the determination of microstructure properties, including phase content and grain size, and the determination of mechanical properties, such as hardness, toughness, yield strength, texture, and residual stress.

Gives an overview of established and new NDT techniques, including scanning and transmission electron microscopy, X-ray microtomography and diffraction, ultrasonic, electromagnetic, microwave, and hybrid techniques Reviews the determination of microstructural and mechanical properties Focuses on materials used in the automotive, aerospace, power plants, and infrastructure construction industries Serves as a highly desirable resource for both long-term monitoring and short-term assessment of materials

Magnetic nanowires and microwires are key tools in the development ofenhanced devices for information technology (memory and data processing) andsensing. Offering the combined characteristics of high density, high speed, andnon-volatility, they facilitate reliable control of the motion of magnetic domainwalls; a key requirement for the development of novel classes of logic and storagedevices.

Part One introduces the design and synthesis of magnetic nanowires andmicrowires, reviewing the growth and processing of nanowires and nanowireheterostructures using such methods as sol-gel and electrodepositioncombinations, focused-electron/ion-beam-induced deposition, chemicalvapour transport, quenching and drawing and magnetic interactions. Magneticand transport properties, alongside domain walls, in nano- and microwiresare then explored in Part Two, before Part Three goes on to explore a widerange of applications for magnetic nano- and microwire devices, includingmemory, microwave and electrochemical applications, in addition to thermalspin polarization and configuration, magnetocalorific effects and Bloch pointdynamics.

Detailed coverage of multiple key techniques for the growth and processing of nanowires and microwiresReviews the principles and difficulties involved in applying magnetic nano- and microwires to a wide range of applicationsCombines the expertise of specialists from around the globe to give a broad overview of current and future trends

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects.

This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes.

Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction.

Considers techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for particular materials Addresses consumables and process control for improved CMP

Biomimetic engineering takes the principles of biological organisms and copies, mimics or adapts these in the design and development of new materials and technologies. Biomimetic Technologies reviews the key materials and processes involved in this groundbreaking field, supporting theoretical background by outlining a range of applications.

Beginning with an overview of the key principles and materials associated with biomimetic technologies in Part One, the book goes on to explore biomimetic sensors in more detail in Part Two, with bio-inspired tactile, hair-based, gas-sensing and sonar systems all reviewed. Biomimetic actuators are then the focus of Part Three, with vision systems, tissue growth and muscles all discussed. Finally, a wide range of applications are investigated in Part Four, where biomimetic technology and artificial intelligence are reviewed for such uses as bio-inspired climbing robots and multi-robot systems, microrobots with CMOS IC neural networks locomotion control, central pattern generators (CPG's) and biologically inspired antenna arrays.

Includes a solid overview of modern artificial intelligence as background to the principles of biomimetic engineering Reviews a selection of key bio-inspired materials and sensors, highlighting their current strengths and future�potential Features cutting-edge examples of biomimetic technologies employed for a broad range of applications

The directed self-assembly (DSA) method of patterning for microelectronics uses polymer phase-separation to generate features of less than 20nm, with the positions of self-assembling materials externally guided into the desired pattern. Directed self-assembly of Block Co-polymers for Nano-manufacturing reviews the design, production, applications and future developments needed to facilitate the widescale adoption of this promising technology.

Beginning with a solid overview of the physics and chemistry of block copolymer (BCP) materials, Part 1 covers the synthesis of new materials and new processing methods for DSA. Part 2 then goes on to outline the key modelling and characterization principles of DSA, reviewing templates and patterning using topographical and chemically modified surfaces, line edge roughness and dimensional control, x-ray scattering for characterization, and nanoscale driven assembly. Finally, Part 3 discusses application areas and related issues for DSA in nano-manufacturing, including for basic logic circuit design, the inverse DSA problem, design decomposition and the modelling and analysis of large scale, template self-assembly manufacturing techniques.

