Er-Ping Li – författare

New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems

Based on the author''s extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures.

Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through:

The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems

The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias

Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations

The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards

An equivalent circuit model of through-silicon vias

Metal-oxide-semiconductor capacitance effects of through-silicon vias

Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.

New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems

Based on the author''s extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures.

Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through:

The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems

The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias

Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations

The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards

An equivalent circuit model of through-silicon vias

Metal-oxide-semiconductor capacitance effects of through-silicon vias

Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.

This book offers a comprehensive examination of ongoing advancements in theoretical and experimental approaches to Maxwell''s equations. It focuses on three key aspects: quantum effects, scale effects, and kinetic effects, which exert subtle influences at microscopic levels. Addressing pressing challenges for future progress, the text explores the interplay of these phenomena within classical electromagnetism.

The evolution of data communication and information technology has led to a demand for high-density, minimization, ultra-compact nano-photo-electronic integration. As electronic devices scale down to nanometer and sub-nanometer levels, classical Maxwell’s equations reveal quantum effects. This book provides insights into these advancements, focusing on potential applications in nano-scale electronic and optic devices.

Tailored for physicists, engineering scientists, electronics engineers, and developers, this text serves as a valuable resource. It guides readers from classical Maxwell’s equations to their quantum-affected counterparts, providing essential insights for electromagnetic simulation and the design of nano-scale electronic and optic systems. With its blend of theoretical foundations and practical applications, this book equips professionals with the knowledge needed to apply these advancements in real-world scenarios.