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Kuo-Ning Chiang – författare

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2 produkter

  1. John Lau, Kuo-Ning Chiang - Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration, Inbunden. Tillgänglighet: Lägg i varukorg

    Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

    Av John Lau, Kuo-Ning Chiang

    Inbunden, 2026

    2183 kr

    Lägg i varukorg

    This book focuses on the design, materials, process, fabrication, quality, reliability, fatigue, fracture, and artificial intelligence (AI) assisted in chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more emphasis placed on engineering …

  2. Kuo-Ning Chiang, John Lau - Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration, E-bok. Tillgänglighet: Lägg i varukorg

    Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

    Av Kuo-Ning Chiang, John Lau

    E-bok, 2026

    2833 kr

    Lägg i varukorg

    This book focuses on the design, materials, process, fabrication, quality, reliability, fatigue, fracture, and artificial intelligence (AI) assisted in chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more emphasis placed on engineering …