Authoritative outlining of theoretical principles and modeling techniques to give a thorough introdution to the topic Discusses a broad range of practical applications for directed self-assembly in nano-manufacturing Highlights the importance of this technology to both the present and future of nano-manufacturing by exploring its potential use in a range of fields

Laser Additive Manufacturing: Materials, Design, Technologies, and Applications provides the latest information on this highly efficient method of layer-based manufacturing using metals, plastics, or composite materials. The technology is particularly suitable for the production of complex components with high precision for a range of industries, including aerospace, automotive, and medical engineering.

This book provides a comprehensive review of the technology and its range of applications. Part One looks at materials suitable for laser AM processes, with Part Two discussing design strategies for AM. Parts Three and Four review the most widely-used AM technique, powder bed fusion (PBF) and discuss other AM techniques, such as directed energy deposition, sheet lamination, jetting techniques, extrusion techniques, and vat photopolymerization. The final section explores the range of applications of laser AM.

Provides a comprehensive one-volume overview of advances in laser additive manufacturing Presents detailed coverage of the latest techniques used for laser additive manufacturing Reviews both established and emerging areas of application

Wireless MEMS Networks and Applications reviews key emerging applications of MEMS in wireless and mobile networks. This book covers the different types of wireless MEMS devices, also exploring MEMS in smartphones, tablets, and the MEMS used for energy harvesting.

The book reviews the range of applications of wireless MEMS networks in manufacturing, infrastructure monitoring, environmental monitoring, space applications, agricultural monitoring for food safety, health applications, and systems for smart cities.

Focuses on the use of MEMS in the emerging area of wireless applications Contains comprehensive coverage of the range of applications of MEMS for wireless networks Presents an international range of expert contributors who identify key research in the field

TV White Space Communications and Networks summarizes the current state-of-the-art in this important aspect of wireless communication. Part One covers related technologies, while Part Two looks at policy, regulation and standardization issues. Part Three discusses the commercialization and potential applications of white space networks, rounding out a comprehensive book that provides a standard reference for those researching and commercializing white space networks.

Presents broad-ranging coverage of all the key issues in white space networks, including regulation, standards, technologies and commercial applications Brings together an international group of experts to summarize the state-of-the-art Builds on the results of the first trials of white space networks

Principles and Applications of Organic Light Emitting Diodes (OLEDs)explores the ways in which the development of organic semiconductor materials is opening up new applications in electronic and optoelectronic luminescent devices.

The book begins by covering the principles of luminescence and the luminescent properties of organic semiconductors. It then covers the development of luminescent materials for OLEDs, discussing the advantages and disadvantages of organic versus inorganic luminescent materials. The fabrication and characterization of OLEDs is also covered in detail, including information on, and comparisons of, vacuum deposition and solution techniques.

Finally, applications of OLEDs are explored, including OLEDs in solid-state lighting, colored lighting, displays and potential future applications, such as ultra-thin and flexible technologies.

This book is an excellent resource both for experts and newcomers to the field of organic optoelectronics and OLEDs. It is ideal for scientists working on optical devices, lighting, display and imaging technologies, and for all those engaged in research in photonics, luminescence and optical materials.

Provides a one-stop guide to OLED technology for the benefit of newcomers to the field of organic optoelectronics Comprehensively covers the luminescent properties of organic semiconductors and their development into OLED materials Offers practical information on OLED fabrication and their applications in solid-state lighting and displays, making this essential reading for optoelectronics engineers and materials scientists

The development of nitride-based light-emitting diodes (LEDs) has led to advancements in high-brightness LED technology for solid-state lighting, handheld electronics, and advanced bioengineering applications. Nitride Semiconductor Light-Emitting Diodes (LEDs) reviews the fabrication, performance, and applications of this technology that encompass the state-of-the-art material and device development, and practical nitride-based LED design considerations.

Part one reviews the fabrication of nitride semiconductor LEDs. Chapters cover molecular beam epitaxy (MBE) growth of nitride semiconductors, modern metalorganic chemical vapor deposition (MOCVD) techniques and the growth of nitride-based materials, and gallium nitride (GaN)-on-sapphire and GaN-on-silicon technologies for LEDs. Nanostructured, non-polar and semi-polar nitride-based LEDs, as well as phosphor-coated nitride LEDs, are also discussed. Part two covers the performance of nitride LEDs, including photonic crystal LEDs, surface plasmon enhanced LEDs, color tuneable LEDs, and LEDs based on quantum wells and quantum dots. Further chapters discuss the development of LED encapsulation technology and the fundamental efficiency droop issues in gallium indium nitride (GaInN) LEDs. Finally, part three highlights applications of nitride LEDs, including liquid crystal display (LCD) backlighting, infrared emitters, and automotive lighting.

Nitride Semiconductor Light-Emitting Diodes (LEDs) is a technical resource for academics, physicists, materials scientists, electrical engineers, and those working in the lighting, consumer electronics, automotive, aviation, and communications sectors.

Reviews fabrication, performance, and applications of this technology that encompass the state-of-the-art material and device development, and practical nitride-based LED design considerations Covers the performance of nitride LEDs, including photonic crystal LEDs, surface plasmon enhanced LEDs, color tuneable LEDs, and LEDs based on quantum wells and quantum dots Highlights applications of nitride LEDs, including liquid crystal display (LCD) backlighting, infra-red emitters, and automotive lighting

Organic flexible electronics represent a highly promising technology that will provide increased functionality and the potential to meet future challenges of scalability, flexibility, low power consumption, light weight, and reduced cost. They will find new applications because they can be used with curved surfaces and incorporated in to a number of products that could not support traditional electronics. The book covers device physics, processing and manufacturing technologies, circuits and packaging, metrology and diagnostic tools, architectures, and systems engineering. Part one covers the production, properties and characterisation of flexible organic materials and part two looks at applications for flexible organic devices. Reviews the properties and production of various flexible organic materials. Describes the integration technologies of flexible organic electronics and their manufacturing methods. Looks at the application of flexible organic materials in smart integrated systems and circuits, chemical sensors, microfluidic devices, organic non-volatile memory devices, and printed batteries and other power storage devices.

Piezoelectric materials produce electric charges on their surfaces as a consequence of applying mechanical stress. They are used in the fabrication of a growing range of devices such as transducers (used, for example, in ultrasound scanning), actuators (deployed in such areas as vibration suppression in optical and microelectronic engineering), pressure sensor devices (such as gyroscopes) and increasingly as a way of producing energy. Their versatility has led to a wealth of research to broaden the range of piezoelectric materials and their potential uses. Advanced piezoelectric materials: science and technology provides a comprehensive review of these new materials, their properties, methods of manufacture and applications.After an introductory overview of the development of piezoelectric materials, Part one reviews the various types of piezoelectric material, ranging from lead zirconate titanate (PZT) piezo-ceramics, relaxor ferroelectric ceramics, lead-free piezo-ceramics, quartz-based piezoelectric materials, the use of lithium niobate and lithium in piezoelectrics, single crystal piezoelectric materials, electroactive polymers (EAP) and piezoelectric composite materials. Part two discusses how to design and fabricate piezo-materials with chapters on piezo-ceramics, single crystal preparation techniques, thin film technologies, aerosol techniques and manufacturing technologies for piezoelectric transducers. The final part of the book looks at applications such as high-power piezoelectric materials and actuators as well as the performance of piezoelectric materials under stress.With its distinguished editor and international team of expert contributors Advanced piezoelectric materials: science and technology is a standard reference for all those researching piezoelectric materials and using them to develop new devices in such areas as microelectronics, optical, sound, structural and biomedical engineering.Provides a comprehensive review of the new materials, their properties and methods of manufacture and applicationExplores the development of piezoelectric materials from the historical background to the present statusFeatures an overview of manufacturing methods for piezoelectric ceramic materials including design considerations

Electrical and electronic waste is a growing problem as volumes are increasing fast. Rapid product innovation and replacement, especially in information and communication technologies (ICT), combined with the migration from analog to digital technologies and to flat-screen televisions and monitors has resulted in some electronic products quickly reaching the end of their life. The EU directive on waste electrical and electronic equipment (WEEE) aims to minimise WEEE by putting organizational and financial responsibility on producers and distributors for collection, treatment, recycling and recovery of WEEE. Therefore all stakeholders need to be well-informed about their WEEE responsibilities and options. While focussing on the EU, this book draws lessons for policy and practice from all over the world.Part one introduces the reader to legislation and initiatives to manage WEEE. Part two discusses technologies for the refurbishment, treatment and recycling of waste electronics. Part three focuses on electronic products that present particular challenges for recyclers. Part four explores sustainable design of electronics and supply chains. Part five discusses national and regional WEEE management schemes and part six looks at corporate WEEE management strategies.With an authoritative collection of chapters from an international team of authors, Waste electrical and electronic equipment (WEEE) handbook is designed to be used as a reference by policy-makers, producers and treatment operators in both the developed and developing world.

Whilst printed films are currently used in varied devices across a wide range of fields, research into their development and properties is increasingly uncovering even greater potential. Printed films provides comprehensive coverage of the most significant recent developments in printed films and their applications.Materials and properties of printed films are the focus of part one, beginning with a review of the concepts, technologies and materials involved in their production and use. Printed films as electrical components and silicon metallization for solar cells are discussed, as are conduction mechanisms in printed film resistors, and thick films in packaging and microelectronics. Part two goes on to review the varied applications of printed films in devices. Printed resistive sensors are considered, as is the role of printed films in capacitive, piezoelectric and pyroelectric sensors, mechanical micro-systems and gas sensors. The applications of printed films in biosensors, actuators, heater elements, varistors and polymer solar cells are then explored, followed by a review of screen printing for the fabrication of solid oxide fuel cells and laser printed micro- and meso-scale power generating devices.With its distinguished editors and international team of expert contributors, Printed films is a key text for anyone working in such fields as microelectronics, fuel cell and sensor technology in both industry and academia.Provides a comprehensive analysis of the most significant recent developments in printed films and their applicationsReviews the concepts, properties, technologies and materials involved in the production and use of printed filmsAnalyses the varied applications of printed films in devices, including printed restrictive sensors for physical quantities and printed thick film mechanical micro-systems (MEMS), among others

Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area.Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure. Finally, part three covers electromigration in solder, with chapters discussing topics such as electromigration-induced microstructural evolution and electromigration in flip-chip solder joints.With its distinguished editor and international team of contributors, Electromigration in thin films and electronic devices is an essential reference for materials scientists and engineers in the microelectronics, packaging and interconnects industries, as well as all those with an academic research interest in the field.

Thin film technology is used in many applications such as microelectronics, optics, hard and corrosion resistant coatings and micromechanics, and thin films form a uniquely versatile material base for the development of novel technologies within these industries. Thin film growth provides an important and up-to-date review of the theory and deposition techniques used in the formation of thin films.Part one focuses on the theory of thin film growth, with chapters covering nucleation and growth processes in thin films, phase-field modelling of thin film growth and surface roughness evolution. Part two covers some of the techniques used for thin film growth, including oblique angle deposition, reactive magnetron sputtering and epitaxial growth of graphene films on single crystal metal surfaces. This section also includes chapters on the properties of thin films, covering topics such as substrate plasticity and buckling of thin films, polarity control, nanostructure growth dynamics and network behaviour in thin films.With its distinguished editor and international team of contributors, Thin film growth is an essential reference for engineers in electronics, energy materials and mechanical engineering, as well as those with an academic research interest in the topic.Provides an important and up-to-date review of the theory and deposition techniques used in the formation of thin filmsFocusses on the theory and modelling of thin film growth, techniques and mechanisms used for thin film growth and properties of thin filmsAn essential reference for engineers in electronics, energy materials and mechanical engineering

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics.With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field.Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applicationsProvides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systemsFocuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

High temperature superconductors have received a great deal of attention in recent years, due to their potential in device and power applications. This book summarises the materials science and physics of all the most important high temperature superconductors as well as discussing material growth, properties and applications.Part one covers fundamental characteristics of high temperature superconductors and high TC films such as deposition technologies, growth, transport properties and optical conductivity. Part two is concerned with growth techniques and properties of high temperature superconductors, including YBCO, BSCCO and HTSC high TC films, and electron-doped cuprates. Finally, part three describes the various applications of high temperature superconductors, from Josephson junctons and dc-superconductive quantum inference devices (dc-SQUIDs) to microwave filters.With its distinguished editor and international team of contributors, this book is an invaluable resource for those researching high temperature superconductors, in industry and academia. In light of the many recent advances in high temperature superconductors, it will benefit physicists, materials scientists and engineers working in this field, as well as in areas of industrial application, such as electronic devices and power transmission.

Nanostructured silicon-germanium (SiGe) opens up the prospects of novel and enhanced electronic device performance, especially for semiconductor devices. Silicon-germanium (SiGe) nanostructures reviews the materials science of nanostructures and their properties and applications in different electronic devices.The introductory part one covers the structural properties of SiGe nanostructures, with a further chapter discussing electronic band structures of SiGe alloys. Part two concentrates on the formation of SiGe nanostructures, with chapters on different methods of crystal growth such as molecular beam epitaxy and chemical vapour deposition. This part also includes chapters covering strain engineering and modelling. Part three covers the material properties of SiGe nanostructures, including chapters on such topics as strain-induced defects, transport properties and microcavities and quantum cascade laser structures. In Part four, devices utilising SiGe alloys are discussed. Chapters cover ultra large scale integrated applications, MOSFETs and the use of SiGe in different types of transistors and optical devices.With its distinguished editors and team of international contributors, Silicon-germanium (SiGe) nanostructures is a standard reference for researchers focusing on semiconductor devices and materials in industry and academia, particularly those interested in nanostructures.Reviews the materials science of nanostructures and their properties and applications in different electronic devicesAssesses the structural properties of SiGe nanostructures, discussing electronic band structures of SiGe alloysExplores the formation of SiGe nanostructuresfeaturing different methods of crystal growth such as molecular beam epitaxy and chemical vapour deposition

Nanostructured Semiconductors focuses on the development of semiconductor nanocrystals, their technologies and applications, including energy harvesting, solar cells, solid oxide fuel cells, and chemical sensors. Semiconductor oxides are used in electronics, optics, catalysts, sensors, and other functional devices. In their 2D form, the reduction in size confers exceptional properties, useful for creating faster electronics and more efficient catalysts.

Since the first edition of the book, there has been significant progress in the development of new functional nanomaterials with unique and sometimes unpredictable quantum-confined properties within the class what it called two-dimensional (2D) semiconductors. These nanocrystals represent extremely thin nano-structures with thickness of just few nano-meters. Since that time, not only were 2D semiconductor oxides further developed, more importantly, 2D metal dichalcogenides, such as MoS2, MoSe2, WS2, WSe2 and others also progressed significantly in their development demonstrating their superior properties compared to their bulk and microstructural counterparts. The book has been expanded to include these advancements.

The book begins with the structure and properties of semiconductor nanocrystals (chapter 1), addresses electronic device applications (chapter 2), discusses 2-Dimensional oxides and dichalcogenide semiconductors (chapters 3 through 5), and ends with energy, environment, and bio applications (chapters 6 through 8).

