Bokus

R.A. Levy – författare

Visar alla böcker från författaren R.A. Levy. Handla med fri frakt och snabb leverans.

8 produkter

  1. J.M. Martinez-Duart, R. Madar, R.A. Levy - Materials and Processes for Submicron Technologies, Inbunden. Tillgänglighet: Lägg i varukorg

    Materials and Processes for Submicron Technologies

    Av J.M. Martinez-Duart, R. Madar m. fl.

    Inbunden, 1999

    1637 kr

    Lägg i varukorg

    The European Materials Society decided to hold a Symposium entitled Materials and Processes for Submicron Technologies in June 16-19, 1998, within the yearly E-MRS Spring Meeting in Strasbourg, France. The purpose of this meeting was to discuss the results of the advances in microelectronic devices …

  2. R.A. Levy - Microelectronic Materials and Processes, Inbunden. Tillgänglighet: Lägg i varukorg

    Microelectronic Materials and Processes

    Av R.A. Levy

    Inbunden, 1989

    5980 kr

    Lägg i varukorg

    The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron …

  3. R.A. Levy - Microelectronic Materials and Processes, Häftad. Tillgänglighet: Lägg i varukorg

    Microelectronic Materials and Processes

    Av R.A. Levy

    Häftad, 1989

    5980 kr

    Lägg i varukorg

    The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron …

  4. R.A. Levy - Reduced Thermal Processing for ULSI, Häftad. Tillgänglighet: Lägg i varukorg

    Reduced Thermal Processing for ULSI

    Av R.A. Levy

    Häftad, 2011

    550 kr

    Lägg i varukorg

    As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget for processing such devices. Furthermore, due to the relatively low melting point of the first aluminum metallization level, such …

  5. R.A. Levy - Reduced Thermal Processing for ULSI, E-bok. Tillgänglighet: Lägg i varukorg

    Reduced Thermal Processing for ULSI

    Av R.A. Levy

    E-bok, 2012

    718 kr

    Lägg i varukorg

    As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget for processing such devices. Furthermore, due to the relatively low melting point of the first aluminum metallization level, such …

  6. R.A. Levy - Microelectronic Materials and Processes, E-bok. Tillgänglighet: Lägg i varukorg

    Microelectronic Materials and Processes

    Av R.A. Levy

    E-bok, 2012

    7854 kr

    Lägg i varukorg

    The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron …

  7. R.A. Levy - Novel Silicon Based Technologies, Häftad. Tillgänglighet: Lägg i varukorg

    Novel Silicon Based Technologies

    Av R.A. Levy

    Häftad, 2012

    550 kr

    Lägg i varukorg

    Silicon, as an electronic substrate, has sparked a technological revolution that has allowed the realization of very large scale integration (VLSI) of circuits on a chip. These 6 fingernail-sized chips currently carry more than 10 components, consume low power, cost a few dollars, and are capable …

  8. R.A. Levy - Novel Silicon Based Technologies, E-bok. Tillgänglighet: Lägg i varukorg

    Novel Silicon Based Technologies

    Av R.A. Levy

    E-bok, 2012

    710 kr

    Lägg i varukorg

    Silicon, as an electronic substrate, has sparked a technological revolution that has allowed the realization of very large scale integration (VLSI) of circuits on a chip. These 6 fingernail-sized chips currently carry more than 10 components, consume low power, cost a few dollars, and are capable …