Advanced Adhesives in Electronics

M. O. Alam is a Researcher in the School of Computing and Mathematical Sciences at the University of Greenwich, UK. Christopher Bailey is a Professor in the School of Computing and Mathematical Sciences at the University of Greenwich, UK.

• Contributor contact detailsChapter 1: Introduction to adhesives joining technology for electronicsAbstract:1.1 Introduction1.2 Classification of adhesives used in electronic packaging1.3 A brief overview of electronic assemblies1.4 Typical uses of advanced adhesives in electronicsChapter 2: Thermally conductive adhesives in electronicsAbstract:2.1 Introduction2.2 Model of heat conductance2.3 Heat transport in thermally conductive adhesives2.4 Thermally conductive fillers2.5 Role of polymer base materials2.6 Thermal conductivity of adhesives and methods for its measurement2.7 ConclusionsChapter 3: Anisotropic conductive adhesives in electronicsAbstract:3.1 Introduction3.2 Nature of adhesive bond3.3 Materials and processing3.4 Critical loading3.5 Evaluation methods3.6 Case studies3.7 Conclusions3.8 Acknowledgments3.10 Appendix: List of abbreviationsChapter 4: Isotropic conductive adhesives in electronicsAbstract:4.1 Introduction4.2 General isotropic conductive adhesive (ICA) properties4.3 Reliability4.4 Modeling4.5 Nanotechnologies in isotropic conductive adhesives4.6 ConclusionsChapter 5: Underfill adhesive materials for flip chip applicationsAbstract:5.1 Introduction: flip chip and direct chip attachment technology5.2 Advantages of direct chip attachment technology5.3 Reliability challenge of flip chip technology5.4 Advances in the flip chip underfill process and encapsulant materials5.5 New material challenges to lead-free solder5.6 The ′no-flow′ pre-applied underfill process5.7 The wafer level pre-applied underfill process5.8 The wafer level dual encapsulation process5.9 ConclusionsChapter 6: Structural integrity of metal–polymer adhesive interfaces in microelectronicsAbstract:6.1 Introduction6.2 Theoretical considerations of work of fracture and bonding strength of adhesive joints6.3 Chemical and physical intermolecular interactions at interfaces6.4 Other influential factors determining bond strength of real adhesive joints6.5 Effect of environmental factors6.6 Interconnections using electrically conductive adhesives6.7 ConclusionsChapter 7: Modelling techniques used to assess conductive adhesive propertiesAbstract:7.1 Introduction7.2 Numerical modelling technologies7.3 Modelling applied to packaging processes7.4 Modelling the thermal, electrical and mechanical performance of adhesives7.5 Future trends7.6 ConclusionsChapter 8: Adhesive technology for photonicsAbstract:8.1 Introduction8.2 The major characteristics of adhesives for photonic applications8.3 Types of adhesive used in photonics8.4 Major applications of adhesives in photonics8.5 Adhesives for photonic packaging8.6 Adhesives used in photonic devices8.7 Typical challenges for reliable fabrication of photonic devices8.8 ConclusionsIndex