Physical Deposition Methods for Films and Coatings

Inbunden, Engelska, 2025

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Beskrivning

Comprehensive resource on the subject of deposition techniques for films and coatings and their characterization Physical Deposition Methods for Films and Coatings presents a pedagogical compilation of current knowledge of dry deposition. Written by a renowned and awarded academic with more than 40 years of experience in the field, Physical Deposition Methods for Films and Coatings covers topics including: The process of making a deposit that appears on the surface, growth of deposits, their post treatments, and characterization methodsDifferent physical and chemical deposition techniques including atomistic, chemical vapor, and various thermal spraying methodsProperties of deposits depending on the material and deposition techniqueSubstrate preparation, coating microstructure, and morphology and stability of thin filmsExamples of applications of thin films in optical devices, environmental applications, telecommunications devices, and energy storage devicesPhysical Deposition Methods for Films and Coatings is an essential reference on the subject for professionals and researchers in surface treatment and graduate students in related programs of study.

Produktinformation

Utgivningsdatum:2025-02-21
Mått:170 x 244 x 30 mm
Vikt:964 g
Format:Inbunden
Språk:Engelska
Antal sidor:432
Förlag:John Wiley & Sons Inc
ISBN:9781119713067

Utforska kategorier

Maskinteknik och material inom Naturvetenskap och teknik

Mer om författaren

Lech Pawłowski is a professor emeritus at the University of Limoges in France. He has more than 40 years of experience working with and researching coatings of different materials. He was honored by doctorate honoris causa attributed by Chemnitz University of Technology in Germany and through introduction into the Hall of Fame of Thermal Spray Society by the American Society of Materials. He has authored and co-authored over 100 papers.

