Mikhail Baklanov – författare
Visar alla böcker från författaren Mikhail Baklanov. Handla med fri frakt och snabb leverans.
5 produkter
Dielectric Films for Advanced Microelectronics
Av Mikhail Baklanov, Karen Maex m. fl.
Inbunden, 2007
3165 kr
Lägg i varukorg
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, …
Dielectric Films for Advanced Microelectronics
Av Martin Green, Karen Maex m. fl.
E-bok, 2007
3715 kr
Lägg i varukorg
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, …
Advanced Interconnects for ULSI Technology
Av Mikhail Baklanov, Paul S. Ho m. fl.
Inbunden, 2012
2316 kr
Lägg i varukorg
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, …
Advanced Interconnects for ULSI Technology
Av Ehrenfried Zschech, Paul S. Ho m. fl.
E-bok, 2012
2582 kr
Lägg i varukorg
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, …
Advanced Interconnects for ULSI Technology
Av Ehrenfried Zschech, Paul S. Ho m. fl.
E-bok, 2012
2639 kr
Lägg i varukorg
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, …