Microelectronics Packaging Handbook, 3-part set

Name: Microelectronics Packaging Handbook, 3-part set
Brand: Chapman and Hall
Price: 4921 SEK
Availability: InStock

Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging

AvR.R. Tummala,Eugene J. Rymaszewski

Chapman and Hall

1997

4 921 kr

Beställningsvara. Skickas inom 10-15 vardagar. Fri frakt över 249 kr.

Beskrivning

A threer-volume set updating the author's earlier one-volume "Microelectronics Handbook" published in 1988. Revised to incorporate advances in the industry, this text provides a balance of theory and practical applications. The set explains the latest in microelectronics design methods, modelling tools, simulation techniques and manufacturing procedures.

Produktinformation

Märke:Chapman and Hall
Utgivningsdatum:1997-01-31
Språk:Engelska
Antal sidor:3 000
Upplaga:2
Förlag:Chapman and Hall
EAN:9780412084614

Utforska kategorier

Recensioner i media

'A most comprehensive book set, both well presented and well illustrated.' IEEE Electrical Insulation Magazine, September/October 1997

Innehållsförteckning

Part I: Foreword. Preface. Conversion Factors. Summary Contents. 1. Microelectronics packaging: An overview. 2. Package wiring and terminals. 3. Package electrical design. 4. Heat transfer in electronic packages. 5. Package reliability. 6. Package manufacture. Glossary and Symbols. Authors' Biographies. Index. Part II: 7. Microelectronics packaging: An overview. 8. Chip-to-package interconnection. 9. Ceramic packaging. 10. Plastic packaging. 11. Polymers in packaging. 12. Thin-film packaging. 13. Package electrical testing. 14. Package sealing and encapsulation. Part III: 15. Microelectronics packaging: An overview. 16. Package-to-board interconnections. 17. Printed-wiring board packaging. 18. Coated-metal packaging. 19. Connector and cable packaging. 20. Packaging of optoelectronics with electronics.

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Microelectronics Packaging Handbook, 3-part set

Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging

AvR.R. Tummala,Eugene J. Rymaszewski

Chapman and Hall

1997

4 921 kr

Beställningsvara. Skickas inom 10-15 vardagar. Fri frakt över 249 kr.

Beskrivning

Produktinformation

Märke:Chapman and Hall
Utgivningsdatum:1997-01-31
Språk:Engelska
Antal sidor:3 000
Upplaga:2
Förlag:Chapman and Hall
EAN:9780412084614

Utforska kategorier

Recensioner i media

'A most comprehensive book set, both well presented and well illustrated.' IEEE Electrical Insulation Magazine, September/October 1997

Innehållsförteckning

Part I: Foreword. Preface. Conversion Factors. Summary Contents. 1. Microelectronics packaging: An overview. 2. Package wiring and terminals. 3. Package electrical design. 4. Heat transfer in electronic packages. 5. Package reliability. 6. Package manufacture. Glossary and Symbols. Authors' Biographies. Index. Part II: 7. Microelectronics packaging: An overview. 8. Chip-to-package interconnection. 9. Ceramic packaging. 10. Plastic packaging. 11. Polymers in packaging. 12. Thin-film packaging. 13. Package electrical testing. 14. Package sealing and encapsulation. Part III: 15. Microelectronics packaging: An overview. 16. Package-to-board interconnections. 17. Printed-wiring board packaging. 18. Coated-metal packaging. 19. Connector and cable packaging. 20. Packaging of optoelectronics with electronics.