John Lau – författare

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14 produkter

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14 produkter

Reliability of RoHS-Compliant 2D and 3D IC Interconnects
AvJohn Lau
Inbunden, Engelska, 2010
1 904 kr
Skickas inom 3-6 vardagar
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
Proven 2D and 3D IC lead-free interconnect reliability techniques
Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.
Covers reliability of:
2D and 3D IC lead-free interconnectsCCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder jointsLead-free (SACX) solder jointsLow-temperature lead-free (SnBiAg) solder jointsSolder joints with voids, high strain rate, and high ramp rateVCSEL and LED lead-free interconnects3D LED and 3D MEMS with TSVsChip-to-wafer (C2W) bonding and lead-free interconnectsWafer-to-wafer (W2W) bonding and lead-free interconnects3D IC chip stacking with low-temperature bondingTSV interposers and lead-free interconnectsElectromigration of lead-free microbumps for 3D IC integration
Through-Silicon Vias for 3D Integration
AvJohn Lau
Inbunden, Engelska, 2012
2 448 kr
Skickas inom 3-6 vardagar
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
A comprehensive guide to TSV and other enabling technologies for 3D integration
Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edgeinformation on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.
This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.
Coverage includes:
Nanotechnology and 3D integration for the semiconductor industryTSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealingTSVs: mechanical, thermal, and electrical behaviorsThin-wafer strength measurementWafer thinning and thin-wafer handlingMicrobumping, assembly, and reliabilityMicrobump electromigrationTransient liquid-phase bonding: C2C, C2W, and W2W2.5D IC integration with interposers3D IC integration with interposersThermal management of 3D IC integration3D IC packaging
3D IC Integration and Packaging
AvJohn Lau
Inbunden, Engelska, 2015
2 219 kr
Skickas inom 3-6 vardagar
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail.3D IC Integration and Packaging covers:• 3D integration for semiconductor IC packaging• Through-silicon vias modeling and testing• Stress sensors for thin-wafer handling and strength measurement• Package substrate technologies• Microbump fabrication, assembly, and reliability• 3D Si integration• 2.5D/3D IC integration• 3D IC integration with passive interposer• Thermal management of 2.5D/3D IC integration• Embedded 3D hybrid integration• 3D LED and IC integration• 3D MEMS and IC integration• 3D CMOS image sensors and IC integration• PoP, chip-to-chip interconnects, and embedded fan-out WLP
Basics Fashion Design 09: Designing Accessories
Exploring the design and construction of bags, shoes, hats and jewellery
AvJohn Lau
Häftad, Engelska, 2019
388 kr
Skickas inom 5-8 vardagar
Long since regarded as an inessential object that simply adds to the beauty, convenience or effectiveness of an outfit, accessories are now considered key items in a fashion collection and as stand-alone pieces worthy of our undivided attention. Basics Fashion Design 09: Designing Accessories is filled with important information that any designer will need to know, examining four key items from concept to production: the bag, footwear, jewellery and millinery. The key accessories are dissected to clearly display the core components, giving a clear view of how each connects. The design process is explored by looking at creative product development, from gathering research to generating ideas into key products, construction techniques and the essential tools of the trade used in modern accessories design. 2D pattern and 3D modelling techniques are described in detail with explanations of traditional and rapid prototyping tools in use today. Bespoke and commercial production is examined and creative solutions to technical challenges are presented.Designing Accessories also explores specialist finishing techniques, such as hand-finishing and machine embellishment and contains descriptions of contemporary techniques that break new boundaries in accessories design. A detailed explanation of small accessories, essential to the accessories designer, will broaden the reader's knowledge and provide them with the dexterity of skills to enter the fashion industry.This title is filled with images of beautiful accessories to inspire young designers. It is essential reading for fashion students and all those interested in accessories design. The book also includes a whole chapter on small accessories (eyewear, scarves, ties, wristwatches, belts and gloves).
Basics Fashion Design 09: Designing Accessories
Exploring the Design and Construction of Bags, Shoes, Hats and Jewellery
AvJohn Lau
E-bok
Engelska, 2021
420 kr
Läs direkt efter köp
Long since regarded as an inessential object that simply adds to the beauty, convenience or effectiveness of an outfit, accessories are now considered key items in a fashion collection and as stand-alone pieces worthy of our undivided attention. Basics Fashion Design 09: Designing Accessories is filled with important information that any designer will need to know, examining four key items from concept to production: the bag, footwear, jewellery and millinery. The key accessories are dissected to clearly display the core components, giving a clear view of how each connects. The design process is explored by looking at creative product development, from gathering research to generating ideas into key products, construction techniques and the essential tools of the trade used in modern accessories design. 2D pattern and 3D modelling techniques are described in detail with explanations of traditional and rapid prototyping tools in use today. Bespoke and commercial production is examined and creative solutions to technical challenges are presented.Designing Accessories also explores specialist finishing techniques, such as hand-finishing and machine embellishment and contains descriptions of contemporary techniques that break new boundaries in accessories design. A detailed explanation of small accessories, essential to the accessories designer, will broaden the reader''s knowledge and provide them with the dexterity of skills to enter the fashion industry.This title is filled with images of beautiful accessories to inspire young designers. It is essential reading for fashion students and all those interested in accessories design. The book also includes a whole chapter on small accessories (eyewear, scarves, ties, wristwatches, belts and gloves).
Thermal Stress and Strain in Microelectronics Packaging
AvJohn Lau
E-bok
PDF, Engelska, 2012
2 049 kr
Läs direkt efter köp
Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.
Thermal Stress and Strain in Microelectronics Packaging
AvJohn Lau
Häftad, Engelska, 2012
1 626 kr
Skickas inom 10-15 vardagar
Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.
