Ephraim Suhir – författare

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16 produkter

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16 produkter

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
AvEphraim Suhir
Häftad, Engelska, 2024
900 kr
Skickas inom 10-15 vardagar
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devicesShows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical dataCovers how to design the most effective test vehicles for testing solder jointsDetails how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnectionsOutlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such casesIllustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated testsThis book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.
Human-in-the-Loop
Probabilistic Modeling of an Aerospace Mission Outcome
AvEphraim Suhir
Häftad, Engelska, 2021
786 kr
Skickas inom 10-15 vardagar
Improvements in safety in the air and in space can be achieved through better ergonomics, better work environments, and other efforts of traditional avionic psychology that directly affect human behaviors and performance. Not limited to just the aerospace field, this book discusses adaptive probabilistic predictive modeling in human-in-the-loop situations and gets you familiar with a new, powerful, flexible, and effective approach to making outcomes from missions successful and safe. Covers the concepts, which are adaptable across other disciplines, and methodology for evaluating the likelihood of a successful outcome of an extraordinary situation Considers human performance and equipment/instrumentation reliability, as well as other possible sources of uncertainty Presents probabilistic assessment of an aerospace mission outcome Provides the most effective, physically meaningful, and cost-effective planning of an aerospace mission Offers how to organize and provide the most effective training of personnel
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging
Springer-Verlag New York Inc.
2007
6 517 kr
Skickas inom 10-15 vardagar
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art and present new information on recently developed important methods or devices. Furthermore, practical recommendations are offered on how to successfully apply current knowledge and recently developed technology to design, manufacture and operate viable, reliable and cost-effective electronic components or photonic devices. The emphasis is on the science and engineering of electronic and photonic packaging, on physical design problems, challenges and solutions.Volume I focuses on physics and mechanics of micro- and opto-electronic structures and systems, i.e., on the science underpinnings of engineering methods and approaches used in microelectronics and photonics. Volume II deals with various practical aspects of reliability and packaging of micro- and opto-electronic systems. Internationally recognized experts and world leaders in particular areas of this branch of applied science and engineering contributed to the book.
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging
AvC.P. Wong,Y.C. Leem. fl.
E-bok
PDF, Engelska, 2007
7 092 kr
Läs direkt efter köp
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art and present new information on recently developed important methods or devices. Furthermore, practical recommendations are offered on how to successfully apply current knowledge and recently developed technology to design, manufacture and operate viable, reliable and cost-effective electronic components or photonic devices. The emphasis is on the science and engineering of electronic and photonic packaging, on physical design problems, challenges and solutions.
Volume I focuses on physics and mechanics of micro- and opto-electronic structures and systems, i.e., on the science underpinnings of engineering methods and approaches used in microelectronics and photonics. Volume II deals with various practical aspects of reliability and packaging of micro- and opto-electronic systems. Internationally recognized experts and world leaders in particular areas of this branch of applied science and engineering contributed to the book.
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
AvEphraim Suhir
E-bok
Engelska, 2021
1 056 kr
Läs direkt efter köp
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices

Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data

Covers how to design the most effective test vehicles for testing solder joints

Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections

Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases

Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests
This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
AvEphraim Suhir
E-bok
PDF, Engelska, 2021
1 059 kr
Läs direkt efter köp
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices

Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data

Covers how to design the most effective test vehicles for testing solder joints

Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections

Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases

Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests
This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.
Structural Dynamics of Electronic and Photonic Systems
AvEphraim Suhir,T. X. Yum. fl.
Inbunden, Engelska, 2011
2 291 kr
Skickas inom 11-20 vardagar
The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.
Structural Dynamics of Electronic and Photonic Systems
AvDavid S. Steinberg,T. X. Yum. fl.
E-bok
PDF, Engelska, 2011
2 556 kr
Läs direkt efter köp
The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer''s viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.
Structural Dynamics of Electronic and Photonic Systems
AvDavid S. Steinberg,T. X. Yum. fl.
E-bok
Engelska, 2011
2 556 kr
Läs direkt efter köp
The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer''s viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.
Human-in-the-Loop
Probabilistic Modeling of an Aerospace Mission Outcome
AvEphraim Suhir
Inbunden, Engelska, 2018
2 671 kr
Skickas inom 10-15 vardagar
Improvements in safety in the air and in space can be achieved through better ergonomics, better work environments, and other efforts of traditional avionic psychology that directly affect human behaviors and performance. Not limited to just the aerospace field, this book discusses adaptive probabilistic predictive modeling in human-in-the-loop situations and gets you familiar with a new, powerful, flexible, and effective approach to making outcomes from missions successful and safe. Covers the concepts, which are adaptable across other disciplines, and methodology for evaluating the likelihood of a successful outcome of an extraordinary situation Considers human performance and equipment/instrumentation reliability, as well as other possible sources of uncertainty Presents probabilistic assessment of an aerospace mission outcome Provides the most effective, physically meaningful, and cost-effective planning of an aerospace mission Offers how to organize and provide the most effective training of personnel
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
AvEphraim Suhir
Inbunden, Engelska, 2021
2 445 kr
Skickas inom 10-15 vardagar
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devicesShows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical dataCovers how to design the most effective test vehicles for testing solder jointsDetails how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnectionsOutlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such casesIllustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated testsThis book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.
Human-in-the-Loop
Probabilistic Modeling of an Aerospace Mission Outcome
AvEphraim Suhir
E-bok
Engelska, 2018
932 kr
Läs direkt efter köp
Improvements in safety in the air and in space can be achieved through better ergonomics, better work environments, and other efforts of traditional avionic psychology that directly affect human behaviors and performance. Not limited to just the aerospace field, this book discusses adaptive probabilistic predictive modeling in human-in-the-loop situations and gets you familiar with a new, powerful, flexible, and effective approach to making outcomes from missions successful and safe.

Covers the concepts, which are adaptable across other disciplines, and methodology for evaluating the likelihood of a successful outcome of an extraordinary situation

Considers human performance and equipment/instrumentation reliability, as well as other possible sources of uncertainty

Presents probabilistic assessment of an aerospace mission outcome

Provides the most effective, physically meaningful, and cost-effective planning of an aerospace mission

Offers how to organize and provide the most effective training of personnel
Human-in-the-Loop
Probabilistic Modeling of an Aerospace Mission Outcome
AvEphraim Suhir
E-bok
PDF, Engelska, 2018
922 kr
Läs direkt efter köp
Improvements in safety in the air and in space can be achieved through better ergonomics, better work environments, and other efforts of traditional avionic psychology that directly affect human behaviors and performance. Not limited to just the aerospace field, this book discusses adaptive probabilistic predictive modeling in human-in-the-loop situations and gets you familiar with a new, powerful, flexible, and effective approach to making outcomes from missions successful and safe.

Covers the concepts, which are adaptable across other disciplines, and methodology for evaluating the likelihood of a successful outcome of an extraordinary situation

Considers human performance and equipment/instrumentation reliability, as well as other possible sources of uncertainty

Presents probabilistic assessment of an aerospace mission outcome

Provides the most effective, physically meaningful, and cost-effective planning of an aerospace mission

Offers how to organize and provide the most effective training of personnel
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging
Springer-Verlag New York Inc.
2016
6 444 kr
Skickas inom 10-15 vardagar
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art and present new information on recently developed important methods or devices. Furthermore, practical recommendations are offered on how to successfully apply current knowledge and recently developed technology to design, manufacture and operate viable, reliable and cost-effective electronic components or photonic devices. The emphasis is on the science and engineering of electronic and photonic packaging, on physical design problems, challenges and solutions.Volume I focuses on physics and mechanics of micro- and opto-electronic structures and systems, i.e., on the science underpinnings of engineering methods and approaches used in microelectronics and photonics. Volume II deals with various practical aspects of reliability and packaging of micro- and opto-electronic systems. Internationally recognized experts and world leaders in particular areas of this branch of applied science and engineering contributed to the book.
Structural Analysis in Microelectronic and Fiber-Optic Systems
Volume I Basic Principles of Engineering Elastictiy and Fundamentals of Structural Analysis
AvEphraim Suhir
E-bok
PDF, Engelska, 2012
700 kr
Läs direkt efter köp
This book contains the fundamentals of a discipline, which could be called Structural Analysis in Microelectronics and Fiber Optics. It deals with mechanical behavior of microelectronic and fiber-optic systems and is written in response to the crucial need for a textbook for a first in-depth course on mechanical problems in microelectronics and fiber optics. The emphasis of this book is on electronic and optical packaging problems, and analytical modeling. This book is apparently the first attempt to select, advance, and present those methods of classical structural mechanics which have been or can be applied in various stress-strain problems encountered in "high technology" engineering and some related areas, such as materials science and solid-state physics. The following major objectives are pursued in Structural Analysis in Microelectronic and Fiber-Optic Systems: Identify structural elements typical for microelectronic and fiber-optic systems and devices, and introduce the student to the basic concepts of the mechanical behavior of microelectronic and fiber-optic struc tures, subjected to thermally induced or external loading. Select, advance, and present methods for analyzing stresses and deflections developed in microelectronic and fiber-optic structures; demonstrate the effectiveness of the methods and approaches of the classical struc tural analysis in the diverse mechanical problems of microelectronics and fiber optics; and give students of engineering, as well as practicing engineers and designers, a thorough understanding of the main princi ples involved in the analytical evaluation of the mechanical behavior of microelectronic and fiber-optic systems.
Structural Analysis in Microelectronic and Fiber-Optic Systems
Volume I Basic Principles of Engineering Elastictiy and Fundamentals of Structural Analysis
AvEphraim Suhir
Häftad, Engelska, 2012
549 kr
Skickas inom 10-15 vardagar
This book contains the fundamentals of a discipline, which could be called Structural Analysis in Microelectronics and Fiber Optics. It deals with mechanical behavior of microelectronic and fiber-optic systems and is written in response to the crucial need for a textbook for a first in-depth course on mechanical problems in microelectronics and fiber optics. The emphasis of this book is on electronic and optical packaging problems, and analytical modeling. This book is apparently the first attempt to select, advance, and present those methods of classical structural mechanics which have been or can be applied in various stress-strain problems encountered in "high technology" engineering and some related areas, such as materials science and solid-state physics. The following major objectives are pursued in Structural Analysis in Microelectronic and Fiber-Optic Systems: Identify structural elements typical for microelectronic and fiber-optic systems and devices, and introduce the student to the basic concepts of the mechanical behavior of microelectronic and fiber-optic struc tures, subjected to thermally induced or external loading. Select, advance, and present methods for analyzing stresses and deflections developed in microelectronic and fiber-optic structures; demonstrate the effectiveness of the methods and approaches of the classical struc tural analysis in the diverse mechanical problems of microelectronics and fiber optics; and give students of engineering, as well as practicing engineers and designers, a thorough understanding of the main princi ples involved in the analytical evaluation of the mechanical behavior of microelectronic and fiber-optic systems.

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Ephraim Suhir – författare

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Human-in-the-Loop

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Structural Dynamics of Electronic and Photonic Systems

Structural Dynamics of Electronic and Photonic Systems

Structural Dynamics of Electronic and Photonic Systems

Human-in-the-Loop

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Human-in-the-Loop

Human-in-the-Loop

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Structural Analysis in Microelectronic and Fiber-Optic Systems

Structural Analysis in Microelectronic and Fiber-Optic Systems

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