Focuses on the development of semiconductor nanocrystals and their technologies and applications, including energy harvesting, solar cells, solid oxide fuel cells and chemical sensors Include other 2D materials, such as dichalcogenides to present a comprehensive resource on the latest advancements in nanostructured semiconductors Reviews the fundamental physics of conductivity and electron arrangement before proceeding to practical applications Contains a unique chapter dedicated to the new atomic layer deposition (ALD) technique which has the ability to develop 2D nanostructures with great precision

Nitride Semiconductor Light-Emitting Diodes (LEDs): Materials, Technologies, and Applications, Second Edition reviews the fabrication, performance and applications of the technology, encompassing the state-of-the-art material and device development, along with considerations regarding nitride-based LED design. This updated edition is based on the latest research and advances, including two new chapters on LEDs for large displays and laser lighting. Chapters cover molecular beam epitaxy (MBE) growth of nitride semiconductors, modern metalorganic chemical vapor deposition (MOCVD) techniques, the growth of nitride-based materials, and gallium nitride (GaN)-on-sapphire and GaN-on-silicon technologies for LEDs. Nanostructured, non-polar and semi-polar nitride-based LEDs, as well as phosphor-coated nitride LEDs, are also discussed.

The book also addresses the performance of nitride LEDs, including photonic crystal LEDs, surface plasmon enhanced LEDs, color tuneable LEDs, and LEDs based on quantum wells and quantum dots. Further chapters discuss the development of LED encapsulation technology and fundamental efficiency droop issues in gallium indium nitride (GaInN) LEDs.

It is a technical resource for academics, physicists, materials scientists, electrical engineers, and those working in the lighting, consumer electronics, automotive, aviation, and communications sectors.

Features new chapters on laser lighting, addressing the latest advances on this topic Reviews fabrication, performance, and applications of this technology that encompass the state-of-the-art material and device development Covers the performance of nitride LEDs, including photonic crystal LEDs, surface plasmon enhanced LEDs, color tuneable LEDs, and LEDs based on quantum wells and quantum dots Highlights applications of nitride LEDs, including liquid crystal display (LCD) backlighting, infra-red emitters, and automotive lighting Provides a comprehensive discussion of gallium nitride on both silicon and sapphire substrates

Luminescence Thermometry: Methods, Materials, and Applications presents the state-of-the art applications of luminescence thermometry, giving a detailed explanation of luminescence spectroscopic schemes for the read-out of temperature, while also describing the diverse materials that are capable of sensing temperature via luminescence. Chapters cover the fundamentals of temperature, traditional thermometers and their figures of merit, a concise description of optical thermometry methods, luminescence and instrumentation, and an explanation of the ways in which increases in temperature quench luminescence.

Additional sections focus on materials utilized for luminescence thermometry and the broad range of applications for luminescence thermometry, including temperature measurement at the nanoscale and the application of multifunctional luminescent materials.

Provides an overview of luminescence thermometry applications, including high-temperature, biomedical, nanoscale and multifunctional Delves into luminescence thermometry by materials group, including Rare-earth and transition Metal Ion Doped, Semiconductors, Quantum Dots and Organic materials Gives a concise introduction of the latest methods of temperature measurement, including luminescence spectroscopic schemes and methods of analysis

Defects in Advanced Electronic Materials and Novel Low Dimensional Structures provides a comprehensive review on the recent progress in solving defect issues and deliberate defect engineering in novel material systems. It begins with an overview of point defects in ZnO and group-III nitrides, including irradiation-induced defects, and then look at defects in one and two-dimensional materials, including carbon nanotubes and graphene. Next, it examines the ways that defects can expand the potential applications of semiconductors, such as energy upconversion and quantum processing. The book concludes with a look at the latest advances in theory.

While defect physics is extensively reviewed for conventional bulk semiconductors, the same is far from being true for novel material systems, such as low-dimensional 1D and 0D nanostructures and 2D monolayers. This book fills that necessary gap.