Basics Fashion Design 09: Designing Accessories
Exploring the Design and Construction of Bags, Shoes, Hats and Jewellery
AvJohn Lau
E-bok
PDF, Engelska, 2012
420 kr
Läs direkt efter köp
Long since regarded as an inessential object that simply adds to the beauty, convenience or effectiveness of an outfit, accessories are now considered key items in a fashion collection and as stand-alone pieces worthy of our undivided attention. Basics Fashion Design 09: Designing Accessories is filled with important information that any designer will need to know, examining four key items from concept to production: the bag, footwear, jewellery and millinery. The key accessories are dissected to clearly display the core components, giving a clear view of how each connects. The design process is explored by looking at creative product development, from gathering research to generating ideas into key products, construction techniques and the essential tools of the trade used in modern accessories design. 2D pattern and 3D modelling techniques are described in detail with explanations of traditional and rapid prototyping tools in use today. Bespoke and commercial production is examined and creative solutions to technical challenges are presented.Designing Accessories also explores specialist finishing techniques, such as hand-finishing and machine embellishment and contains descriptions of contemporary techniques that break new boundaries in accessories design. A detailed explanation of small accessories, essential to the accessories designer, will broaden the reader's knowledge and provide them with the dexterity of skills to enter the fashion industry.This title is filled with images of beautiful accessories to inspire young designers. It is essential reading for fashion students and all those interested in accessories design. The book also includes a whole chapter on small accessories (eyewear, scarves, ties, wristwatches, belts and gloves).
Diseño de accesorios
AvJohn Lau
E-bok
PDF, Spanska, 2013
238 kr
Läs direkt efter köp
El sector de los accesorios es una especialidad en auge en el mundo de la moda. Sin embargo, es difícil encontrar manuales que aborden los principios y procesos del diseño de moda centrándose en las especificidades de la industria del accesorio. Este libro trata de paliar este vacío ofreciendo una introducción básica al diseño de accesorios. Con un estilo directo y pragmático, el libro expone todo lo que hay que saber para hacerse una idea completa de cómo funciona esta especialidad: desde la anatomía y los aspectos básicos de los complementos más importantes (bolsos, calzado, joyería, sombreros, gafas, bufandas, pañuelos, corbatas, relojes, cinturones y guantes), pasando por el proceso completo de diseño, las técnicas de producción, los materiales naturales y sintéticos con que se fabrican, y, finalmente, las técnicas de acabado tradicionales y actuales. Diseño de accesorios es una guía práctica y visual, repleta de información gráfica que complementa la base teórica expuesta en cada capítulo. El libro incluye además ejercicios prácticos, un glosario básico especializado y numerosas entrevistas a prestigiosos diseñadores internacionales que revelan sus propios procesos de diseño y la filosofía subyacente a su trabajo.
Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
AvJohn Lau,Kuo-Ning Chiang
Inbunden, Engelska, 2026
2 165 kr
Skickas inom 10-15 vardagar
This book focuses on the design, materials, process, fabrication, quality, reliability, fatigue, fracture, and artificial intelligence (AI) assisted in chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more emphasis placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as Cu interconnects, glass-core substrate, 3D heterogeneous integration of photonic IC and electronic IC, and combining simulation design with AI technology to effectively apply it to semiconductor packaging.This book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
AvKuo-Ning Chiang,John Lau
E-bok
Engelska, 2026
2 833 kr
Läs direkt efter köp
This book focuses on the design, materials, process, fabrication, quality, reliability, fatigue, fracture, and artificial intelligence (AI) assisted in chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more emphasis placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as Cu interconnects, glass-core substrate, 3D heterogeneous integration of photonic IC and electronic IC, and combining simulation design with AI technology to effectively apply it to semiconductor packaging.This book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
AvJohn Lau,Xuejun Fan
Inbunden, Engelska, 2025
1 949 kr
Skickas inom 5-8 vardagar
The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as hybrid bonding, advanced substrates, failure mechanisms, and modeling due to thermal stresses, moisture absorption, impact loading such as drop as well as electric current driven electromigration, and the fundamentals of thermal management. Each topic is treated with in-depth analysis to bridge foundational principles with real-world engineering challenges. This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration.
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
AvXuejun Fan,John Lau
E-bok
Engelska, 2025
2 517 kr
Läs direkt efter köp
The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as hybrid bonding, advanced substrates, failure mechanisms, and modeling due to thermal stresses, moisture absorption, impact loading such as drop as well as electric current driven electromigration, and the fundamentals of thermal management. Each topic is treated with in-depth analysis to bridge foundational principles with real-world engineering challenges. This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration.
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
AvJohn Lau,Xuejun Fan
Häftad, Engelska, 2026
1 410 kr
Skickas inom 10-15 vardagar
The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as hybrid bonding, advanced substrates, failure mechanisms, and modeling due to thermal stresses, moisture absorption, impact loading such as drop as well as electric current driven electromigration, and the fundamentals of thermal management. Each topic is treated with in-depth analysis to bridge foundational principles with real-world engineering challenges. This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration.

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John Lau – författare

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Through-Silicon Vias for 3D Integration

3D IC Integration and Packaging

Basics Fashion Design 09: Designing Accessories

Basics Fashion Design 09: Designing Accessories

Thermal Stress and Strain in Microelectronics Packaging

Thermal Stress and Strain in Microelectronics Packaging

Basics Fashion Design 09: Designing Accessories

Diseño de accesorios

Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

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