Bokus

Paul S. Ho – författare

Visar alla böcker från författaren Paul S. Ho. Handla med fri frakt och snabb leverans.

8 produkter

  1. Mikhail Baklanov, Paul S. Ho, Ehrenfried Zschech - Advanced Interconnects for ULSI Technology, Inbunden. Tillgänglighet: Lägg i varukorg

    Advanced Interconnects for ULSI Technology

    Av Mikhail Baklanov, Paul S. Ho m. fl.

    Inbunden, 2012

    2316 kr

    Lägg i varukorg

    Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, …

  2. Valeriy Sukharev, Martin Gall, Chao-Kun Hu, Paul S. Ho - Electromigration in Metals, E-bok. Tillgänglighet: Lägg i varukorg

    Electromigration in Metals

    Fundamentals to Nano-Interconnects

    Av Valeriy Sukharev, Martin Gall m. fl.

    E-bok, 2022

    1337 kr

    Lägg i varukorg

    Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. …

  3. Paul S. Ho, Chao-Kun Hu, Martin Gall, Valeriy Sukharev - Electromigration in Metals, Inbunden. Tillgänglighet: Lägg i varukorg

    Electromigration in Metals

    Fundamentals to Nano-Interconnects

    Av Paul S. Ho, Chao-Kun Hu m. fl.

    Inbunden, 2022

    1143 kr

    Lägg i varukorg

    Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. …

  4. Kenneth P. Rodbell, William F. Filter, Harold J. Frost, Paul S. Ho - Materials Reliability in Microelectronics III: Volume 309, Häftad. Tillgänglighet: Lägg i varukorg

    Materials Reliability in Microelectronics III: Volume 309

    Av Kenneth P. Rodbell, William F. Filter m. fl.

    Häftad, 2014

    455 kr

    Lägg i varukorg

    The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

  5. Ehrenfried Zschech, Paul S. Ho, Mikhail Baklanov - Advanced Interconnects for ULSI Technology, E-bok. Tillgänglighet: Lägg i varukorg

    Advanced Interconnects for ULSI Technology

    Av Ehrenfried Zschech, Paul S. Ho m. fl.

    E-bok, 2012

    2639 kr

    Lägg i varukorg

    Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, …

  6. Paul S. Ho, Jihperng Leu, Wei William Lee - Low Dielectric Constant Materials for IC Applications, Inbunden. Tillgänglighet: Lägg i varukorg

    Low Dielectric Constant Materials for IC Applications

    Av Paul S. Ho, Jihperng Leu m. fl.

    Inbunden, 2002

    1641 kr

    Lägg i varukorg

    Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging …

  7. Wei William Lee, Jihperng Leu, Paul S. Ho - Low Dielectric Constant Materials for IC Applications, E-bok. Tillgänglighet: Lägg i varukorg

    Low Dielectric Constant Materials for IC Applications

    Av Wei William Lee, Jihperng Leu m. fl.

    E-bok, 2012

    2065 kr

    Lägg i varukorg

    Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging …

  8. Paul S. Ho, Jihperng Leu, Wei William Lee - Low Dielectric Constant Materials for IC Applications, Häftad. Tillgänglighet: Lägg i varukorg

    Low Dielectric Constant Materials for IC Applications

    Av Paul S. Ho, Jihperng Leu m. fl.

    Häftad, 2012

    1641 kr

    Lägg i varukorg

    Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging …