John Lau – författare
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14 produkter
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
Av John Lau
Inbunden, 2010
1907 kr
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Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC …
Through-Silicon Vias for 3D Integration
Av John Lau
Inbunden, 2012
2550 kr
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Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more …
3D IC Integration and Packaging
Av John Lau
Inbunden, 2015
2219 kr
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Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product . A comprehensive guide to 3D IC integration and packaging technology 3D IC Integration and Packaging fully …
Basics Fashion Design 09: Designing Accessories
Exploring the design and construction of bags, shoes, hats and jewellery
Av John Lau
Häftad, 2019
395 kr
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Long since regarded as an inessential object that simply adds to the beauty, convenience or effectiveness of an outfit, accessories are now considered key items in a fashion collection and as stand-alone pieces worthy of our undivided attention. Basics Fashion Design 09: Designing Accessories is …
Basics Fashion Design 09: Designing Accessories
Exploring the Design and Construction of Bags, Shoes, Hats and Jewellery
Av John Lau
E-bok, 2021
434 kr
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Long since regarded as an inessential object that simply adds to the beauty, convenience or effectiveness of an outfit, accessories are now considered key items in a fashion collection and as stand-alone pieces worthy of our undivided attention. Basics Fashion Design 09: Designing Accessories is …
Thermal Stress and Strain in Microelectronics Packaging
Av John Lau
E-bok, 2012
2049 kr
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Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a …
Thermal Stress and Strain in Microelectronics Packaging
Av John Lau
Häftad, 2012
1639 kr
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Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a …
Basics Fashion Design 09: Designing Accessories
Exploring the Design and Construction of Bags, Shoes, Hats and Jewellery
Av John Lau
E-bok, 2012
434 kr
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Long since regarded as an inessential object that simply adds to the beauty, convenience or effectiveness of an outfit, accessories are now considered key items in a fashion collection and as stand-alone pieces worthy of our undivided attention. Basics Fashion Design 09: Designing Accessories is …
Diseño de accesorios
Av John Lau
E-bok, 2013
238 kr
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El sector de los accesorios es una especialidad en auge en el mundo de la moda. Sin embargo, es difícil encontrar manuales que aborden los principios y procesos del diseño de moda centrándose en las especificidades de la industria del accesorio. Este libro trata de paliar este vacío ofreciendo una …
Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
Inbunden, 2026
2183 kr
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This book focuses on the design, materials, process, fabrication, quality, reliability, fatigue, fracture, and artificial intelligence (AI) assisted in chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more emphasis placed on engineering …
Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
E-bok, 2026
2833 kr
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This book focuses on the design, materials, process, fabrication, quality, reliability, fatigue, fracture, and artificial intelligence (AI) assisted in chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more emphasis placed on engineering …
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Av John Lau, Xuejun Fan
Inbunden, 2025
1966 kr
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The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is …
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Av Xuejun Fan, John Lau
E-bok, 2025
2517 kr
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The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is …
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Av John Lau, Xuejun Fan
Häftad, 2026
1422 kr
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The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is …
