Xuejun Fan – författare
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6 produkter
Solid State Lighting Reliability Part 2
Components to Systems
Av Willem Dirk van Driel, Xuejun Fan m. fl.
Inbunden, 2017
2401 kr
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In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing …
Solid State Lighting Reliability Part 2
Components to Systems
Av Guo Qi Zhang, Xuejun Fan m. fl.
E-bok, 2017
3251 kr
Lägg i varukorg
In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing …
Solid State Lighting Reliability Part 2
Components to Systems
Av Willem Dirk van Driel, Xuejun Fan m. fl.
Häftad, 2018
2401 kr
Lägg i varukorg
In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing …
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Av John Lau, Xuejun Fan
Inbunden, 2025
1966 kr
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The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is …
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Av Xuejun Fan, John Lau
E-bok, 2025
2517 kr
Lägg i varukorg
The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is …
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Av John Lau, Xuejun Fan
Häftad, 2026
1422 kr
Lägg i varukorg
The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is …
