Microelectronics Packaging Handbook

Subsystem Packaging Part III

AvR.R. Tummala,Eugene J. Rymaszewski

Inbunden, Engelska, 1997

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Beskrivning

This text is the third of three volumes to update the author's earlier one-volume "Microelectronics Handbook", first published in 1988. Revised to incorporate advances in the industry, this volume provides a balance of theory and practical applications. It explains the latest in microelectronics design methods, modelling tools, simulation techniques and manufacturing procedures.

Produktinformation

Utgivningsdatum:1997-01-31
Mått:155 x 235 x 43 mm
Vikt:993 g
Format:Inbunden
Språk:Engelska
Antal sidor:628
Upplaga:2
Förlag:Chapman and Hall
ISBN:9780412084515

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Recensioner i media

'A most comprehensive book set, both well presented and well illustrated.' IEEE Electrical Insulation Magazine, September/October 1997

Innehållsförteckning

Part I: Foreword. Preface. Conversion Factors. Summary Contents. 1. Microelectronics packaging: An overview. 2. Package wiring and terminals. 3. Package electrical design. 4. Heat transfer in electronic packages. 5. Package reliability. 6. Package manufacture. Glossary and Symbols. Authors' Biographies. Index. Part II: 7. Microelectronics packaging: An overview. 8. Chip-to-package interconnection. 9. Ceramic packaging. 10. Plastic packaging. 11. Polymers in packaging. 12. Thin-film packaging. 13. Package electrical testing. 14. Package sealing and encapsulation. Part III: 15. Microelectronics packaging: An overview. 16. Package-to-board interconnections. 17. Printed-wiring board packaging. 18. Coated-metal packaging. 19. Connector and cable packaging. 20. Packaging of optoelectronics with electronics.