Bokus

Martin Gall – författare

Visar alla böcker från författaren Martin Gall. Handla med fri frakt och snabb leverans.

4 produkter

  1. Valeriy Sukharev, Martin Gall, Chao-Kun Hu, Paul S. Ho - Electromigration in Metals, E-bok. Tillgänglighet: Lägg i varukorg

    Electromigration in Metals

    Fundamentals to Nano-Interconnects

    Av Valeriy Sukharev, Martin Gall m. fl.

    E-bok, 2022

    1337 kr

    Lägg i varukorg

    Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. …

  2. Paul S. Ho, Chao-Kun Hu, Martin Gall, Valeriy Sukharev - Electromigration in Metals, Inbunden. Tillgänglighet: Lägg i varukorg

    Electromigration in Metals

    Fundamentals to Nano-Interconnects

    Av Paul S. Ho, Chao-Kun Hu m. fl.

    Inbunden, 2022

    1143 kr

    Lägg i varukorg

    Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. …

  3. Martin Gall, Alfred Grill, Francesca Lacopi, Junichi Koike, Takamasa Usui - Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2009: Volume 1156, Häftad. Tillgänglighet: Lägg i varukorg

    Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2009: Volume 1156

    Volume 1156

    Av Martin Gall, Alfred Grill m. fl.

    Häftad, 2014

    471 kr

    Lägg i varukorg

    Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as …

  4. Martin Gall, Alfred Grill, Francesca Lacopi, Junichi Koike, Takamasa Usui - Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2009: Volume 1156, Inbunden. Tillgänglighet: Lägg i varukorg

    Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2009: Volume 1156

    Av Martin Gall, Alfred Grill m. fl.

    Inbunden, 2009

    1693 kr

    Lägg i varukorg

    Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as …