Presents an in-depth overview of both conventional bulk semiconductors and low-dimensional, novel material systems, such as 1D structures and 2D monolayers Addresses a range of defects in a variety of systems, providing a comparative approach Includes sections on advances in theory that provide insights on where this body of research might lead

Smart Sensors and MEMS: Intelligent Devices and Microsystems for Industrial Applications, Second Edition highlights new, important developments in the field, including the latest on magnetic sensors, temperature sensors and microreaction chambers. The book outlines the industrial applications for smart sensors, covering direct interface circuits for sensors, capacitive sensors for displacement measurement in the sub-nanometer range, integrated inductive displacement sensors for harsh industrial environments, advanced silicon radiation detectors in the vacuum ultraviolet (VUV) and extreme ultraviolet (EUV) spectral range, among other topics. New sections include discussions on magnetic and temperature sensors and the industrial applications of smart micro-electro-mechanical systems (MEMS).

The book is an invaluable reference for academics, materials scientists and electrical engineers working in the microelectronics, sensors and micromechanics industry. In addition, engineers looking for industrial sensing, monitoring and automation solutions will find this a comprehensive source of information.

Contains new chapters that address key applications, such as magnetic sensors, microreaction chambers and temperature sensors Provides an in-depth information on a wide array of industrial applications for smart sensors and smart MEMS Presents the only book to discuss both smart sensors and MEMS for industrial applications

Water Electrical and Electronic Equipment Recycling: Aqueous Recovery Methods provides data regarding the implementation of aqueous methods of processing of WEEEs at the industrial level. Chapters explore points-of-view of worldwide researchers and research project managers with respect to new research developments and how to improve processing technologies. The text is divided into two parts, with the first section addressing the new research regarding the hydrometallurgical procedures adopted from minerals processing technologies. Other sections cover green chemistry, bio-metallurgy applications for WEEE treatment and the current developed aqueous methods at industrial scale. A conclusion summarizes existing research with suggestions for future actions.

Provides a one-stop reference for hydrometallurgical processes of metal recovery from WEEE Includes methods presented through intended applications, including waste printed circuit boards, LCD panels, lighting and more Contains suggestions and recommendations for future actions and research prospects

High Mobility Materials for CMOS Applications provides a comprehensive overview of recent developments in the field of (Si)Ge and III-V materials and their integration on Si. The book covers material growth and integration on Si, going all the way from device to circuit design. While the book's focus is on digital applications, a number of chapters also address the use of III-V for RF and analog applications, and in optoelectronics. With CMOS technology moving to the 10nm node and beyond, however, severe concerns with power dissipation and performance are arising, hence the need for this timely work on the advantages and challenges of the technology.

Addresses each of the challenges of utilizing high mobility materials for CMOS applications, presenting possible solutions and the latest innovations Covers the latest advances in research on heterogeneous integration, gate stack, device design and scalability Provides a broad overview of the topic, from materials integration to circuits

Optical Thin Films and Coatings: From Materials to Applications, Second Edition, provides an overview of thin film materials and their properties, design and manufacture across a wide variety of application areas. Sections explore their design and manufacture and their unconventional features, including the scattering properties of random structures in thin films, optical properties at short wavelengths, thermal properties and color effects. Other chapters focus on novel materials, including organic optical coatings, surface multiplasmonics, optical thin films containing quantum dots, and optical coatings, including laser components, solar cells, displays and lighting, and architectural and automotive glass.

The book presents a technical resource for researchers and engineers working with optical thin films and coatings. It is also ideal for professionals in the security, automotive, space and other industries who need an understanding of the topic.

Provides thorough review of applications of optical coatings including laser components, solar cells, glazing, displays and lighting One-stop reference that addresses deposition techniques, properties, and applications of optical thin films and coatings Novel methods, suggestions for analysis, and applications makes this a valuable resource for experts in the field as well

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration.

As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic.

Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates