Sachin Sapatnekar – författare
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10 produkter
Routing Congestion in VLSI Circuits
Estimation and Optimization
Av Prashant Saxena, Rupesh S. Shelar m. fl.
Inbunden, 2007
1641 kr
Lägg i varukorg
With dramatic increases in on-chip packing densities, routing congestion has become a major problem in integrated circuit design, impacting convergence, performance, and yield, and complicating the synthesis of critical interc- nects. The problem is especially acute as interconnects are becoming …
Routing Congestion in VLSI Circuits
Estimation and Optimization
Av Sachin Sapatnekar, Rupesh S. Shelar m. fl.
E-bok, 2007
1622 kr
Lägg i varukorg
With dramatic increases in on-chip packing densities, routing congestion has become a major problem in integrated circuit design, impacting convergence, performance, and yield, and complicating the synthesis of critical interc- nects. The problem is especially acute as interconnects are becoming …
Timing
Inbunden, 2004
2185 kr
Lägg i varukorg
Statistical timing analysis is an area of growing importance in nanometer te- nologies‚ as the uncertainties associated with process and environmental var- tions increase‚ and this chapter has captured some of the major efforts in this area. This remains a very active field of research‚ and there …
Timing
E-bok, 2007
2860 kr
Lägg i varukorg
Statistical timing analysis is an area of growing importance in nanometer te- nologies‚ as the uncertainties associated with process and environmental var- tions increase‚ and this chapter has captured some of the major efforts in this area. This remains a very active field of research‚ and there …
Three-Dimensional Integrated Circuit Design
EDA, Design and Microarchitectures
Av Yuan Xie, Jingsheng Jason Cong m. fl.
Inbunden, 2009
1641 kr
Lägg i varukorg
We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous …
Three-Dimensional Integrated Circuit Design
EDA, Design and Microarchitectures
Av Sachin Sapatnekar, Jingsheng Jason Cong m. fl.
E-bok, 2009
2111 kr
Lägg i varukorg
We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous …
Routing Congestion in VLSI Circuits
Estimation and Optimization
Av Prashant Saxena, Rupesh S. Shelar m. fl.
Häftad, 2010
1205 kr
Lägg i varukorg
With dramatic increases in on-chip packing densities, routing congestion has become a major problem in integrated circuit design, impacting convergence, performance, and yield, and complicating the synthesis of critical interc- nects. The problem is especially acute as interconnects are becoming …
Timing
Häftad, 2010
2185 kr
Lägg i varukorg
Statistical timing analysis is an area of growing importance in nanometer te- nologies‚ as the uncertainties associated with process and environmental var- tions increase‚ and this chapter has captured some of the major efforts in this area. This remains a very active field of research‚ and there …
Three-Dimensional Integrated Circuit Design
EDA, Design and Microarchitectures
Av Yuan Xie, Jingsheng Jason Cong m. fl.
Häftad, 2012
1641 kr
Lägg i varukorg
We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous …
ENCYCLOPEDIA OF THERMAL PACKAGING, SET 2: THERMAL PACKAGING TOOLS - VOLUME 4: THERMALLY-INFORMED DESIGN OF MICROELECTRONIC COMPONENTS
Av Sachin Sapatnekar, Ankur Srivastava m. fl.
Inbunden, 2014
3543 kr
Lägg i varukorg
This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit and /remove Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems — are responsible for much of the progress in miniaturization, reliability, and functional …