W.K. Jones – författare
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6 produkter
MCM C/Mixed Technologies and Thick Film Sensors
Av W.K. Jones, Karel Kurzweil m. fl.
Inbunden, 1995
2188 kr
Lägg i varukorg
Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects and thermal management capability have been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity, highlighting recent advances in MCM-C …
Electronic Packaging for High Reliability, Low Cost Electronics
Av R.R. Tummala, Marija Kosec m. fl.
Inbunden, 2000
1643 kr
Lägg i varukorg
Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, …
Electronic Packaging for High Reliability, Low Cost Electronics
Av R.R. Tummala, Marija Kosec m. fl.
Häftad, 2010
1643 kr
Lägg i varukorg
Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, …
MCM C/Mixed Technologies and Thick Film Sensors
Av W.K. Jones, Karel Kurzweil m. fl.
Häftad, 2012
2188 kr
Lägg i varukorg
Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and …
Multichip Modules with Integrated Sensors
Häftad, 2011
1098 kr
Lägg i varukorg
Advances in electronic devices with higher speeds and complexity have placed higher demands on the electronic packaging of systems. Multichip Modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capabilities have recently evolved to address these new …
MCM C/Mixed Technologies and Thick Film Sensors
Av Sylvia Mergui, Gabor Harsanyi m. fl.
E-bok, 2012
2925 kr
Lägg i varukorg
Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and …