MRS Conference Proceedings – serie
Visar alla böcker i serien MRS Conference Proceedings. Handla med fri frakt och snabb leverans.
3 produkter
3 produkter
Inbunden, Engelska, 1988
363 kr
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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
4 459 kr
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As zeolite science continues to grow, many zeolite conferences and meeting are being held around the world, but the premier venue to present new work continues to be the International Zeolite Conferences. The 12th International Zeolite Conference was held in Baltimore, Maryland, in July 1998, and included 774 participants from 37 different countries. It also spawned this comprehensive four-volume, 3360-page proceedings that covers many diverse areas of zeolite study only touched upon at previous conferences. Topics include: diffusion; adsorption; theory and modeling; structure; industrial applications; synthesis; catalysis; membranes; mesoporous materials; solid-state applications and characterization.
Inbunden, Engelska, 2002
357 kr
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Leading-edge advanced metallization schemes, as applied to VLSI interconnects, include the introduction of novel metals systems and novel dielectric materials. Technological advances highlighted at AMC 2001 include the latest developments in integrating copper metallization with low-dielectric constant materials, and evaluations of the reliability of such interconnects. Recently, in both industry and academia there has been increased interest in basic research as applied to the field of vertical integration. Since the problems that affect vertical integration are similar to those of VLSI interconnects, it is natural to include the topic here. In fact, it is anticipated that cross fertilization between the fields of VLSI metallization and vertical interconnect will yield a viable technical solution to the problem of multichip integration. This book offers a comprehensive look at the current state of the art of VLSI interconnects. Topics include: process integration; vertical integration and advanced packaging; copper metallization; low-K dielectrics technology; modeling; reliability; barriers; atomic-layer epitaxy and other technologies; and CMP and automation.