Guo Qi Zhang – författare

In the past decades, the main stream of microelectronics progress has been mainly powered by Moore''s law which focuses on IC miniaturization down to nanoscale. While the microelectronics community around the world continues to invent new solutions to keep Moore''s law alive, there is a fast increasing need for non-digital and mixed-signal “More than Moore” (MtM) type  technologies that are still based upon or derived from silicon technologies, but do not simply scale with Moore''s law. Typical examples are devices incorporating RF, power/high voltage, passive components, sensors and actuators, MEMS, Bio-chip/bio-systems, microfluidics, solid-state lighting, etc.. The increasing momentum of MtM is triggered by the increasing needs for high level heterogeneous system integration including non-digital functions, the necessity to speed up innovative product creation and to broaden the product portfolio of IC fabs, and the limiting cost and time factors of advanced system-on-chip (SoC) development. It is believed that MtM will add value to society on top of and beyond advanced semiconductors technologies, with fast increasing marketing potentials, and that it will drive paradigm shift for technologies, applications and business models.

In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, Solid State Lighting Reliability Part 2, we invited the experts from industry and academia to present the latest developments and findings in the LED system reliability arena. Topics in this book cover the early failures and critical steps in LED manufacturing; advances in reliability testing and standards; quality of colour and colour stability; degradation of optical materials and the associated chromaticity maintenance; characterization of thermal interfaces; LED solder joint testing and prediction; common failure modes in LED drivers; root causes for lumen depreciation; corrosion sensitivity of LED packages; reliability management for automotive LEDs, and lightning effects on LEDs.