Innehållsförteckning

Preface xiiiAbbreviations and Symbols xvIntroduction xxv1 Substrate Preparation 11.1 Introduction 11.2 Surfaces of Different Types of Substrates (Metals and Alloys, Ceramics, Polymers) 21.2.1 Metals and Alloys 41.2.2 Ceramics and Glasses 81.2.3 Polymers 111.3 Cleaning of Surface 141.3.1 Chemical Cleaning Methods 141.3.2 Physical Cleaning Methods 161.3.2.1 Thermal Cleaning 161.3.2.2 Particles Cleaning 171.3.2.3 Plasma Cleaning 171.3.2.4 Ions and Atoms Bombardment 201.3.2.5 Ultrasonic Cleaning 221.3.2.6 Photons Cleaning 221.3.3 Monitoring of Surface 241.4 Patterning of Films and Coatings 251.4.1 Lithography 271.4.1.1 Illumination 281.4.1.2 Masks 291.4.1.3 Geometry of Lithography 301.4.1.4 Etching and Removal Processes 301.4.2 Direct Patterning 311.4.2.1 Photons Patterning 311.4.2.2 Particles Patterning 321.5 Activation of Substrates Surface 321.5.1 Activation of Substrates at Atomistic Deposition 331.5.1.1 Liquids Activation 341.5.1.2 Photons Activation 341.5.1.3 Particles Activation 341.5.2 Activation of the Substrates Before Granular Deposits 381.5.2.1 Particles Activation 381.5.2.2 Photons Activation 391.5.2.3 Water jet Activation 401.5.2.4 Plasma Activation 40References 422 Films and Coatings Deposition Techniques 492.1 Introduction 492.2 Atomistic Deposition Methods 492.2.1 Physical Vapor Deposition (PVD) by Thermal Evaporation 502.2.1.1 History 502.2.1.2 Principle 512.2.1.3 Sources 522.2.1.4 Medium 552.2.2 Physical Vapor Deposition (PVD) by Sputtering 572.2.2.1 History 572.2.2.2 Principle 582.2.2.3 Source 592.2.2.4 Medium 622.2.3 Ion plating and i-beam-assisted Deposition 632.2.3.1 History 632.2.3.2 Principle 632.2.4 Pulsed-Laser Deposition (PLD) 652.2.4.1 History 652.2.4.2 Principle 662.2.4.3 Source 682.2.4.4 Medium 682.2.5 Chemical Vapor Deposition (CVD) 692.2.5.1 History 702.2.5.2 Principle and Techniques 702.2.5.3 Sources in CVD Techniques 712.2.5.4 Thermal CVD 712.2.5.5 Pe Cvd 772.2.5.6 Laser-Assisted Chemical Vapor Deposition (LCVD) 802.2.5.7 Metal–Organic Chemical Vapor Deposition (MO CVD) 832.2.5.8 Atomic Layer Deposition (ALD) 842.3 Granular Methods of Coatings Deposition 852.3.1 Powder Fedstock 852.3.1.1 Methods of Powder Manufacturing 862.3.1.2 Characterization of Powders 902.3.1.3 Delivery and Injection of Powder to Flame and Plasma 902.3.2 Solid Feedstock Deposition Methods 912.3.2.1 Flame Spraying (FS) 922.3.2.2 Arc Spraying (AS) 932.3.2.3 Atmospheric Plasma Spraying (APS) 942.3.2.4 High-Velocity Oxy-Fuel Spraying (HVOF) 982.3.2.5 Detonation Spraying 1012.3.2.6 Cold Gas Spraying Method (CGSM) 1022.3.2.7 Vacuum Plasma Spraying (VPS) 1042.3.2.8 Plasma Spray Physical Vapor Deposition (PS PVD) 1052.3.3 Liquid Feedstock Deposition Method 1072.3.3.1 Solutions Preparation 1082.3.3.2 Suspension Preparation 1082.3.3.3 Delivery and Injection of Liquid to Flame or Plasma 1102.3.3.4 Spray Pyrolysis (SP) 1112.3.3.5 Suspension Plasma Spraying (SPS) 1122.3.3.6 Solution Precursor Plasma Spraying (SPPS) 1142.4 Bulk Methods of Coatings Deposition 1152.4.1 Plasma Transferred Arc (PTA) 1162.4.2 Laser Coatings 1172.4.2.1 1-Step Laser Deposition (1SLD) 1182.4.2.2 2-step Laser Deposition (2SLD) 121References 1253 Nucleation, Growth, and Microstructure of Physical Deposits 1373.1 Introduction 1373.2 Atomistic Deposition Methods 1383.2.1 Introduction 1383.2.2 Phenomena at Contact and Nucleation 1383.2.2.1 Growth in Three Dimensions 1403.2.2.2 Nucleation and Growth in Two Dimensions 1413.2.2.3 Nucleation and Growth in Two Dimensions and in Three Dimensions 1423.2.3 Interface Between Film and Substrate 1423.2.4 Microstructure of Films Obtained Using Different Deposition Techniques 1433.2.5 Residual Stresses and Defects in Films 1473.2.6 Post-deposition Treatment 1493.3 Granular Deposits 1503.3.1 Introduction 1503.3.2 Contact Phenomena 1513.3.2.1 Deformation of a Particle 1513.3.2.2 Solidification and Cooling of a Particle 1543.3.2.3 Adhesion Mechanisms 1553.3.3 Nucleation and Growth of a Crystal 1573.3.3.1 Phase Composition 1583.3.3.2 Inhomogeneity of Deposits, Composites 1603.3.4 Build-up of a Coating 1623.3.4.1 Temperature of a Coating 1633.3.4.2 Residual Stresses 1653.3.5 Post-deposition Treatment 1673.4 Bulk Deposits 1683.4.1 Introduction 1683.4.2 Phenomena in the Melt-pool 1703.4.3 Laser Shock Treatment 1723.4.4 Nucleation in the Melt Pool 1723.4.5 Inhomogeneities of Deposits and Thermal Stresses 1763.4.6 Post-deposit Treatment 176References 1774 Methods of Films and Coatings Characterization 1854.1 Introduction 1854.2 Methods of Microstructure Characterization 1864.2.1 Chemical Composition Analyses 1874.2.1.1 Auger Electron Spectroscopy (AES) 1874.2.1.2 Energy-dispersive X-ray Spectroscopy (EDX) 1904.2.1.3 Wavelength-dispersive X-ray Spectroscopy (WDX) 1914.2.1.4 Electron Energy Loss Spectroscopy (EELS) 1924.2.1.5 Electron Microprobe Analysis (EMPA) 1934.2.1.6 Raman Spectroscopy (RS) 1944.2.1.7 X-ray Photoelectron Spectroscopy (XPS) 1954.2.1.8 X-ray Fluorescence Spectroscopy 1974.2.2 Crystallographic Analyses 1984.2.2.1 X-ray Diffraction (XRD) 1984.2.2.2 Selected Area Diffraction (SAD) 1994.2.2.3 Electron Backscatter Diffraction (EBSD) 2004.2.3 Analyses of Morphology 2014.2.3.1 Optical Microscope (OM) 2014.2.3.2 Scanning Electron Microscope (SEM) 2024.2.3.3 Scanning Tunneling Microscope (STM) 2034.2.3.4 Atomic Force Microscope (AFM) 2054.2.3.5 Transmission Electron Microscope (TEM) 2054.3 Mechanical Properties of Films and Coatings 2084.3.1 Fundamentals of Mechanical Properties 2084.3.2 Adhesion 2104.3.3 Hardness and Microhardness 2114.3.4 Elasticity of Deposits 2134.3.5 Fracture Toughness 2154.3.6 Friction and Wear 2164.3.7 Residual Stresses 2194.4 Physical Properties of Films and Coatings 2204.4.1 Thickness 2204.4.2 Porosity 2204.4.3 Thermophysical Properties 2224.4.3.1 Thermal Conductivity 2234.4.3.2 Specific Heat and Thermal Expansion 2244.4.3.3 Emissivity 2254.4.3.4 Thermal Shock Resistance 2254.4.4 Contact Angle 2254.5 Corrosion Resistance 2264.5.1 Aqueous Corrosion 2264.5.2 Hot Corrosion 2294.6 Electric and Magnetic Properties of Films and Coatings 2294.6.1 Electric Conductivity and Resistivity 2304.6.2 Dielectric Properties 2324.6.3 Magnetic Properties 2344.7 Optical Properties of Films and Coatings 2354.8 Characterization of Biomaterials 2384.8.1 Introduction 2384.8.2 In vitro Characterization 2394.8.3 In vivo Characterization 239References 2405 Properties of Films and Coatings 2515.1 Introduction 2515.2 Mechanical Properties 2525.2.1 Hardness and Microhardness 2525.2.1.1 Atomistic Films 2525.2.1.2 Granular Coatings 2575.2.1.3 Bulk Deposits 2635.2.2 Adhesion 2655.2.2.1 Atomistic Deposits 2695.2.2.2 Granular Deposits 2725.2.3 Elasticity, Strength, and Toughness 2745.2.3.1 Atomistic Deposits 2745.2.3.2 Granular Deposits 2755.2.4 Friction and Wear 2835.2.4.1 Atomistic Deposits 2845.2.4.2 Granular Coatings 2875.2.4.3 Bulk Coatings 2975.2.5 Example of Coatings Applications: Anilox Rolls 3025.3 Electric and Magnetic Properties 3045.3.1 Conductors and Resistors 3045.3.1.1 Atomistic Deposits 3055.3.1.2 Granular Deposits 3075.3.2 Dielectric Properties 3095.3.2.1 Atomistic Deposits 3105.3.2.2 Granular Deposits 3105.3.3 Magnetic Properties 3135.3.3.1 Atomistic Deposits 3135.3.3.2 Granular Deposits 3155.3.4 Superconductors 3155.3.4.1 Atomistic Deposits 3175.3.4.2 Granular Deposits 3175.3.5 Electron Emitters 3175.3.5.1 Atomistic Films 3195.3.5.2 Granular Coatings 3195.4 Thermophysical Properties 3215.4.1 Thermal Conductivity and Diffusivity 3225.4.1.1 Atomistic Deposits 3225.4.1.2 Granular Deposits 3235.4.2 Emissivity 3285.5 Corrosion Resistance 3325.5.1 Aqueous Corrosion 3325.5.1.1 Atomistic Films 3345.5.1.2 Granular Coatings 3345.5.1.3 Bulk Deposits 3365.5.2 Hot Corrosion 3385.5.2.1 Atomistic Deposits 3425.5.2.2 Granular Deposits 3425.5.2.3 Bulk Deposits 3455.6 Optical Properties 3455.6.1 Decorative Deposits 3455.6.2 Functional Deposits 3495.7 Biomaterials 3495.7.1 Atomistic Deposits 3515.7.2 Granular Deposits 353References 357Index 381